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74LVTN16245BBX,518

NXP Semiconductors

74LVTN16245BBX,518 by NXP Semiconductors

BUS DRIVER; Temperature Grade: INDUSTRIAL; Terminal Form: BUTT; No. of Terminals: 60; Package Code: HVBCC; Package Shape: RECTANGULAR;

Median Price

$0.840

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 19,900 parts In-Stock

1+ parts

-

100+ parts

$0.825

1k+ parts

$0.684

10k+ parts

$0.610

19,900

-

$0.825

$0.684

$0.610

Verical

USA . 19,900 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.855

10k+ parts

$0.763

19,900

-

-

$0.855

$0.763

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,487 parts In-Stock

1+ parts

$0.330

100+ parts

-

1k+ parts

-

10k+ parts

-

1,487

$0.330

-

-

-

DigiKey Marketplace

USA . 19,900 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

19,900

-

-

-

-

Vyrian

USA . 5,812 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,812

-

-

-

-

Anansix

USA . 1,470 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,470

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 568 parts In-Stock

1+ parts

$0.200

100+ parts

-

1k+ parts

-

10k+ parts

$0.192

568

$0.200

-

-

$0.192

Northwest PG Solutions

USA . 2,004 parts In-Stock

1+ parts

$0.220

100+ parts

-

1k+ parts

-

10k+ parts

$0.194

2,004

$0.220

-

-

$0.194

Corphita

USA . 1,159 parts In-Stock

1+ parts

$0.312

100+ parts

-

1k+ parts

-

10k+ parts

-

1,159

$0.312

-

-

-

Microchip USA

USA . 170 parts In-Stock

1+ parts

$2.340

100+ parts

-

1k+ parts

-

10k+ parts

-

170

$2.340

-

-

-

Andel Nordic

Denmark . 868 parts In-Stock

1+ parts

$9.139

100+ parts

-

1k+ parts

$8.774

10k+ parts

$8.774

868

$9.139

-

$8.774

$8.774

AZTECH Wire

Italy . 821 parts In-Stock

1+ parts

$10.360

100+ parts

-

1k+ parts

-

10k+ parts

-

821

$10.360

-

-

-

UNI Independent Distributors

Spain . 5,287 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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5,287

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-

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-

Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,000

-

-

-

-

Technical Specifications

Bus Driver & Transceivers 74LVTN16245BBX,518 attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

LVT

JESD-30 Code:

R-PBCC-B60

JESD-609 Code:

e3

Length:

6 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

2

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

60

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LGA60,8X12,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

3.3 ns

Propagation Delay (tpd):

3.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

.5 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Width:

4 mm

Trade Compliance

74LVTN16245BBX,518 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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