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BLF573S,112

NXP Semiconductors

BLF573S,112 by NXP Semiconductors

NXP Semiconductors BLF573S,112 is a single N-channel power FET with 42A max drain current. Operating in enhancement mode, it uses metal-oxide semiconductor technology and can withstand up to 225°C. Ideal for high-power applications requiring efficient switching capabilities.

Median Price

$134.180

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

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RFMW

USA . 50 parts In-Stock

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$134.180

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DigiKey

USA . 406 parts In-Stock

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Digiode

USA . 2,110 parts In-Stock

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$127.471

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Vyrian

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Anansix

USA . 1,435 parts In-Stock

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Native Components

USA . 185 parts In-Stock

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$0.685

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Northwest PG Solutions

USA . 1,095 parts In-Stock

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$0.754

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Corphita

USA . 58 parts In-Stock

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Microchip USA

USA . 4,824 parts In-Stock

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Authorized Procurement Solutions

USA . 6,800 parts In-Stock

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Overview

Experience unparalleled power and performance with the BLF573S,112 by NXP Semiconductors. As a leading manufacturer in the semiconductor industry, NXP delivers top-quality Power Field Effect Transistors that are ideal for a wide range of applications. Whether you're looking to enhance your electronic devices or improve efficiency in your power systems, this N-CHANNEL transistor offers maximum reliability and durability. Trust NXP to provide you with innovative solutions that exceed your expectations. Elevate your projects with the BLF573S,112 today!

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs are commonly used for high power applications due to their ability to handle higher currents and voltages compared to P-CHANNEL FETs.

Configuration: SINGLE

SINGLE configuration FETs are easier to use in circuits and require fewer components compared to DUAL or MULTI configurations, making them more cost-effective.

Operating Mode: ENHANCEMENT MODE

ENHANCEMENT MODE FETs are turned on by applying a positive voltage to the gate terminal, providing better control over the switching operation.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

METAL-OXIDE SEMICONDUCTOR FETs offer high switching speeds, low gate-drive power requirements, and high input impedance, making them suitable for high-frequency applications.

Maximum Operating Temperature: 225 °C

With a high maximum operating temperature of 225°C, this FET can withstand high-temperature environments, ensuring reliable performance in demanding applications.

Maximum Drain Current (ID): 42 A

A high maximum drain current of 42 amps allows this FET to handle high power levels, making it suitable for applications that require high current-carrying capacity.

Technical Specifications

Power Field Effect Transistors (FET) BLF573S,112 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

42 A

Maximum Drain Current (ID):

42 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

No. of Elements:

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

225 Cel

Polarity or Channel Type:

Sub-Category:

FET General Purpose Power

Trade Compliance

BLF573S,112 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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