Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
Mill-max Mfg's 110-93-314-41-001000 is a Chip Carrier IC Socket with PCT Polyester housing and Beryllium Copper contacts. Featuring 14 contacts with Tin/Lead finish, it is designed for DIP14 devices. Ideal for applications requiring reliable rectangular contact configuration.
Median Price
$2.210
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1k+
RS Americas
1+ parts
$1.860
100+ parts
$1.740
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Element14
$1.940
$1.480
Mouser Electronics
$2.480
$1.870
$1.590
$1.460
Newark
$2.980
$2.250
$1.640
DigiKey
$3.060
$2.300
$1.969
$1.758
Chip1Stop
$5.750
Arrow
$1.423
$1.409
Verical
Nova Conductors
$0.877
Voyager Components
$3.597
VNN
SPM Sales
Vyrian
Inventory MP
A2Z Electronics, Inc.
Bristol Electronics
Lantek
Elcom Components
Specialty Parts & Electronic Components, Inc. (S.P.E.C.)
Quantum Digital Technology
Prism Electronics
Florida Circuit
Bisco
Allen Electronics Distributors
$0.833
$0.724
Aranea Global
$0.859
$0.825
Ampacity Inc.
$1.190
Perfect Parts
GreenTree Electronics
PCT Polyester material provides excellent resistance to heat and chemicals, making this chip carrier socket durable and suitable for a wide range of applications.
Designed specifically for DIP14 devices, ensuring a precise and secure fit, which is crucial for proper functionality in electronic circuits.
Beryllium Copper contacts offer superior conductivity and springiness, resulting in reliable connections with minimal resistance for efficient performance.
With 14 contacts, this socket can accommodate DIP14 ICs, enabling the socket to handle a variety of integrated circuits for versatile use.
The Tin/Lead finish with Nickel barrier provides corrosion resistance and enhances solderability, ensuring stable connections and longevity of the socket.
Being an IC socket, it allows easy insertion and removal of ICs without damaging the pins, facilitating maintenance and testing of the electronic components.
Rectangular contact configuration ensures proper alignment and secure connection, preventing misalignment and ensuring stable electrical connections for optimal performance.
Chip Carrier IC & Component Sockets 110-93-314-41-001000 attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from Mill-max Mfg
Number of Positions or Pins:
Contact Finish - Termination:
Contact Material:
Contact Configuration:
IC Socket Type:
Housing Material:
JESD-609 Code:
Compatible Device Type:
Special Features:
110-93-314-41-001000 Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.90.40.00
SB
Mill-Max Mfg. Corp. is a vertically integrated engineering and manufacturing company capable of producing over 100 million interconnect components a week, making us the largest manufacturer of precision machined interconnect components in North America.
1N4148
Eic Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
2N2222A
Tesla Elektronicke Soucastky
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
SZNUP2105LT1G
Onsemi
SZNUP2105LT1G by Onsemi is a Transient Suppression Device with 2 elements in a common anode configuration. It has a max non-repetitive peak reverse power dissipation of 350W and breakdown voltage of 29.1V. Ideal for applications requiring bidirectional polarity protection, such as automotive electronics and industrial equipment due to its AEC-Q101 compliance and high clamping voltage of 44V.
LM358N
Philips Semiconductors
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
FT232RQ-REEL
FTDI
FTDI's FT232RQ-REEL is a USB bus controller with 32 terminals, operating at 3.3-5.25V. It supports data transfer rates up to 60MBps and clock frequency of 12.02MHz, suitable for RS232/RS422/RS485 interfaces in various applications like industrial automation and communication systems.
MBRS130LT3G
MBRS130LT3G by Onsemi is a Schottky rectifier diode with a max output current of 1A and forward voltage of 0.445V. It operates b/w -65 to 125°C, has a reverse test voltage of 30V, and is ideal for power applications due to its small outline package style.
