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BF720

NXP Semiconductors

BF720 by NXP Semiconductors

NPN; Configuration: SINGLE; Surface Mount: YES; Nominal Transition Frequency (fT): 60 MHz; Maximum Power Dissipation (Abs): 1.5 W; Maximum Collector Current (IC): .1 A;

Median Price

$0.426

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

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TEDSS.com

USA . 1,000 parts In-Stock

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$0.290

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$0.160

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$0.290

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Bristol Electronics

USA . 5,966 parts In-Stock

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$0.563

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$0.208

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$0.146

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USA . 32,500 parts In-Stock

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Digiode

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Dan-Mar Components

USA . 5,966 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 5,000 parts In-Stock

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Vyrian

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Anansix

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LIBRA Elektronik GmbH

Germany . 1,000 parts In-Stock

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Corel Iberica Componentes, S.L.

Spain . 1,000 parts In-Stock

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ComSIT Distribution GmbH

Germany . 950 parts In-Stock

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Prism Electronics

USA . 648 parts In-Stock

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GES GmbH

Germany . 150 parts In-Stock

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ABC Electronics Ltd.

UK . 150 parts In-Stock

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DF Sales Co.

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DF Sales Co.

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Elcom Components

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AZTECH Wire

Italy . 13,452 parts In-Stock

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$0.290

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Modulus Dynamics

Lithuania . 12,332 parts In-Stock

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$1.041

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$0.999

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$0.958

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IDEA Electronic Components Group

UK . 516 parts In-Stock

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$1.065

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$0.959

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MKK Technologies

India . 1,581 parts In-Stock

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$2.003

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DigiPath Technology Company

USA . 1,581 parts In-Stock

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One Stop Electronics

USA . 482 parts In-Stock

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Kepictronics

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Authorized Procurement Solutions

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Northwest PG Solutions

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UNI Independent Distributors

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Corphita

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Perfect Parts

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Native Components

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Alle Elektronik GmbH

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A-Z Elektronik GmbH

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Assy Fe

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Cyclops Electronics Ltd (Excess)

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Supply Digital

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Parana Technologies

USA . 876 parts In-Stock

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Technical Specifications

Small Signal Bipolar Junction Transistors (BJT) BF720 attributes and parameters. Explore more Small Signal Bipolar Junction Transistors (BJT) devices from NXP Semiconductors

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Base Capacitance:

1.6 pF

Maximum Collector-Emitter Voltage:

300 V

Configuration:

Minimum DC Current Gain (hFE):

50

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

4

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

NPN

Maximum Power Dissipation Ambient:

1.5 W

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

Tin (Sn)

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Maximum VCEsat:

.6 V

Trade Compliance

BF720 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.75

SB

8541.29.00.80

NSN

2910-01-582-1187, 2910015821187

NIIN

015821187

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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