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74AHC241D,118

NXP Semiconductors

74AHC241D,118 by NXP Semiconductors

BUS DRIVER; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: SOP; Package Shape: RECTANGULAR;

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,203 parts In-Stock

1+ parts

-

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1k+ parts

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8,203

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Digiode

USA . 2,433 parts In-Stock

1+ parts

-

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1k+ parts

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2,433

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Anansix

USA . 1,497 parts In-Stock

1+ parts

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100+ parts

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1,497

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 23 parts In-Stock

1+ parts

$1.295

100+ parts

-

1k+ parts

$1.243

10k+ parts

$1.243

23

$1.295

-

$1.243

$1.243

Native Components

USA . 514 parts In-Stock

1+ parts

$5.060

100+ parts

-

1k+ parts

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10k+ parts

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514

$5.060

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One Stop Electronics

USA . 574 parts In-Stock

1+ parts

$12.000

100+ parts

-

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574

$12.000

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AZTECH Wire

Italy . 569 parts In-Stock

1+ parts

$16.500

100+ parts

-

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569

$16.500

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-

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Microchip USA

USA . 281 parts In-Stock

1+ parts

$30.807

100+ parts

-

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281

$30.807

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Corphita

USA . 4,994 parts In-Stock

1+ parts

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4,994

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UNI Independent Distributors

Spain . 2,161 parts In-Stock

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2,161

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Northwest PG Solutions

USA . 251 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

$4.959

10k+ parts

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251

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$4.959

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Technical Specifications

Bus Driver & Transceivers 74AHC241D,118 attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Control Type:

ENABLE LOW/HIGH

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

11.2 ns

Qualification:

Not Qualified

Sub-Category:

Bus Driver/Transceivers

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

74AHC241D,118 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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