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BLF7G27L-150P,112

NXP Semiconductors

BLF7G27L-150P,112 by NXP Semiconductors

BLF7G27L-150P,112 by NXP Semiconductors is a Power FET with N-CHANNEL polarity. It operates in ENHANCEMENT MODE with max drain current of 37A. Ideal for applications requiring high power and efficiency at up to 225°C operating temperature.

Median Price

$108.146

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 35 parts In-Stock

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$96.130

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$86.010

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$80.950

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Verical

USA . 35 parts In-Stock

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$120.162

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$107.513

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$101.188

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$101.188

Distributors (In-Stock)

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Digiode

USA . 4,350 parts In-Stock

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$110.181

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Vyrian

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Anansix

USA . 2,649 parts In-Stock

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AZTECH Wire

Italy . 121 parts In-Stock

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$20.410

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Corphita

USA . 2,902 parts In-Stock

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$104.382

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Continental Prestige Electronics

USA . 35 parts In-Stock

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$139.180

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QUARKTWIN TECHNOLOGY LTD

USA . 28,061 parts In-Stock

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UNI Independent Distributors

Spain . 7,410 parts In-Stock

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Microchip USA

USA . 7,028 parts In-Stock

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Northwest PG Solutions

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Native Components

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Overview

Enhance your power management capabilities with the BLF7G27L-150P,112 by NXP Semiconductors. As a leading manufacturer in the industry, NXP Semiconductors delivers top-quality Power Field Effect Transistors that are designed for efficiency and reliability. Ideal for a wide range of applications, this N-CHANNEL FET offers a maximum drain current of 37A and operates in enhancement mode, making it a versatile and powerful component for your projects. Experience the value and benefits of superior performance with the BLF7G27L-150P,112 from NXP Semiconductors.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have better performance and lower resistance compared to P-channel FETs, making them a good choice for efficient power handling.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs have a higher input impedance and are easier to control, making them suitable for various applications where precise control is needed.

Maximum Drain Current (ID): 37 A

With a high maximum drain current of 37 A, this FET is capable of handling large amounts of current without overheating, making it suitable for high-power applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFETs offer high switching speeds, low input capacitance, and high input impedance, making them ideal for power management applications with high efficiency and minimal power loss.

Maximum Operating Temperature: 225 °C

With a maximum operating temperature of 225°C, this FET can withstand higher temperatures, ensuring reliable performance in demanding environments.

Technical Specifications

Power Field Effect Transistors (FET) BLF7G27L-150P,112 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Maximum Drain Current (Abs) (ID):

37 A

Maximum Drain Current (ID):

37 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

225 Cel

Polarity or Channel Type:

Sub-Category:

FET General Purpose Powers

Trade Compliance

BLF7G27L-150P,112 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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