Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
Mill-max Mfg's 110-93-964-41-001000 is a Chip Carrier IC Socket with POLYETHYLENE housing, BERYLLIUM COPPER contacts, and 64 gold-plated contacts. Designed for DIP64 devices, it features Tin/Lead termination and is ideal for rectangular IC configurations.
Median Price
$11.400
Lifecycle Status
Suppliers In-Stock
9
In-Stock Inventory
1k+
Arrow
1+ parts
$2.890
100+ parts
$2.778
1k+ parts
$2.500
10k+ parts
$2.412
Mouser Electronics
$8.700
$7.430
$7.080
DigiKey
$11.540
$8.707
$7.438
$7.086
Verical
-
Nova Conductors
$5.051
VNN
Vyrian
Mil-Aero Solutions, Inc.
Bisco
Ampacity Inc.
$2.460
AZTECH Wire
$14.741
Glotronic Ltd.
Perfect Parts
Netroflash
$4.950
$4.799
$4.698
Polyethylene is a highly durable and lightweight material, making the chip carrier socket resistant to damage and suitable for long-term use.
Designed for DIP64 devices, ensuring compatibility and a secure fit for the integrated circuit.
Beryllium copper offers excellent electrical conductivity and durability, promoting reliable connections between the socket and the integrated circuit.
With 64 contacts, this chip carrier socket can accommodate a wide range of integrated circuits, providing versatility and compatibility.
The gold finish over nickel ensures high conductivity and corrosion resistance, enhancing the performance and longevity of the socket.
The tin/lead finish with nickel barrier promotes solderability and strong solder joints, ensuring secure termination of the socket.
Being an IC socket, this product allows for easy installation and replacement of integrated circuits, making it user-friendly and convenient.
The rectangular contact configuration provides a stable and secure connection between the socket and integrated circuit, minimizing the risk of signal loss or disconnection.
Chip Carrier IC & Component Sockets 110-93-964-41-001000 attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from Mill-max Mfg
Number of Positions or Pins:
Contact Finish - Mating:
Contact Finish - Termination:
Contact Material:
Contact Configuration:
IC Socket Type:
Housing Material:
JESD-609 Code:
Compatible Device Type:
Special Features:
110-93-964-41-001000 Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.90.40.00
SB
Mill-Max Mfg. Corp. is a vertically integrated engineering and manufacturing company capable of producing over 100 million interconnect components a week, making us the largest manufacturer of precision machined interconnect components in North America.
LM317T
Comset Semiconductors
Other Regulators; No. of Terminals: 3; Terminal Pitch: 2.54 mm; Minimum Output Voltage-1: 1.2 V; Technology: BIPOLAR; Operating Temperature (TJ-Max): 125 Cel;
2N7002
Diotec Semiconductor Ag
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Maximum Time At Peak Reflow Temperature (s): 10; Terminal Finish: MATTE TIN;
SS14+
Multicomp Pro
SS14+ by Multicomp Pro is a Schottky rectifier diode with a max output current of 1A and a reverse test voltage of 40V. It is designed for surface mount applications in electronic circuits, offering a small outline package style and dual terminal position. With a temperature range from -65°C to 150°C, it is suitable for various industrial and consumer electronics.
LL4148
Temic Semiconductors
RECTIFIER DIODE; Terminal Position: END; Terminal Form: NO LEAD; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
BSS138NH6327XTSA2
Infineon Technologies
BSS138NH6327XTSA2 by Infineon is a N-CHANNEL FET with 60V DS Breakdown Voltage, ideal for small signal applications. Operating in Enhancement Mode, it has 0.36W Power Dissipation and 3.5 ohm Drain-Source Resistance. With Gull Wing terminals and AEC-Q101 reference standard, it's suitable for automotive electronics due to its high temperature range of -55 to 150 °C.
M39029/56351
Souriau
CONNECTOR ACCESSORY; MIL Conformity: YES; Contact Gender: FEMALE; Insertion Tools: M81969/14-10; Tool Settings: M22520/2-10; DIN Conformity: NO;
CRG0805F10R
Tyco Electronics Components
FIXED RESISTOR; Mounting Type: SURFACE MOUNT; Resistance: 10 ohm; Rated Power Dissipation (P): .125 W; Maximum Operating Temperature: 125 Cel; Tolerance: 1 %;
BAV99
Bytesonic Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
M39029/58360
Esterline Technologies
CONNECTOR ACCESSORY; Terminal Type: CRIMP; Removal Tools: M81969/14-01; Associated Military - Specifications: MIL-DTL-38999; IEC Conformity: NO; MIL-Connector Accessory Name: CONTACT;
2N2222A
Semiconductor Technology
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
LM555CN
Intersil
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
BSS138
Jiangsu Changjiang Electronics Technology
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Package Style (Meter): SMALL OUTLINE; Maximum Drain Current (ID): .22 A; Package Shape: RECTANGULAR;
LM107H
Raytheon Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Low-Offset: NO;
LM107H/883C
Rochester Electronics
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Package Equivalence Code: CAN8,.2;
LM555CM
Fairchild Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
RC0402FR-071KL
Yageo
The Yageo RC0402FR-071KL is a fixed resistor with a resistance of 1000 ohm and a tolerance of 1%. It is suitable for surface mount applications and has a max operating temperature of 155 °C.
