Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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110-93-316-41-605000 by Mill-max Mfg is a PLASTIC chip carrier IC socket with 16 contacts. It features GOLD (30) over NICKEL (100) mating finish and Tin/Lead termination with Nickel barrier. Ideal for DIP16 devices, this RECTANGLE contact configuration socket ensures reliable connections in electronic applications.
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The use of plastic housing material ensures durability and lightweight construction, making it a reliable choice for electronic applications.
Designed specifically for DIP16 devices, this chip carrier socket provides a secure and precise fit for optimal performance.
With 16 contacts available, this chip carrier socket can accommodate a wide range of ICs, allowing for versatile use in various electronic projects.
The gold mating contact finish over nickel ensures superior conductivity and corrosion resistance, enhancing the overall reliability and longevity of the chip carrier socket.
The tin/lead termination with nickel barrier provides a stable and secure connection, reducing the risk of signal interference and ensuring consistent performance.
Being an IC socket, this component socket allows for easy insertion and removal of integrated circuits, facilitating quick and hassle-free maintenance or upgrades.
The rectangular contact configuration offers a standardized layout that is easy to work with, simplifying the installation process and ensuring compatibility with a variety of ICs.
Chip Carrier IC & Component Sockets 110-93-316-41-605000 attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from Mill-max Mfg
Number of Positions or Pins:
Contact Finish - Mating:
Contact Finish - Termination:
Contact Configuration:
IC Socket Type:
Housing Material:
JESD-609 Code:
Compatible Device Type:
Special Features:
110-93-316-41-605000 Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.90.40.00
SB
Mill-Max Mfg. Corp. is a vertically integrated engineering and manufacturing company capable of producing over 100 million interconnect components a week, making us the largest manufacturer of precision machined interconnect components in North America.
LM358N
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
MBR1560CT
Yangzhou Yangjie Electronics
RECTIFIER DIODE; Surface Mount: NO; Maximum Operating Temperature: 150 Cel; Maximum Repetitive Peak Reverse Voltage: 60 V; Technology: SCHOTTKY; Maximum Non Repetitive Peak Forward Current: 150 A;
FT232RL-REEL
FTDI
FTDI's FT232RL-REEL is a bus controller with 28 terminals, operating at 3.3V to 5.25V. It supports USB, VBUS, and UART buses with a data transfer rate of 60MBps. Ideal for industrial applications due to its CMOS technology and compatibility with RS232, RS422, and RS485 standards.
SMBJ18CA
Fairchild Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM555CM
Intersil
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
LL4148
Surge Components
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
BAT54C-7-F
Diodes Incorporated
BAT54C-7-F by Diodes Inc. is a Schottky rectifier diode with common cathode, 2 elements, and max forward voltage of 0.24V. Ideal for applications requiring fast reverse recovery time of 0.005 us, such as in small outline packages for surface mount technology at temperatures ranging from -65 to 150°C.
Pro-an Electronic
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Clamping Voltage: 29.2 V; Polarity: BIDIRECTIONAL; Nominal Breakdown Voltage: 21.05 V; Maximum Repetitive Peak Reverse Voltage: 18 V;
Secos
MBR0520L-T1
Won-top Electronics
MBR0520L-T1 by Won-top Electronics is a Schottky rectifier diode with 20V peak reverse voltage and 0.5A output current. It is a single-config, surface-mount diode in a small outline package, suitable for applications requiring high-speed switching and low forward voltage drop. Operating temperature range from -65°C to 125°C makes it ideal for various electronic circuits.
SS14
General Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Forward International Electronics
RECTIFIER DIODE; Surface Mount: NO; Maximum Output Current: .15 A; Maximum Reverse Recovery Time: .004 us; Maximum Operating Temperature: 200 Cel; No. of Phases: 1;
CL10B104KB8NNNC
Samsung Electro-mechanics
CL10B104KB8NNNC by Samsung Electro-mechanics is a ceramic capacitor with capacitance of 0.1uF and rated DC voltage of 50V. It has a negative tolerance of 10% and temperature coefficient of 15ppm/°C, suitable for surface mount applications in various electronic devices. With dimensions of 1.6mm x 0.8mm x 0.9mm, it operates b/w -55 to 125 °C providing stable performance in compact designs.
