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PMDT290UNEYL

Nexperia

PMDT290UNEYL by Nexperia

PMDT290UNEYL by Nexperia is a N-CHANNEL FET with 2 elements and built-in diode, ideal for SWITCHING applications. It features a Min DS Breakdown Voltage of 20V, Max Drain Current of 0.8A, and Max Drain-Source On Resistance of 0.38 ohm. This small outline transistor operates in ENHANCEMENT MODE and is surface mountable.

Median Price

$0.075

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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Arrow

USA . 16,000 parts In-Stock

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Verical

USA . 16,000 parts In-Stock

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$0.075

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Nova Conductors

Japan . 500 parts In-Stock

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$0.125

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USA . 176,000 parts In-Stock

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Vyrian

USA . 6,241 parts In-Stock

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AZTECH Wire

Italy . 10,634 parts In-Stock

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Ampacity Inc.

Singapore . 1,071 parts In-Stock

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$35.050

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Supply Digital

USA . 1,244 parts In-Stock

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Netroflash

USA . 50 parts In-Stock

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$0.122

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$0.119

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$0.116

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Overview

Unlock the power of innovation with the PMDT290UNEYL by Nexperia, a cutting-edge small signal Field Effect Transistor that offers unparalleled performance and reliability. Manufactured by Nexperia, a leader in semiconductor technology, this N-CHANNEL transistor is designed for switching applications with a minimum DS breakdown voltage of 20 V. With its unique configuration of separate elements and built-in diode, this transistor provides enhanced functionality and efficiency. Experience the value and benefits of this high-quality product and take your projects to the next level with Nexperia's PMDT290UNEYL.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the transistor, making it suitable for a variety of environments.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have lower ON-resistance and higher electron mobility, making them efficient for switching applications.

Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

Having built-in diodes allows for easier implementation and protection against reverse polarity, increasing the reliability of the product.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor provides fast and efficient switching performance.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving space and enabling automated production processes.

Minimum DS Breakdown Voltage: 20 V

The high breakdown voltage ensures reliable operation and protection against voltage spikes in the circuit.

Package Shape: RECTANGULAR

The rectangular shape of the package provides a compact form factor, ideal for applications with limited space constraints.

Transistor Element Material: SILICON

Silicon is a common semiconductor material known for its high thermal conductivity and low energy consumption, making it a cost-effective choice for transistors.

Maximum Drain Current (ID): 0.8 A

The high maximum drain current capability allows for the handling of larger loads, making the transistor suitable for a wide range of applications.

Maximum Drain-Source On Resistance: 0.38 ohm

The low ON-resistance minimizes power loss and heat generation, increasing the efficiency of the transistor in conducting current.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductors offer high switching speeds and low leakage current, making them suitable for high-frequency applications and power efficiency.

Terminal Finish: TIN

Tin provides good solderability and corrosion resistance, ensuring reliable and stable connections in various operating conditions.

Technical Specifications

Small Signal Field Effect Transistors (FET) PMDT290UNEYL attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Nexperia

Specs

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (ID):

.8 A

Maximum Drain-Source On Resistance:

.38 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-F6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

PMDT290UNEYL Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Nexperia

Founded in 2017, Nexperia is a leading provider of semiconductors, based out of Nijmegen, the Netherlands. It is owned by the partially state-owned Chinese company Wingtech Technology. With factories in Hamburg, Germany and Greater Manchester, England, Nexperia is able to provide its clients with high quality semiconductor products quickly and efficiently.On November 8, 2023, Vishay and Nexperia BV announced that they have entered into an agreement whereby Vishay will acquire Nexperia’s wafer fabrication facility and operations located in Newport, South Wales, U.K. for approximately $177,000 in cash, subject to customary post-closing adjustments. On November 8, 2023, Vishay remitted $8,750 to an escrow account as a deposit for the acquisition. Such amount is included within "Purchase of and deposits for businesses, net of cash acquired" on the consolidated statement of cash flows. To effect the transaction, Vishay will acquire a 100% interest in the legal entity Neptune 6 Limited, and its wholly-owned operating subsidiary, Nexperia Newport Limited, which owns and operates the Newport facility. The closing of the transaction is subject to U.K. government review and customary closing conditions, and is expected to occur in the first quarter of 2024.

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Management team

CEO

Xuezheng Zhang (Wing)

CFO

Stefan Tilger

COO

Achim Kempe

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Hamburg

Fabrication

Fab Initiation

1981

Germany

Hamburg

Wafer Capacity

36,000

1981

36,000

Manchester (8-inch line)

Fabrication

Fab Initiation

2017

Australia

Hazelgrove

Wafer Capacity

12,000

2017

12,000

Manchester (6-inch line)

Fabrication

Fab Initiation

1998

Australia

Hazelgrove

Wafer Capacity

22,000

1998

22,000

Shanghai Fab

Fabrication

Fab Initiation

2022

China

Shanghai

Wafer Capacity

2022

Nexperia Newport

Fabrication

Fab Initiation

1998

UK

Newport

Wafer Capacity

34,000

1998

34,000

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