Meritek Electronics
4554
Jw Miller Magnetics
Other Semiconductors;
RC0402JR-070RL
Yageo's RC0402JR-070RL is a SMT fixed resistor with 0 ohm resistance, rated for temperatures from -55 to 155 °C. It features METAL GLAZE/THICK FILM tech, WRAPAROUND terminals, and 0.0625 W power dissipation. Ideal for jumper applications in electronics requiring compact surface mount components.
ECA2DHG4R7
Panasonic
ECA2DHG4R7 by Panasonic is a 4.7uF aluminum electrolytic capacitor with 200V rated DC voltage. It features tan delta of 0.15, leakage current of 0.0664mA, and ripple current of 50mA, making it ideal for applications requiring high capacitance stability and low leakage in through-hole mounting setups at temperatures ranging from -25 to 105°C.
GFZ-30-03-G-10-AD
Samtec
The Samtec GFZ-30-03-G-10-AD is an IC socket with 300 contacts, made of beryllium copper with gold over nickel finish. It is designed for LGA300 devices and features a housing material of liquid crystal polymer. Ideal for chip carrier applications due to its high-quality contact materials and construction.
816-AG11D-ESL-LF
TE Connectivity
TE Connectivity's 816-AG11D-ESL-LF is a DIP16 IC socket with 16 contacts, rated at 3A current. Featuring a PCB contact row spacing of 7.62mm and rectangular pattern, it uses solder termination and has a thermoplastic polyester housing. Ideal for applications requiring a dielectric voltage withstand of 1000VAC in temperatures ranging from -55 to 105°C.
150-10-316-00-006101
Preci-dip Sa
150-10-316-00-006101 by Preci-dip Sa is a DIP16 IC socket with POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER housing and BRASS contacts plated with GOLD. It has 16 contacts for chip carrier ICs and components, suitable for various electronic applications requiring reliable connections.
28-C182-10
Aries Electronics
28-C182-10 by Aries Electronics is a DIP28 IC socket with 28 contacts, made of brass with gold finish. It has a PCB contact row spacing of 15.24mm and operates b/w -55°C to 105°C. Ideal for applications requiring a chip carrier socket with high insulation resistance and dielectric voltage withstand capability.
XR2T-1601-N
Omron
IC SOCKET; JESD-609 Code: e4; Contact Finish (Mating): GOLD (30); Manufacturer Series: XR2T; Contact Finish (Termination): GOLD; Contact Material: BERYLLIUM COPPER;
214-44-308-01-670799
Mill-max Mfg
214-44-308-01-670799 by Mill-max Mfg is a NYLON46 IC SOCKET for DIP8 devices with 8 contacts. It features MATTE TIN OVER NICKEL finish, ideal for Chip Carrier IC & Component Sockets applications due to its RECTANGLE contact configuration.
XR2P-3241
IC SOCKET; Contact Finish (Termination): GOLD; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED; JESD-609 Code: e4;
XR2A-0825
IC SOCKET; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT SPECIFIED;
XR2C-1611-N
IC SOCKET; JESD-609 Code: e4; Manufacturer Series: XR2; Contact Finish (Mating): GOLD (10); Contact Finish (Termination): GOLD; Contact Material: BERYLLIUM COPPER;
240-1280-00-0602J
3m Electronic Products Division
The 3M Electronic Products Division's 240-1280-00-0602J is a DIP40 IC socket with GLASS FILLED POLYSULFONE housing. It features 40 BERYLLIUM COPPER contacts with GOLD (30) over NICKEL (50) finish for mating and termination. Ideal for chip carrier ICs, this socket offers reliable connectivity in electronic applications.
DILB8P-223TLF
Amphenol Communications Solutions
DILB8P-223TLF by Amphenol is a chip carrier IC socket with 8 contacts, copper alloy material, and matte tin finish. It has a PCB contact row spacing of 7.62mm and is used on DIP8 devices. This socket is ideal for applications requiring a dielectric voltage withstand of 1400VAC and operating temperatures ranging from -55 to 105°C.
XR2A-2205
IC SOCKET; Manufacturer Series: XR2;
ICF-624-TM-O-TR
ICF-624-TM-O-TR by Samtec is a chip carrier IC socket with 24 contacts and a rectangular contact pattern. It has a PCB contact row spacing of 15.24mm and is made of liquid crystal polymer. This socket is used on DIP24 devices and can operate in temperatures ranging from -55°C to 125°C.