Surge Components
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Collector Current (IC): .6 A; No. of Terminals: 3;
43025-0400
Molex
The Molex 43025-0400 is a board connector with 4 contacts, 2 rows, and a mating contact pitch of 0.118". It has a body length of 0.27", insulation resistance of 1Gohm, and operates b/w -40 to 105°C. Ideal for commercial applications requiring a female connector with crimp termination and UL94V-0 flammability rating.
Digitron Semiconductors
SMBJ18CA
Fagor Electronica S Coop
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM317T
Comset Semiconductors
Other Regulators; No. of Terminals: 3; Terminal Pitch: 2.54 mm; Minimum Output Voltage-1: 1.2 V; Technology: BIPOLAR; Operating Temperature (TJ-Max): 125 Cel;
BSS123LT1G
BSS123LT1G by Onsemi is a N-CHANNEL FET with 100V DS breakdown voltage, 0.17A drain current, and 6 ohm on resistance. Ideal for switching applications, it operates in enhancement mode with a max power dissipation of 0.225W. It comes in a small outline package with gull wing terminals and can withstand temperatures from -55 to 150°C.
Bay Linear
Other Regulators; No. of Terminals: 3; No. of Outputs: 1; Surface Mount: NO; Maximum Load Regulation (%): 1.5 %; Operating Temperature (TJ-Min): 0 Cel;
LM555CM
Harris Semiconductor
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
Diotec Semiconductor Ag
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Collector Current (IC): .6 A; Maximum Time At Peak Reflow Temperature (s): 10;
BAV99
Siemens
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Analog Devices
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; No. of Functions: 1; Package Body Material: PLASTIC/EPOXY; Surface Mount: NO;
2N7002
General Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; JEDEC-95 Code: TO-236AB; Qualification: Not Qualified; Package Style (Meter): SMALL OUTLINE;
Sipex
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Peak Reflow Temperature (C): 240; Terminal Finish: TIN LEAD;
ABS10-32.768KHZ-T
Abracon
Abracon's ABS10-32.768KHZ-T crystal oscillator offers 20 ppm frequency tolerance, 122% stability, and 70000 ohm series resistance. Ideal for applications requiring precise timing at 0.032768 MHz, such as IoT devices and wearables due to its compact size and low power consumption.
510-93-168-17-101002
Mill-max Mfg
Mill-max Mfg 510-93-168-17-101002 is a Chip Carrier IC Socket with 168 contacts, 2.54mm terminal pitch, and gold over nickel contact finish. It is used on PGA168 devices with rectangular PCB contact pattern and polycyclohexydimethylene terephthalate-polyester housing material.
27E487
TE Connectivity
TE Connectivity's 27E487 is an IC SOCKET with GLASS FILLED POLYESTER housing. It features 8 RND PIN-SKT contacts terminated by SCREW, designed for RELAY applications.
94.54
Finder
Finder's 94.54 is a RELAY SOCKET with 14 SQ PIN-SKT contacts, rated at 10A current. With SNAP ON termination, it operates b/w -25°C to 70°C and withstands up to 2000VAC dielectric voltage. Ideal for Chip Carrier IC & Component Sockets applications.
614-91-964-31-012000
IC SOCKET;
8452-21B1-RK-TP
3m Electronic Products Division
8452-21B1-RK-TP by 3m Electronic Products Division is a chip carrier IC socket with a housing made of glass-filled polyphenylene sulfide. It is used on PLCC52 devices and has a surface mount termination type. With 52 contacts and insulation resistance of 1G ohm, it operates in temperatures ranging from -40 to 105 °C.
315-43-120-41-003000
315-43-120-41-003000 by Mill-max Mfg is a PLASTIC IC SOCKET for SIP20 devices with 20 contacts. It features MATTE TIN OVER NICKEL finish and RECTANGLE contact configuration. Ideal for Chip Carrier IC & Component Sockets applications.
