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110-93-628-41-605

Mill-max Mfg

110-93-628-41-605 by Mill-max Mfg

IC SOCKET; Device Type Used On: DIP28; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Dielectric Withstanding Voltage (V): 1000VAC; Housing Material: GLASS FILLED POLYETHYLENE POLYESTER;

Median Price

-

Lifecycle Status

Suppliers In-Stock

1

In-Stock Inventory

< 1k

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

R&J Components

USA . 49 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

49

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-

-

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Technical Specifications

Chip Carrier IC & Component Sockets 110-93-628-41-605 attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from Mill-max Mfg

Connectivity

Number of Positions or Pins:

28

Contact Finish - Mating:

Gold (30) over Nickel (100)

Contact Finish - Termination:

Tin / Lead with Nickel Barrier

Contact Configuration:

Rectangle

Contact Style:

Installation Type:

Solder

Mating Contact Pitch:

0.1 in (2.54 mm)

PCB Contact Row Spacing:

0.6 in (15.24 mm)

Terminal Pitch:

0.1 in (2.54 mm)

Mounting Style:

PCB Contact Layout:

Rectangular

Physical Characteristics

IC Socket Type:

Length:

1.4 inch

Width:

0.7 in (17.78 mm)

Depth:

0.165 in (4.191 mm)

JESD-609 Code:

e0

Electrical Characteristics

Current Rating:

1 A

Dielectric Withstanding Voltage:

Insulation Resistance:

10 GΩ

Thermal Characteristics

Minimum Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Compatibility

Compatible Device Type:

Additional Features

Special Features:

DIP Socket

Trade Compliance

110-93-628-41-605 Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8536.90.40.00

SB

8536.90.40.00

Manufacturer Highlights

Mill-max Mfg

Mill-Max Mfg. Corp. is a vertically integrated engineering and manufacturing company capable of producing over 100 million interconnect components a week, making us the largest manufacturer of precision machined interconnect components in North America.

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