EPCS4SI8N
Intel
EPCS4SI8N by Intel is a small outline flash memory with 512Kx8 organization, operating at 3.3V. It features a max clock frequency of 40MHz and endurance of 100k write/erase cycles. Ideal for industrial applications requiring configuration memory with serial interface and low standby current consumption.
STM32H753ZIT6
STMicroelectronics
STM32H753ZIT6 by STMicroelectronics is a 32-bit microcontroller with Cortex-M7 CPU, offering 20-Ch 16-Bit ADC and 2-Ch 12-Bit DAC channels. With a clock frequency of up to 48 MHz, it is ideal for industrial applications requiring CAN, Ethernet, and USB connectivity. This microcontroller operates b/w -40°C to +85°C temperature range.
Taitron Components
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
CRCW04020000Z0EDHP
Vishay Intertechnology
Vishay Intertechnology's CRCW04020000Z0EDHP is a 0402 SMT resistor with 0 ohm resistance, rated for temperatures from -55°C to 155°C. Ideal for jumper applications in automotive electronics due to AEC-Q200 compliance and compact size of 1mm x 0.5mm x 0.3mm.
ABS07-32.768KHZ-T
Abracon
Abracon ABS07-32.768KHZ-T crystal oscillator offers 20 ppm frequency tolerance, 144% stability, and 70000 ohm series resistance. Ideal for applications requiring 0.032768 MHz frequency precision in a compact surface-mount design with gold over nickel finish.
1552200253
Molex
WIRE AND CABLE;
FDN5618P
Onsemi
FDN5618P by Onsemi is a P-CHANNEL Power FET with 60V DS Breakdown Voltage. It features a single configuration with built-in diode, suitable for switching applications. With 10A IDM and 0.17 ohm RDS(on), it operates in the temperature range of -55 to 150 °C, making it ideal for various electronic devices.
A16-LC-TT
Assmann Wsw Components
A16-LC-TT by Assmann Wsw Components is a DIP16 IC socket with 16 phosphor bronze contacts and polybutylene terephthalate housing. It features tin contact finish for mating (80) and termination (Sn). Ideal for chip carrier applications requiring a rectangular contact configuration.
PL08-Q
Omron
RELAY SOCKET; Contact Finish (Mating): NOT APPLICABLE; Contact Material: NOT APPLICABLE;
2-1571552-2
Tyco Electronics Amp
IC SOCKET; Device Type Used On: DIP8; Housing Material: PCT PLASTIC POLYESTER; Contact Finish (Termination): TIN OVER NICKEL; Contact Finish (Mating): GOLD FLASH OVER NICKEL (100); JESD-609 Code: e3;
P2RF-08
RELAY SOCKET; Contact Finish (Termination): NOT APPLICABLE; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT SPECIFIED;
69802-444LF
Amphenol Communications Solutions
Amphenol's 69802-444LF is a PLCC44 IC socket with POLYPHENYLENE SULFIDE housing. Featuring 44 contacts, it has a current rating of 1A and operates b/w -55°C to 125°C. With surface mount termination, it offers high insulation resistance for various chip carrier applications.
HLT-1719-T-R
Samtec
Samtec's HLT-1719-T-R is a plastic IC socket for PGA323 devices with 323 brass contacts. Features tin over nickel mating finish and tin with nickel termination. Ideal for chip carrier applications, offering reliable connectivity and durability in electronic assemblies.
ICF-320-T-O-TR
Samtec's ICF-320-T-O-TR is a Chip Carrier IC Socket with 20 contacts, rated at 1A current. It features a rectangular contact pattern, liquid crystal polymer housing material, and surface mount termination type. Ideal for DIP20 devices, it has a mating contact pitch of 0.1 inches and operates b/w -55°C to 125°C.
1825575-2
TE Connectivity
TE Connectivity's 1825575-2 is a Chip Carrier IC Socket with 8 contacts, BE-CU material, and SN finish. It has a PCB contact row spacing of 17.78mm and mating pitch of 0.1 inch, suitable for DIP8 devices. Ideal for surface mount applications in electronics, it operates b/w -55°C to 125°C with a current rating of 1A.
