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2N881/PH

NXP Semiconductors

2N881/PH by NXP Semiconductors

SCR; Package Style (Meter): CYLINDRICAL; Surface Mount: NO; Terminal Position: BOTTOM; Configuration: SINGLE; Repetitive Peak Reverse Voltage: 200 V;

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,870 parts In-Stock

1+ parts

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2,870

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Digiode

USA . 1,788 parts In-Stock

1+ parts

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1,788

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Anansix

USA . 512 parts In-Stock

1+ parts

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512

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 45 parts In-Stock

1+ parts

$1.232

100+ parts

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45

$1.232

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Northwest PG Solutions

USA . 1,640 parts In-Stock

1+ parts

$1.355

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1,640

$1.355

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One Stop Electronics

USA . 794 parts In-Stock

1+ parts

$11.100

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794

$11.100

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UNI Independent Distributors

Spain . 7,997 parts In-Stock

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7,997

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Corphita

USA . 1,029 parts In-Stock

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1,029

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Technical Specifications

Silicon Controlled Rectifiers (SCR) 2N881/PH attributes and parameters. Explore more Silicon Controlled Rectifiers (SCR) devices from NXP Semiconductors

Specs

Configuration:

Maximum DC Gate Trigger Current:

.2 mA

JEDEC-95 Code:

TO-18

JESD-30 Code:

O-MBCY-W3

No. of Elements:

1

No. of Terminals:

3

Package Body Material:

METAL

Package Shape:

ROUND

Package Style (Meter):

Qualification:

Not Qualified

Repetitive Peak Reverse Voltage:

200 V

Surface Mount:

NO

Terminal Form:

WIRE

Terminal Position:

Trigger Device Type:

SCR

Trade Compliance

2N881/PH Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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