Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
Mill-max Mfg's 110-93-628-41-605000 is a PLASTIC IC SOCKET for DIP28 devices. Featuring BERYLLIUM COPPER contacts with Tin/Lead finish, it has 28 RECTANGLE contacts. Ideal for Chip Carrier IC & Component Sockets applications.
Median Price
$3.810
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Component Electronics Inc.
$2.310
$1.730
$1.500
Nova Conductors
$5.310
Vyrian
VNN
Bisco
PC Components Company LLC
Bristol Electronics
AZTECH Wire
$0.840
$0.810
$0.790
$0.770
Ampacity Inc.
$18.000
The housing material being plastic makes the chip carrier IC & component socket lightweight and durable, which is ideal for electronic components that may require frequent handling or movement.
Being compatible with DIP28 devices allows for easy installation and connection, ensuring that this socket can be used with a wide range of components without compatibility issues.
Beryllium copper is known for its excellent conductivity and durability, ensuring a reliable and long-lasting connection between the socket and the component.
Having 28 contacts allows for a wide range of connectivity options, making this socket suitable for various devices and applications that may require multiple connections.
The tin/lead finish with nickel barrier provides a corrosion-resistant surface for the contacts, ensuring a stable and reliable electrical connection over time.
The IC socket type is specifically designed for integrated circuit components, providing a secure and reliable connection for delicate and sensitive electronic devices.
The rectangle contact configuration allows for easy and secure placement of the component, ensuring a stable connection and minimizing the risk of disconnection during operation.
Chip Carrier IC & Component Sockets 110-93-628-41-605000 attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from Mill-max Mfg
Number of Positions or Pins:
Contact Finish - Termination:
Contact Material:
Contact Configuration:
IC Socket Type:
Housing Material:
JESD-609 Code:
Compatible Device Type:
Special Features:
110-93-628-41-605000 Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.90.40.00
SB
Mill-Max Mfg. Corp. is a vertically integrated engineering and manufacturing company capable of producing over 100 million interconnect components a week, making us the largest manufacturer of precision machined interconnect components in North America.
MBR1560CT
Yangzhou Yangjie Electronics
RECTIFIER DIODE; Surface Mount: NO; Maximum Operating Temperature: 150 Cel; Maximum Repetitive Peak Reverse Voltage: 60 V; Technology: SCHOTTKY; Maximum Non Repetitive Peak Forward Current: 150 A;
PIC18F4550-I/ML
Microchip Technology
The Microchip Technology PIC18F4550-I/ML is an 8-bit microcontroller with a max clock frequency of 48 MHz. It features 13-Ch 10-Bit ADC channels and USB connectivity, making it ideal for industrial applications requiring high-speed data processing and analog-to-digital conversion. With low power mode and flash ROM programmability, this chip offers efficient performance in compact designs.
LM78L05ACMX/NOPB
Texas Instruments
LM78L05ACMX/NOPB by Texas Instruments is a fixed positive single output standard regulator with an output voltage of 5V and max current of 0.1A. It operates b/w 0-125°C, has a dropout voltage of 1.6V, and can handle input voltages up to 30V making it ideal for various electronic applications requiring stable power supply.
SS14
Changzhou Starsea Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LL4148
Daco Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
M39029/56-351
Defense Logistics Agency
CONNECTOR ACCESSORY; MIL Conformity: YES; Contact Gender: FEMALE; Mating Contacts: M39029/58-363; Removal Tool Sources: MILITARY; Alternate Contact Sources: MILITARY;
STM32H743XIH6
STMicroelectronics
STM32H743XIH6 by STMicroelectronics is a 32-bit microcontroller with Cortex-M7 CPU, 36-Ch 16-Bit ADC, and 2-Ch 12-Bit DAC. It operates at up to 48 MHz, has 1085440 bytes of RAM, and offers connectivity options like CAN, I2C, USB. Ideal for industrial applications requiring high-performance processing and extensive peripheral support.
