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74HC4075DB,118

NXP Semiconductors

74HC4075DB,118 by NXP Semiconductors

NXP Semiconductors' 74HC4075DB,118 is a CMOS Logic Gates IC with 3 functions and inputs. It operates at a supply voltage range of 2-6V, with a propagation delay of 30ns. Ideal for automotive applications due to its temperature grade and small outline package style.

Median Price

$0.734

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

$0.721

1k+ parts

$0.599

10k+ parts

$0.534

6,000

-

$0.721

$0.599

$0.534

Verical

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

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$0.748

10k+ parts

$0.667

6,000

-

-

$0.748

$0.667

Distributors (In-Stock)

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Nova Conductors

Japan . 63 parts In-Stock

1+ parts

$0.271

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-

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63

$0.271

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Digiode

USA . 3,115 parts In-Stock

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$0.288

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3,115

$0.288

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Vyrian

USA . 6,907 parts In-Stock

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6,907

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VNN

France . 3,508 parts In-Stock

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Anansix

USA . 562 parts In-Stock

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562

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Distributors (Availability)

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Ampacity Inc.

Singapore . 5,569 parts In-Stock

1+ parts

$0.258

100+ parts

-

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5,569

$0.258

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Aranea Global

USA . 2,000 parts In-Stock

1+ parts

$0.265

100+ parts

-

1k+ parts

$0.254

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2,000

$0.265

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$0.254

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Corphita

USA . 3,323 parts In-Stock

1+ parts

$0.273

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3,323

$0.273

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Microchip USA

USA . 364 parts In-Stock

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$0.432

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364

$0.432

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AZTECH Wire

Italy . 199 parts In-Stock

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$15.210

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199

$15.210

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UNI Independent Distributors

Spain . 2,661 parts In-Stock

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2,661

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Overview

Upgrade your electronics with the 74HC4075DB,118 from NXP Semiconductors. This high-quality logic gate offers three functions and three inputs in a small outline package, making it perfect for a wide range of applications. With a fast propagation delay of only 30 ns and a wide operating temperature range, this component is ideal for automotive use. Trust NXP Semiconductors for reliable performance and innovative technology that will take your projects to the next level.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - Provides durability and cost-effectiveness.

Surface Mount:

YES - Allows for easy installation and space-saving design.

No. of Functions:

3 - Offers versatility and flexibility in circuit design.

No. of Inputs:

3 - Provides multiple input options for complex logic operations.

Package Shape:

RECTANGULAR - Fits well in standard circuit layouts for easy integration.

Nominal Supply Voltage / Vsup (V):

5 - Compatible with common power sources for widespread use.

Load Capacitance (CL):

50 pF - Ensures reliable performance with standard capacitance levels.

No. of Terminals:

14 - Provides ample connection points for various applications.

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH - Saves space and enhances circuit density.

Propagation Delay (tpd):

30 ns - Offers fast signal transmission for efficient operations.

Maximum Operating Temperature:

125 °C - Suitable for high-temperature environments.

Minimum Operating Temperature:

40 °C - Ideal for use in cold or harsh conditions.

Terminal Finish:

NICKEL PALLADIUM GOLD - Enhances conductivity and corrosion resistance.

Terminal Position:

DUAL - Facilitates easy PCB layout and connection routing.

Maximum Seated Height:

2 mm - Fits in compact spaces without cluttering the layout.

Width:

5.3 mm - Contributes to the compact size and efficient use of board space.

Minimum Supply Voltage (Vsup):

2 V - Can operate efficiently at low power levels.

Length:

6.2 mm - Provides a balanced form factor for ease of integration.

Temperature Grade:

AUTOMOTIVE - Suitable for automotive applications with specific temperature requirements.

Technology:

CMOS - Offers low power consumption and high noise immunity.

Terminal Form:

GULL WING - Facilitates easy soldering and secure PCB attachment.

Terminal Pitch:

0.65 mm - Enables close terminal spacing for compact designs.

Maximum Supply Voltage (Vsup):

6 V - Allows for higher voltage applications when needed.

Technical Specifications

Logic Gates 74HC4075DB,118 attributes and parameters. Explore more Logic Gates devices from NXP Semiconductors

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

6.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

3

No. of Inputs:

3

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Propagation Delay (tpd):

30 ns

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

5.3 mm

Trade Compliance

74HC4075DB,118 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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