XR2A-6405
Omron
IC SOCKET; Manufacturer Series: XR2;
816-22-057-10-000101
IC SOCKET; Device Type Used On: SIP57; Housing Material: PLASTIC; Additional Features: STANDARD: UL 94V-0; No. of Contacts: 57; Contact Finish (Termination): GOLD OVER NICKEL;
PGA-280
IC SOCKET; Device Type Used On: PGA280; Housing Material: POLYESTER; Manufacturer Series: PGA; Additional Features: STANDARD: UL 94V-0; No. of Contacts: 280;
3334485008
Robert Bosch
RELAY SOCKET; Device Type Used On: RELAY; Mounting Style: STRAIGHT; Body Width: 1.417 inch; No. of Contacts: 5; Body Depth: 1.433 inch;
XR2D-1801-N
IC SOCKET; Contact Material: BERYLLIUM COPPER; JESD-609 Code: e4; Contact Finish (Termination): Gold (Au); Contact Finish (Mating): GOLD (30);
110-87-328-41-001101
Preci-dip Sa
110-87-328-41-001101 by Preci-dip Sa is a DIP28 IC socket with 28 contacts, Beryllium Copper contact material, and Gold Flash finish. It has a PCB contact row spacing of 7.62mm and operates b/w -55°C to 125°C. Ideal for chip carrier applications requiring high insulation resistance and dielectric voltage withstand capabilities.
XR2A-2011-N
IC SOCKET; Device Type Used On: DIP20; No. of Contacts: 20; Contact Finish (Mating): NOT SPECIFIED; JESD-609 Code: e4; Contact Material: NOT SPECIFIED;
SS-104-G-2-N
Samtec
SS-104-G-2-N by Samtec is a Chip Carrier IC Socket with 4 contacts, rated at 1A current. It features a rectangular PCB contact pattern, glass-filled polyester housing material, and gold finish with nickel barrier. Ideal for SIP4 devices, it operates b/w -65°C to 125°C and has a mating contact pitch of 0.1 inch.
173-10-304-00-001000
173-10-304-00-001000 by Mill-max Mfg is a PLASTIC IC SOCKET for DIP4 devices with 4 contacts. Features GOLD OVER NICKEL contact finish, RECTANGLE configuration. Ideal for Chip Carrier IC & Component Sockets applications.
2-1571552-5
TE Connectivity's 2-1571552-5 is a DIP18 IC socket with 18 contacts, rated at 3A current. Featuring a rectangular PCB contact pattern with 7.62mm row spacing, it uses solder termination and has a thermoplastic polyester housing. Ideal for applications requiring a dielectric voltage of 1000VAC and operating temperatures ranging from -55 to 105°C.
2-382401-1
Tyco Electronics Amp
IC SOCKET; Device Type Used On: DIP8; Housing Material: GLASS FILLED POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER; No. of Contacts: 8; Manufacturer Series: 382401;
PY11QN
RELAY SOCKET;
210-93-308-41-001000
210-93-308-41-001000 by Mill-max Mfg is a Chip Carrier IC Socket with PCT Polyester housing and Beryllium Copper contacts. It is designed for DIP8 devices, featuring 8 contacts with Tin/Lead finish. Ideal for applications requiring reliable connection in electronic circuits.