FDD5614P
Fairchild Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 42 W; Terminal Position: SINGLE; Terminal Form: GULL WING;
C0603C104K5RACAUTO
KEMET Corporation
KEMET C0603C104K5RACAUTO is a ceramic capacitor with 0.1uF capacitance, rated for 50V. It has X7R temperature characteristics, -55 to 125°C operating range, and ±10% tolerance. Ideal for automotive applications meeting AEC-Q200 standard, it comes in SMT package with matte tin finish and wraparound terminals.
Goodwork Semiconductor
2N7002
Sinyork
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Operating Temperature: 85 Cel; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR; Operating Mode: ENHANCEMENT MODE;
MBRS1100T3G
Onsemi
MBRS1100T3G by Onsemi is a Schottky rectifier diode with a max output current of 1A and forward voltage of 0.75V. It operates in temperatures ranging from -65 to 175°C, making it suitable for power applications. With a reverse test voltage of 100V, this diode is ideal for high-power circuits requiring efficient rectification.
1N4148
New Jersey Semiconductor Products
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
2N2222A
Vpt Components
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Power Dissipation (Abs): 1 W; Maximum Collector Current (IC): .8 A; Maximum Power Dissipation Ambient: .5 W;
BAV99
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
0462-201-16141
TE Connectivity
TE Connectivity's 0462-201-16141 is a CRIMP terminal with MACHINED contact design. It operates b/w -55 to 125 °C, suitable for wire gauges from 20 to 16 AWG. With a rated current of 13A, it is ideal for applications requiring FEMALE ROUND PIN-SOCKET contacts.
DS18B20+
Maxim Integrated
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: THROUGH HOLE MOUNT; No. of Terminals: 3; Package Shape or Style: RECTANGULAR; Maximum Operating Current: 1.5 mA; Package Equivalence Code: SIP3,.1,50;
ULN2803A
Allegro MicroSystems
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Maximum Operating Temperature: 85 Cel; Terminal Form: THROUGH-HOLE;
International Semiconductor
ERJU06F10R0V
Panasonic
ERJU06F10R0V by Panasonic is an 0805 size SMT fixed resistor with a resistance of 10 ohm and 1% tolerance. It operates b/w -55 to 155 °C, suitable for AEC-Q200 standards in automotive applications due to its high temperature coefficient of 100 ppm/°C. With a max operating voltage of 150 V and power dissipation of 0.125 W, it is ideal for surface mounting type.
264-4493-00-0602J
3m Electronic Products Division
The 3M Electronic Products Division's 264-4493-00-0602J is a DIP64 IC socket with GLASS FILLED POLYSULFONE housing and BERYLLIUM COPPER contacts. It features 64 gold (30) over nickel (50) contacts for mating and termination. Ideal for chip carrier ICs, this socket offers reliable connectivity in electronic applications.
4513
Keystone Electronics
TRANSISTOR SOCKET;
XR2A-4221-N
Omron
IC SOCKET; Manufacturer Series: XR2;
153-10-952-00-001000
Mill-max Mfg
153-10-952-00-001000 by Mill-max Mfg is a PLASTIC IC SOCKET for DIP52 devices with 52 contacts. It features GOLD OVER NICKEL contact finish and RECTANGLE contact configuration. Ideal for Chip Carrier IC & Component Sockets applications.
RSE116166
Amphenol
RELAY SOCKET;
110-91-322-41-001000
110-91-322-41-001000 by Mill-max Mfg is a Chip Carrier IC Socket with POLYETHYLENE housing and BERYLLIUM COPPER contacts. Featuring 22 gold-plated contacts, it is designed for DIP22 devices. The socket has Tin/Lead termination with Nickel barrier, making it ideal for various electronic applications.
