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MT40A4G8NEA-062E:F

Micron Technology

MT40A4G8NEA-062E:F by Micron Technology

MT40A4G8NEA-062E:F by Micron Technology is a DDR4 DRAM with 4GX8 organization, operating at up to 1600 MHz. It features a thin profile grid array package, common I/O type, and self-refresh capability. Ideal for applications requiring high-speed synchronous memory with a density of 34 Gb and low power consumption.

Median Price

$71.285

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,120 parts In-Stock

1+ parts

$61.890

100+ parts

$52.949

1k+ parts

-

10k+ parts

-

1,120

$61.890

$52.949

-

-

Arrow

USA . 185 parts In-Stock

1+ parts

$62.750

100+ parts

$45.930

1k+ parts

-

10k+ parts

-

185

$62.750

$45.930

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-

Mouser Electronics

USA . 118 parts In-Stock

1+ parts

$79.820

100+ parts

$65.510

1k+ parts

-

10k+ parts

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118

$79.820

$65.510

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Element14

Singapore . 1,170 parts In-Stock

1+ parts

$363.700

100+ parts

-

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1,170

$363.700

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Farnell

UK . 2,430 parts In-Stock

1+ parts

$381.050

100+ parts

-

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2,430

$381.050

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EBV Elektronik

Germany . 1,260 parts In-Stock

1+ parts

-

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1,260

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Verical

USA . 320 parts In-Stock

1+ parts

-

100+ parts

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$43.202

10k+ parts

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320

-

-

$43.202

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 283 parts In-Stock

1+ parts

$60.030

100+ parts

-

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283

$60.030

-

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Vyrian

USA . 8,069 parts In-Stock

1+ parts

-

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8,069

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Chip Stock

USA . 4,509 parts In-Stock

1+ parts

-

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4,509

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Sensible Micro Corp

USA . 1,694 parts In-Stock

1+ parts

-

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1,694

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Nova Conductors

Japan . 66 parts In-Stock

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66

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 1,360 parts In-Stock

1+ parts

$52.650

100+ parts

-

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10k+ parts

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1,360

$52.650

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Ampacity Inc.

Singapore . 1,715 parts In-Stock

1+ parts

$53.700

100+ parts

-

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1,715

$53.700

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Corphita

USA . 1,225 parts In-Stock

1+ parts

$56.871

100+ parts

-

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1,225

$56.871

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QUARKTWIN TECHNOLOGY LTD

USA . 14,326 parts In-Stock

1+ parts

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14,326

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Argo Parts USA

USA . 3,634 parts In-Stock

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3,634

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GreenTree Electronics

Israel . 1,520 parts In-Stock

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1,520

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Authorized Procurement Solutions

USA . 260 parts In-Stock

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260

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Aranea Global

USA . 100 parts In-Stock

1+ parts

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100+ parts

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100

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Overview

Enhance your device's speed and performance with the MT40A4G8NEA-062E:F from Micron Technology. As a leading manufacturer in the industry, Micron Technology ensures top-notch quality and reliability in their DRAM products. Ideal for various applications, this DDR4 DRAM offers exceptional value by providing faster data access speeds, improved multitasking capabilities, and energy efficiency. Upgrade your system with Micron Technology's MT40A4G8NEA-062E:F to experience seamless performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the DRAM.

Operating Mode: SYNCHRONOUS

Allows for precise data transfer and synchronization, increasing overall performance.

Nominal Supply Voltage / Vsup (V): 1.2

Efficiently powers the DRAM while maintaining stable performance.

Maximum Clock Frequency (fCLK): 1600 MHz

Enables high-speed data processing and enhances system responsiveness.

Memory IC Type: DDR4 DRAM

Utilizes the latest DDR4 technology for faster data transfer speeds and improved efficiency.

