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74LVC821APW,112

NXP Semiconductors

74LVC821APW,112 by NXP Semiconductors

BUS DRIVER; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: TSSOP; Package Shape: RECTANGULAR;

Median Price

$0.761

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$0.747

1k+ parts

$0.620

10k+ parts

$0.553

500

-

$0.747

$0.620

$0.553

Verical

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.775

10k+ parts

$0.691

500

-

-

$0.775

$0.691

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,199 parts In-Stock

1+ parts

$0.298

100+ parts

-

1k+ parts

-

10k+ parts

-

1,199

$0.298

-

-

-

Vyrian

USA . 8,580 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,580

-

-

-

-

Anansix

USA . 1,517 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,517

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,279 parts In-Stock

1+ parts

$0.283

100+ parts

-

1k+ parts

-

10k+ parts

-

3,279

$0.283

-

-

-

Andel Nordic

Denmark . 476 parts In-Stock

1+ parts

$1.970

100+ parts

-

1k+ parts

$1.891

10k+ parts

$1.891

476

$1.970

-

$1.891

$1.891

Native Components

USA . 700 parts In-Stock

1+ parts

$2.100

100+ parts

-

1k+ parts

-

10k+ parts

-

700

$2.100

-

-

-

Northwest PG Solutions

USA . 375 parts In-Stock

1+ parts

$2.310

100+ parts

-

1k+ parts

-

10k+ parts

-

375

$2.310

-

-

-

AZTECH Wire

Italy . 215 parts In-Stock

1+ parts

$12.920

100+ parts

-

1k+ parts

-

10k+ parts

-

215

$12.920

-

-

-

Microchip USA

USA . 289 parts In-Stock

1+ parts

$25.240

100+ parts

-

1k+ parts

-

10k+ parts

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289

$25.240

-

-

-

UNI Independent Distributors

Spain . 3,030 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,030

-

-

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Perfect Parts

USA . 1,154 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,154

-

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-

Technical Specifications

Bus Driver & Transceivers 74LVC821APW,112 attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

7.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

120000000 Hz

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

10

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

9.5 ns

Propagation Delay (tpd):

11 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

4.4 mm

Trade Compliance

74LVC821APW,112 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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