540-88-044-17-400-TR
Preci-dip Sa
IC SOCKET; Device Type Used On: PLCC44; Housing Material: PPS THERMOPLASTIC; Additional Features: STANDARD: UL 94V-0, LOW PROFILE; No. of Contacts: 44; Contact Material: NOT SPECIFIED;
M12883/40-01
RELAY SOCKET; Device Type Used On: RELAY; Housing Material: POLYETHERIMIDE; No. of Contacts: 14; Contact Finish (Termination): GOLD; Contact Finish (Mating): GOLD;
1-2199298-9
TE Connectivity 1-2199298-9 is a DIP28 IC socket with 28 contacts, 7.62mm PCB row spacing, and glass-filled PBT housing material. It has a solder termination type, -40 to 105°C operating temperature range, and 1A current rating. Ideal for applications requiring reliable chip carrier connections in electronic devices.
XR2D-3204
IC SOCKET; Contact Material: BERYLLIUM COPPER; Contact Finish (Mating): GOLD (30); JESD-609 Code: e4; Contact Finish (Termination): Gold (Au);
1-1814655-5
TE Connectivity's 1-1814655-5 is a SIP20 IC socket with 20 contacts, rated at 1A current. It features thermoplastic polyester housing, solder termination, and rectangular PCB contact pattern. With a dielectric voltage of 1400VAC, it operates b/w -55°C to 125°C, ideal for chip carrier applications.
1-1437504-9
TE Connectivity 1-1437504-9 is a FLUOROPOLYMER Chip Carrier IC Socket for TO-5 devices. With 3 solder contacts, it supports up to 3A current rating. Operating b/w -55°C to 125°C, it's ideal for high-temp applications in various industries.
PL11
RELAY SOCKET; Contact Material: NOT SPECIFIED; Contact Finish (Termination): NOT APPLICABLE; Contact Finish (Mating): NOT SPECIFIED;
08-3518-10E
Aries Electronics
Aries Electronics 08-3518-10E is a DIP18 IC socket with 8 contacts, made of brass with gold finish. It has a 0.1" contact pitch and can handle up to 3A current. Ideal for chip carrier applications due to its rectangular PCB contact pattern and nylon46 housing material.
3-1437530-5
IC SOCKET; Device Type Used On: SIP20; Housing Material: POLYESTER; Contact Finish (Mating): NOT APPLICABLE; Additional Features: UL94V-0; No. of Contacts: 20;
XR3G-6411
IC SOCKET; Contact Material: BERYLLIUM COPPER; Contact Finish (Termination): GOLD; Contact Finish (Mating): GOLD (10); JESD-609 Code: e4;
10140369-201LF
Amphenol Communications Solutions
Amphenol's 10140369-201LF is a Chip Carrier IC Socket with 225 contacts, featuring a rectangular contact pattern and surface mount termination. With a PCB contact row spacing of 0.99mm, it is designed for BGA225 devices. This IC socket has a mating contact pitch of 0.039" and is ideal for straight mounting applications.
PR3-BSC1/2X21
Phoenix Contact
2-1571552-9
TE Connectivity's 2-1571552-9 is a DIP28 IC socket with 28 contacts, rated at 3A current. Featuring a PCB contact row spacing of 15.24mm and rectangular pattern, it uses solder termination for applications requiring a dielectric voltage withstand of 1400VAC.