Technical Specifications

DRAM MT40A4G8NEA-062E:F attributes and parameters. Explore more DRAM devices from Micron Technology

Specs

Access Mode:

MULTI BANK PAGE BURST

Maximum Clock Frequency (fCLK):

1600 MHz

Input/Output Type:

COMMON

JESD-30 Code:

R-PBGA-B78

Length:

11 mm

Memory Density:

34359738368 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

78

No. of Words:

4294967296 words

No. of Words Code:

4G

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

0 Cel

Organization:

4GX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA78,9X11,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Refresh Cycles:

Maximum Seated Height:

1.2 mm

Self Refresh:

YES

Maximum Supply Current:

205 mA

Maximum Supply Voltage (Vsup):

1.26 V

Minimum Supply Voltage (Vsup):

1.14 V

Nominal Supply Voltage / Vsup (V):

1.2

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

MT40A4G8NEA-062E:F Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.36

SB

8542.32.00.23

Manufacturer Highlights

Micron Technology

Micron Technology, Inc. is a leading provider of cutting-edge semiconductor solutions and products, based in Boise, Idaho. Founded in 1978, the company manufactures dynamic random-access memory (DRAM), flash memory, USB flash drives and other storage solutions used by a wide range of businesses and consumers around the world. With more than 35,000 employees worldwide and a $20 billion market capitalization as of 2019, Micron has remained at the forefront of technological innovation for over 40 years. The company's products are used in enterprise applications such as networking and data centers; mobile computing devices including smartphones and tablets; personal computers; automotive electronics; embedded systems; gaming consoles; imaging systems; industrial manufacturing processes; medical devices; military systems and more.

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Management team

President, CEO

Sanjay Mehrotra

Executive VP, CFO

Mark J. Murphy

Executive VP, CBO

Sumit Sadana

Manufacturer fab locations 23

Fab name Location Fab Initiation Wafer Capacity

Fab 4

Fabrication

Fab Initiation

1994

USA

Boise

Wafer Capacity

8,750

1994

8,750

Fab 6

Fabrication

Fab Initiation

1997

USA

Manassas

Wafer Capacity

23,000

1997

23,000

Fab 6

Fabrication

Fab Initiation

2006

USA

Manassas

Wafer Capacity

28,000

2006

28,000

Fab 11

Fabrication

Fab Initiation

2007

Taiwan

Taoyuan

Wafer Capacity

34,000

2007

34,000

Fab 16 A1

Fabrication

Fab Initiation

2007

Taiwan

Taichung

Wafer Capacity

50,000

2007

50,000

Fab 16 A3

Fabrication

Fab Initiation

2021

Taiwan

Taichung

Wafer Capacity

3,000

2021

3,000

Fab 15

Fabrication

Fab Initiation

2002

Japan

Hiroshima

Wafer Capacity

98,000

2002

98,000

Fab 11

Fabrication

Fab Initiation

2004

Taiwan

Taoyuan

Wafer Capacity

34,000

2004

34,000

New Hiroshima DRAM Fab

Fabrication

Fab Initiation

-

Japan

Hiroshima

Wafer Capacity

-

Fab 4

Fabrication

Fab Initiation

2017

USA

Boise

Wafer Capacity

11,750

2017

11,750

Fab 10W

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

20,000

2016

20,000

Fab 10X

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

55,000

2016

55,000

Fab 15

Fabrication

Fab Initiation

2019

Japan

Hiroshima

Wafer Capacity

18,000

2019

18,000

Fab 10A

Fabrication

Fab Initiation

2019

Singapore

Singapore

Wafer Capacity

18,000

2019

18,000

Fab 10N

Fabrication

Fab Initiation

2014

Singapore

Singapore

Wafer Capacity

47,000

2014

47,000

Fab 11

Fabrication

Fab Initiation

2000

Taiwan

Taoyuan

Wafer Capacity

32,000

2000

32,000

Fab 4

Fabrication

Fab Initiation

2012

USA

Boise

Wafer Capacity

6,000

2012

6,000

Fab 16 A2

Fabrication

Fab Initiation

2015

Taiwan

Taichung

Wafer Capacity

43,000

2015

43,000

New Clay Fab Phase 1

Fabrication

Fab Initiation

2027

USA

Clay

Wafer Capacity

2027

New Boise Fab 1

Fabrication

Fab Initiation

2025

USA

Boise

Wafer Capacity

2025

Fab 15

Fabrication

Fab Initiation

2021

Japan

Hiroshima

Wafer Capacity

2021

Fab 16 A5

Fabrication

Fab Initiation

2028

Taiwan

Taichung

Wafer Capacity

2028

Expansion Fab

Fabrication

Fab Initiation

2020

USA

Manassas

Wafer Capacity

6,000

2020

6,000

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