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BLF573,112

NXP Semiconductors

BLF573,112 by NXP Semiconductors

BLF573,112 by NXP Semiconductors is an N-channel enhancement mode FET designed for high-performance applications. It supports a max drain current of 42 A and operates at temperatures up to 225 °C, making it ideal for power amplification in RF systems. This single configuration transistor excels in efficiency and reliability.

Median Price

$125.795

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

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RFMW

USA . 81 parts In-Stock

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$134.180

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Flip Electronics (Authorized)

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DigiKey

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Rochester

USA . 1 parts In-Stock

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$117.410

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$105.050

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$98.870

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$98.870

Distributors (In-Stock)

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Digiode

USA . 227 parts In-Stock

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$123.937

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Vyrian

USA . 5,409 parts In-Stock

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Anansix

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Native Components

USA . 684 parts In-Stock

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$0.728

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Northwest PG Solutions

USA . 2,004 parts In-Stock

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$0.801

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Advanced Electronics

New Zealand . 100 parts In-Stock

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$1.298

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$1.181

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$1.064

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Corphita

USA . 4,980 parts In-Stock

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$117.414

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Component Stockers USA

USA . 48 parts In-Stock

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$135.560

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Microchip USA

USA . 5,900 parts In-Stock

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Authorized Procurement Solutions

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UNI Independent Distributors

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Perfect Parts

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Overview

Unlock superior performance with the BLF573,112 from NXP Semiconductors, a leader in innovative technology. This robust N-channel Power FET is engineered for efficiency and reliability, making it ideal for demanding applications in industrial and telecommunications sectors. With its high current capacity and exceptional thermal stability, the BLF573,112 ensures optimal operation even in extreme conditions, delivering unmatched value and longevity to your projects. Experience the power of quality and innovation with NXP!

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel FETs provide higher electron mobility, leading to better performance in terms of switching speed and efficiency.

Configuration: SINGLE

A single configuration simplifies circuit design and reduces potential points of failure, making it a reliable choice for various applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer improved control over the device's conductivity, making them ideal for low-power applications and better efficiency.

Maximum Drain Current (Abs): 42 A

With a maximum drain current rating of 42 A, this FET can handle substantial loads, making it suitable for high-power applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology allows for higher efficiency and faster switching capabilities, enhancing the overall performance of electronic circuits.

Maximum Operating Temperature: 225 °C

A maximum operating temperature of 225 °C ensures reliable performance even in high-heat environments, expanding its usability in demanding applications.

Maximum Drain Current (ID): 42 A

This specification confirms the robust capability of the FET to manage heavy electrical loads, making it a versatile component in power electronics.

Technical Specifications

Power Field Effect Transistors (FET) BLF573,112 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

42 A

Maximum Drain Current (ID):

42 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

No. of Elements:

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

225 Cel

Polarity or Channel Type:

Sub-Category:

FET General Purpose Power

Trade Compliance

BLF573,112 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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