110-93-320-41-801000
Mill-max Mfg's 110-93-320-41-801000 is a Chip Carrier IC Socket with 20 contacts made of Beryllium Copper. It features Tin/Lead finish with Nickel barrier, suitable for DIP20 devices. The rectangular contact configuration and plastic housing make it ideal for various electronic applications.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
110-93-308-41-001000
IC SOCKET; Device Type Used On: DIP8; Housing Material: PCT POLYESTER; Additional Features: DIP SOCKET; Contact Finish (Mating): NOT SPECIFIED; Contact Config: RECTANGLE;
110-99-632-41-001000
IC SOCKET; Device Type Used On: DIP32; Housing Material: POLYETHYLENE; Additional Features: DIP SOCKET; Contact Config: RECTANGLE; Contact Finish (Termination): Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier;
IC SOCKET; Device Type Used On: DIP20; Housing Material: PLASTIC; JESD-609 Code: e0; Contact Material: BERYLLIUM COPPER; Contact Config: RECTANGLE;
110-93-628-41-801000
IC SOCKET; Device Type Used On: DIP28; Housing Material: PLASTIC; Additional Features: LOW PROFILE; Contact Config: RECTANGLE; Contact Material: NOT SPECIFIED;
110-93-314-10-001000
RELAY SOCKET; Device Type Used On: DIP4; Housing Material: PCT POLYESTER; JESD-609 Code: e0; Contact Finish (Mating): NOT SPECIFIED; Contact Finish (Termination): Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier;
110-93-308-41-605000
IC SOCKET; Device Type Used On: DIP8; Housing Material: PLASTIC; No. of Contacts: 8; Contact Config: RECTANGLE; Contact Finish (Termination): Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier;
110-93-320-41-605000
IC SOCKET; Device Type Used On: DIP20; Housing Material: PLASTIC; Contact Finish (Termination): Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier; Contact Finish (Mating): GOLD (30) OVER NICKEL (100); Contact Config: RECTANGLE;
110-91-322-41-001000
IC SOCKET; Device Type Used On: DIP22; Housing Material: POLYETHYLENE; Additional Features: DIP SOCKET; Contact Config: RECTANGLE; JESD-609 Code: e0;
110-99-308-41-001000
IC SOCKET; Device Type Used On: DIP8; Housing Material: POLYETHYLENE; Contact Config: RECTANGLE; Contact Finish (Termination): Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier; Additional Features: DIP SOCKET;
110-93-632-41-001000
IC SOCKET; Device Type Used On: DIP32; Housing Material: POLYETHYLENE; No. of Contacts: 32; Contact Material: BERYLLIUM COPPER; JESD-609 Code: e0;
110-93-964-41-001000
IC SOCKET; Device Type Used On: DIP64; Housing Material: POLYETHYLENE; JESD-609 Code: e0; No. of Contacts: 64; Contact Config: RECTANGLE;
110-93-306-41-001000
IC SOCKET; Device Type Used On: DIP6; Housing Material: POLYETHYLENE; Contact Finish (Mating): GOLD (30) OVER NICKEL (100); Additional Features: DIP SOCKET; Contact Config: RECTANGLE;
110-93-316-41-605000
IC SOCKET; Device Type Used On: DIP16; Housing Material: PLASTIC; Contact Finish (Termination): Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier; Contact Finish (Mating): GOLD (30) OVER NICKEL (100); Additional Features: 94V-0;
110-93-628-41-605000
IC SOCKET; Device Type Used On: DIP28; Housing Material: PLASTIC; JESD-609 Code: e0; Contact Finish (Mating): NOT SPECIFIED; Additional Features: DIP SOCKET;
110-93-314-41-105
IC SOCKET; Device Type Used On: DIP14; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Dielectric Withstanding Voltage (V): 1000VAC; Housing Material: GLASS FILLED POLYETHYLENE POLYESTER;
110-93-314-41-001
110-93-314-41-001100
IC SOCKET; Device Type Used On: DIP14; Housing Material: POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER; Contact Material: NOT SPECIFIED; No. of Contacts: 14; JESD-609 Code: e0;
110-93-314-41-801000
IC SOCKET; Device Type Used On: DIP14; Housing Material: PLASTIC; Contact Finish (Mating): GOLD (30) OVER NICKEL (100); JESD-609 Code: e0; No. of Contacts: 14;
110-93-314-41-105000
IC SOCKET; Device Type Used On: DIP14; Housing Material: PCT POLYESTER; Contact Finish (Mating): NOT SPECIFIED; JESD-609 Code: e0; No. of Contacts: 14;
110-93-314-41-605000
IC SOCKET; Device Type Used On: DIP14; Housing Material: PLASTIC; Contact Material: NOT SPECIFIED; Contact Finish (Mating): GOLD (30) OVER NICKEL (100); JESD-609 Code: e0;
Supply Digital Components
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