TF183
Fischer Elektronik & Kg
TF183 by Fischer Elektronik & Kg is a TRANSISTOR SOCKET for TO-18 devices with 3 GOLD contacts. It features POLYTETRAFLUORO ETHYLENE housing material, ideal for chip carrier IC applications.
551-90-012-05-001005
Mill-max Mfg
Mill-max Mfg's 551-90-012-05-001005 is a Chip Carrier IC Socket with POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER housing and BRASS contacts. Designed for PGA12 devices, it features 12 Tin/Lead (Sn/Pb) contacts with Nickel (Ni) barrier finish. Ideal for electronic applications requiring reliable socket connections.
1-2199298-4
TE Connectivity's 1-2199298-4 is a Chip Carrier IC Socket with 16 contacts, 7.62mm PCB row spacing, and rectangular contact pattern. It is used on DIP16 devices for solder termination applications in electronics, offering a current rating of 1A and operating temperatures from -40 to 105°C.
208-7391-55-1902
3m Electronic Products Division
208-7391-55-1902 by 3m Electronic Products Division is a Chip Carrier IC & Component Socket made of POLYETHERSULFONE. It is used for SOIC8 devices and has 8 BERYLLIUM COPPER contacts with GOLD (30) OVER NICKEL (50) mating finish. This IC socket is suitable for various electronic applications.
APA-316-T-D
Samtec APA-316-T-D is a 16-contact IC socket with brass contacts and polyester housing. It features Tin over Nickel mating finish and Tin with Nickel termination finish. Ideal for DIP16 devices, this rectangular contact configuration chip carrier socket is suitable for various electronic applications.
614-43-964-31-012000
IC SOCKET; Device Type Used On: DIP64; Housing Material: PLASTIC; Contact Finish (Termination): MATTE TIN OVER NICKEL; No. of Contacts: 64; JESD-609 Code: e3;
MVAT-114-NT-13
IC SOCKET; Device Type Used On: PGA114; Contact Finish (Termination): TIN; No. of Contacts: 114; Additional Features: PGA SOCKET; JESD-609 Code: e3;
22-1508-30
Aries Electronics
Aries Electronics 22-1508-30 is a DIP32 IC socket with 22 contacts, rated at 3A current. It features wire wrap termination, gold finish over nickel mating contact, and nylon46 housing material. Used for chip carrier components on PCBs with rectangular contact pattern and 2.54mm pitch row spacing.
40-6554-10
Aries Electronics 40-6554-10 is a DIP42 IC socket with 40 contacts, PCB contact spacing of 15.24mm, and housing made of polyphenylene sulfide. It has a mating contact pitch of 0.1 inch and is used for chip carrier applications requiring a current rating of 1A at temperatures up to 105°C.
110-13-308-41-001000
110-13-308-41-001000 by Mill-max Mfg is a Chip Carrier IC Socket with 8 contacts, 0.1" pitch, and gold over nickel termination. It has a PCB contact row spacing of 7.62mm and is used on DIP8 devices. Ideal for applications requiring a mating contact pitch of 2.54mm in temperature ranges from -55°C to 125°C.
9-1437514-0
TE Connectivity's 9-1437514-0 is a Chip Carrier IC Socket with PRESS FIT termination, RND PIN-SKT contact style, and 5A current rating. It operates b/w -65°C to 125°C, making it suitable for various electronic applications requiring reliable connections.
