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BLF7G24L-100,112

NXP Semiconductors

BLF7G24L-100,112 by NXP Semiconductors

BLF7G24L-100,112 by NXP Semiconductors is a Power FET with N-CHANNEL polarity. It operates in ENHANCEMENT MODE with 28A Max Drain Current. Ideal for high-power applications requiring up to 200°C operating temperature.

Median Price

$62.512

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

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DigiKey

USA . 37 parts In-Stock

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Verical

USA . 25 parts In-Stock

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$70.875

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$64.088

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Rochester

USA . 19 parts In-Stock

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$54.150

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$48.450

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$45.600

19

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$54.150

$48.450

$45.600

Distributors (In-Stock)

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Digiode

USA . 4,911 parts In-Stock

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Chip Stock

USA . 62,000 parts In-Stock

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Vyrian

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Anansix

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DigiKey Marketplace

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Distributors (Availability)

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Native Components

USA . 526 parts In-Stock

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$0.548

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Northwest PG Solutions

USA . 275 parts In-Stock

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$0.603

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Corphita

USA . 351 parts In-Stock

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Component Stockers USA

USA . 32 parts In-Stock

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$61.660

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Continental Prestige Electronics

USA . 37 parts In-Stock

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Microchip USA

USA . 418 parts In-Stock

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UNI Independent Distributors

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Overview

Looking for a reliable power field effect transistor for your next project? Look no further than the BLF7G24L-100,112 by NXP Semiconductors. Known for their superior quality and cutting-edge technology, NXP Semiconductors delivers top-of-the-line FETs that are perfect for a variety of applications. Whether you're working on automotive electronics or industrial automation, this N-CHANNEL SINGLE configuration FET offers a maximum drain current of 28 A and operates at temperatures up to 200°C. Trust NXP Semiconductors to provide you with the performance and value you need to bring your designs to life.

Feature Benefit Bullets

Polarity or Channel Type

N-Channel FETs are known for their higher electron mobility and faster switching speeds, making them ideal for high-performance applications.

Configuration

Single configuration simplifies circuit designs and reduces component count, improving overall reliability and efficiency.

Operating Mode

Enhancement mode FETs offer better control and lower conduction losses, leading to improved efficiency in power applications.

Maximum Drain Current (Abs) (ID)

With a maximum drain current of 28 A, this FET can handle high power loads reliably without overheating or failing.

Field Effect Transistor Technology

Metal-oxide semiconductor technology provides good insulation properties and high switching speeds, making it suitable for various power applications.

Maximum Operating Temperature

With a maximum operating temperature of 200°C, this FET can withstand high temperature environments, ensuring long-term reliability.

Technical Specifications

Power Field Effect Transistors (FET) BLF7G24L-100,112 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

28 A

Maximum Drain Current (ID):

28 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

No. of Elements:

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

200 Cel

Polarity or Channel Type:

Sub-Category:

FET General Purpose Power

Trade Compliance

BLF7G24L-100,112 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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