2625-6325-9UA-1902
2625-6325-9UA-1902 by 3M Electronic Products Division is a POLYETHERSULFONE chip carrier IC socket for PGA625 with 625 gold contacts. It features gold (30) over nickel (50) finish for mating and termination, suitable for high-performance integrated circuit applications.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
110-93-308-41-001000
IC SOCKET; Device Type Used On: DIP8; Housing Material: PCT POLYESTER; Additional Features: DIP SOCKET; Contact Finish (Mating): NOT SPECIFIED; Contact Config: RECTANGLE;
110-99-632-41-001000
IC SOCKET; Device Type Used On: DIP32; Housing Material: POLYETHYLENE; Additional Features: DIP SOCKET; Contact Config: RECTANGLE; Contact Finish (Termination): Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier;
110-93-320-41-801000
IC SOCKET; Device Type Used On: DIP20; Housing Material: PLASTIC; JESD-609 Code: e0; Contact Material: BERYLLIUM COPPER; Contact Config: RECTANGLE;
110-93-628-41-801000
IC SOCKET; Device Type Used On: DIP28; Housing Material: PLASTIC; Additional Features: LOW PROFILE; Contact Config: RECTANGLE; Contact Material: NOT SPECIFIED;
110-93-314-10-001000
RELAY SOCKET; Device Type Used On: DIP4; Housing Material: PCT POLYESTER; JESD-609 Code: e0; Contact Finish (Mating): NOT SPECIFIED; Contact Finish (Termination): Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier;
110-93-308-41-605000
IC SOCKET; Device Type Used On: DIP8; Housing Material: PLASTIC; No. of Contacts: 8; Contact Config: RECTANGLE; Contact Finish (Termination): Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier;
110-93-320-41-605000
IC SOCKET; Device Type Used On: DIP20; Housing Material: PLASTIC; Contact Finish (Termination): Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier; Contact Finish (Mating): GOLD (30) OVER NICKEL (100); Contact Config: RECTANGLE;
IC SOCKET; Device Type Used On: DIP22; Housing Material: POLYETHYLENE; Additional Features: DIP SOCKET; Contact Config: RECTANGLE; JESD-609 Code: e0;
110-99-308-41-001000
IC SOCKET; Device Type Used On: DIP8; Housing Material: POLYETHYLENE; Contact Config: RECTANGLE; Contact Finish (Termination): Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier; Additional Features: DIP SOCKET;
110-93-632-41-001000
IC SOCKET; Device Type Used On: DIP32; Housing Material: POLYETHYLENE; No. of Contacts: 32; Contact Material: BERYLLIUM COPPER; JESD-609 Code: e0;
110-93-964-41-001000
IC SOCKET; Device Type Used On: DIP64; Housing Material: POLYETHYLENE; JESD-609 Code: e0; No. of Contacts: 64; Contact Config: RECTANGLE;
110-93-306-41-001000
IC SOCKET; Device Type Used On: DIP6; Housing Material: POLYETHYLENE; Contact Finish (Mating): GOLD (30) OVER NICKEL (100); Additional Features: DIP SOCKET; Contact Config: RECTANGLE;
110-93-314-41-001000
IC SOCKET; Device Type Used On: DIP14; Housing Material: PCT POLYESTER; Contact Finish (Mating): NOT SPECIFIED; No. of Contacts: 14; Additional Features: DIP SOCKET;
110-93-316-41-605000
IC SOCKET; Device Type Used On: DIP16; Housing Material: PLASTIC; Contact Finish (Termination): Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier; Contact Finish (Mating): GOLD (30) OVER NICKEL (100); Additional Features: 94V-0;
110-93-628-41-105
IC SOCKET; Device Type Used On: DIP28; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Dielectric Withstanding Voltage (V): 1000VAC; Housing Material: GLASS FILLED POLYETHYLENE POLYESTER;
110-93-628-41-001
110-93-628-41-605
110-93-628-41-801
IC SOCKET; Device Type Used On: DIP28; Mounting Style: STRAIGHT; Contact Style: SQ PIN-SKT; Dielectric Withstanding Voltage (V): 1000VAC; Housing Material: GLASS FILLED POLYETHYLENE POLYESTER;
110-93-628-41-105000
IC SOCKET; Device Type Used On: DIP28; Housing Material: PLASTIC; Contact Config: RECTANGLE; Additional Features: DIP SOCKET; JESD-609 Code: e0;
110-93-628-41-001000
IC SOCKET; Device Type Used On: DIP28; Housing Material: POLYETHYLENE; Contact Config: RECTANGLE; Contact Material: BERYLLIUM COPPER; Contact Finish (Mating): NOT SPECIFIED;
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
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