214-44-318-01-670800
214-44-318-01-670800 by Mill-max Mfg is a NYLON46 Chip Carrier IC Socket for DIP18 devices with 18 contacts and MATTE TIN finish. It features RECTANGLE contact configuration, ideal for connecting integrated circuits in electronic applications.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
110-93-308-41-001000
IC SOCKET; Device Type Used On: DIP8; Housing Material: PCT POLYESTER; Additional Features: DIP SOCKET; Contact Finish (Mating): NOT SPECIFIED; Contact Config: RECTANGLE;
110-99-632-41-001000
IC SOCKET; Device Type Used On: DIP32; Housing Material: POLYETHYLENE; Additional Features: DIP SOCKET; Contact Config: RECTANGLE; Contact Finish (Termination): Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier;
110-93-320-41-801000
IC SOCKET; Device Type Used On: DIP20; Housing Material: PLASTIC; JESD-609 Code: e0; Contact Material: BERYLLIUM COPPER; Contact Config: RECTANGLE;
110-93-628-41-801000
IC SOCKET; Device Type Used On: DIP28; Housing Material: PLASTIC; Additional Features: LOW PROFILE; Contact Config: RECTANGLE; Contact Material: NOT SPECIFIED;
110-93-314-10-001000
RELAY SOCKET; Device Type Used On: DIP4; Housing Material: PCT POLYESTER; JESD-609 Code: e0; Contact Finish (Mating): NOT SPECIFIED; Contact Finish (Termination): Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier;
110-93-308-41-605000
IC SOCKET; Device Type Used On: DIP8; Housing Material: PLASTIC; No. of Contacts: 8; Contact Config: RECTANGLE; Contact Finish (Termination): Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier;
110-93-320-41-605000
IC SOCKET; Device Type Used On: DIP20; Housing Material: PLASTIC; Contact Finish (Termination): Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier; Contact Finish (Mating): GOLD (30) OVER NICKEL (100); Contact Config: RECTANGLE;
110-91-322-41-001000
IC SOCKET; Device Type Used On: DIP22; Housing Material: POLYETHYLENE; Additional Features: DIP SOCKET; Contact Config: RECTANGLE; JESD-609 Code: e0;
110-99-308-41-001000
IC SOCKET; Device Type Used On: DIP8; Housing Material: POLYETHYLENE; Contact Config: RECTANGLE; Contact Finish (Termination): Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier; Additional Features: DIP SOCKET;
110-93-632-41-001000
IC SOCKET; Device Type Used On: DIP32; Housing Material: POLYETHYLENE; No. of Contacts: 32; Contact Material: BERYLLIUM COPPER; JESD-609 Code: e0;
110-93-964-41-001000
IC SOCKET; Device Type Used On: DIP64; Housing Material: POLYETHYLENE; JESD-609 Code: e0; No. of Contacts: 64; Contact Config: RECTANGLE;
110-93-306-41-001000
IC SOCKET; Device Type Used On: DIP6; Housing Material: POLYETHYLENE; Contact Finish (Mating): GOLD (30) OVER NICKEL (100); Additional Features: DIP SOCKET; Contact Config: RECTANGLE;
110-93-314-41-001000
IC SOCKET; Device Type Used On: DIP14; Housing Material: PCT POLYESTER; Contact Finish (Mating): NOT SPECIFIED; No. of Contacts: 14; Additional Features: DIP SOCKET;
110-93-628-41-605000
IC SOCKET; Device Type Used On: DIP28; Housing Material: PLASTIC; JESD-609 Code: e0; Contact Finish (Mating): NOT SPECIFIED; Additional Features: DIP SOCKET;
110-93-316-41-105
IC SOCKET; Device Type Used On: DIP16; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Dielectric Withstanding Voltage (V): 1000VAC; Housing Material: GLASS FILLED POLYETHYLENE POLYESTER;
110-93-316-41-001
110-93-316-41-605
110-93-316-41-801
IC SOCKET; Device Type Used On: DIP16; Mounting Style: STRAIGHT; Contact Style: SQ PIN-SKT; Dielectric Withstanding Voltage (V): 1000VAC; Housing Material: GLASS FILLED POLYETHYLENE POLYESTER;
110-93-316-41-801000
IC SOCKET; Device Type Used On: DIP16; Housing Material: PLASTIC; Contact Config: RECTANGLE; JESD-609 Code: e0; Contact Material: NOT SPECIFIED;
110-93-316-41-105000
IC SOCKET; Device Type Used On: DIP16; Housing Material: PCT POLYESTER; JESD-609 Code: e0; Contact Finish (Mating): NOT SPECIFIED; Contact Finish (Termination): Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier;
Supply Digital Components
$106.00
$54.25
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$7.29
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12,000 In-Stock
Total price ≈ $80,197.29
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