5401
Pomona Electronics
IC SOCKET; Device Type Used On: PLCC68; Housing Material: GLASS FILLED POLYAMIDE; Additional Features: PLCC ADAPTER; JESD-609 Code: e4; Contact Finish (Mating): GOLD;
XR2T-0811-N
IC SOCKET; Contact Finish (Termination): GOLD; Contact Material: BERYLLIUM COPPER; Contact Finish (Mating): GOLD (10); Manufacturer Series: XR2T; JESD-609 Code: e4;
PY11
RELAY SOCKET; Contact Material: NOT APPLICABLE; Contact Finish (Mating): NOT APPLICABLE;
P7SA-10P
RELAY SOCKET; Contact Finish (Mating): NOT SPECIFIED; Contact Finish (Termination): NOT APPLICABLE; No. of Contacts: 10; Contact Material: NOT SPECIFIED;
2-1571550-9
TE Connectivity's 2-1571550-9 is a DIP28 IC socket with 28 contacts, rated at 3A current. It features a PCB contact row spacing of 15.24mm and uses solder termination. With a housing made of polyethylene, it operates b/w -55°C to 105°C, suitable for various electronic applications requiring reliable connections.
110-024-050
The 3M Electronic Products Division's 110-024-050 is a DIP24 IC socket with GLASS FILLED POLYPHENYLENE SULFIDE housing and BERYLLIUM COPPER contacts. It features 24 gold-plated contacts for reliable connections, suitable for chip carrier IC applications.
XR2A-4005
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
110-93-308-41-001000
IC SOCKET; Device Type Used On: DIP8; Housing Material: PCT POLYESTER; Additional Features: DIP SOCKET; Contact Finish (Mating): NOT SPECIFIED; Contact Config: RECTANGLE;
110-99-632-41-001000
IC SOCKET; Device Type Used On: DIP32; Housing Material: POLYETHYLENE; Additional Features: DIP SOCKET; Contact Config: RECTANGLE; Contact Finish (Termination): Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier;
110-93-320-41-801000
IC SOCKET; Device Type Used On: DIP20; Housing Material: PLASTIC; JESD-609 Code: e0; Contact Material: BERYLLIUM COPPER; Contact Config: RECTANGLE;
110-93-628-41-801000
IC SOCKET; Device Type Used On: DIP28; Housing Material: PLASTIC; Additional Features: LOW PROFILE; Contact Config: RECTANGLE; Contact Material: NOT SPECIFIED;
110-93-314-10-001000
RELAY SOCKET; Device Type Used On: DIP4; Housing Material: PCT POLYESTER; JESD-609 Code: e0; Contact Finish (Mating): NOT SPECIFIED; Contact Finish (Termination): Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier;
110-93-308-41-605000
IC SOCKET; Device Type Used On: DIP8; Housing Material: PLASTIC; No. of Contacts: 8; Contact Config: RECTANGLE; Contact Finish (Termination): Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier;
110-93-320-41-605000
IC SOCKET; Device Type Used On: DIP20; Housing Material: PLASTIC; Contact Finish (Termination): Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier; Contact Finish (Mating): GOLD (30) OVER NICKEL (100); Contact Config: RECTANGLE;
110-91-322-41-001000
IC SOCKET; Device Type Used On: DIP22; Housing Material: POLYETHYLENE; Additional Features: DIP SOCKET; Contact Config: RECTANGLE; JESD-609 Code: e0;
110-99-308-41-001000
IC SOCKET; Device Type Used On: DIP8; Housing Material: POLYETHYLENE; Contact Config: RECTANGLE; Contact Finish (Termination): Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier; Additional Features: DIP SOCKET;
110-93-632-41-001000
IC SOCKET; Device Type Used On: DIP32; Housing Material: POLYETHYLENE; No. of Contacts: 32; Contact Material: BERYLLIUM COPPER; JESD-609 Code: e0;
110-93-306-41-001000
IC SOCKET; Device Type Used On: DIP6; Housing Material: POLYETHYLENE; Contact Finish (Mating): GOLD (30) OVER NICKEL (100); Additional Features: DIP SOCKET; Contact Config: RECTANGLE;
110-93-314-41-001000
IC SOCKET; Device Type Used On: DIP14; Housing Material: PCT POLYESTER; Contact Finish (Mating): NOT SPECIFIED; No. of Contacts: 14; Additional Features: DIP SOCKET;
110-93-316-41-605000
IC SOCKET; Device Type Used On: DIP16; Housing Material: PLASTIC; Contact Finish (Termination): Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier; Contact Finish (Mating): GOLD (30) OVER NICKEL (100); Additional Features: 94V-0;
110-93-628-41-605000
IC SOCKET; Device Type Used On: DIP28; Housing Material: PLASTIC; JESD-609 Code: e0; Contact Finish (Mating): NOT SPECIFIED; Additional Features: DIP SOCKET;
110-93-964-41-105
IC SOCKET; Device Type Used On: DIP64; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Dielectric Withstanding Voltage (V): 1000VAC; Housing Material: GLASS FILLED POLYETHYLENE POLYESTER;
110-93-964-41-001
110-93-964-41-001100
IC SOCKET; Device Type Used On: DIP64; Housing Material: POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER; JESD-609 Code: e0; Contact Finish (Termination): Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier; No. of Contacts: 64;
110-93-964-41-105000
IC SOCKET; Device Type Used On: DIP64; Housing Material: PLASTIC; Contact Material: NOT SPECIFIED; No. of Contacts: 64; Contact Finish (Mating): GOLD (30) OVER NICKEL (100);
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
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