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M45PE80-VMP6TG

Micron Technology

M45PE80-VMP6TG by Micron Technology

FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: VSON; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 3;

Median Price

$1.815

Lifecycle Status

Suppliers In-Stock

18

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 260,000 parts In-Stock

1+ parts

$1.740

100+ parts

-

1k+ parts

$1.190

10k+ parts

$1.030

260,000

$1.740

-

$1.190

$1.030

DigiKey

USA . 43 parts In-Stock

1+ parts

$1.890

100+ parts

$1.598

1k+ parts

-

10k+ parts

$1.307

43

$1.890

$1.598

-

$1.307

Mouser Electronics

USA . 1,371 parts In-Stock

1+ parts

$2.080

100+ parts

$1.810

1k+ parts

$1.670

10k+ parts

$1.620

1,371

$2.080

$1.810

$1.670

$1.620

Verical

USA . 260,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

$1.030

260,000

-

-

-

$1.030

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 5,077 parts In-Stock

1+ parts

$1.653

100+ parts

-

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5,077

$1.653

-

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Vyrian

USA . 132,689 parts In-Stock

1+ parts

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132,689

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Kruse

Germany . 72,000 parts In-Stock

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Kruse Electronics AG

Switzerland . 60,000 parts In-Stock

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60,000

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ARCO, INC.

USA . 56,000 parts In-Stock

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56,000

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Chip Stock

USA . 16,670 parts In-Stock

1+ parts

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16,670

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Dan-Mar Components

USA . 5,897 parts In-Stock

1+ parts

-

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5,897

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-

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Bristol Electronics

USA . 5,612 parts In-Stock

1+ parts

-

100+ parts

$1.500

1k+ parts

$0.792

10k+ parts

-

5,612

-

$1.500

$0.792

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Greenchips

USA . 5,413 parts In-Stock

1+ parts

-

100+ parts

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5,413

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Dynamic Solutions

Germany . 4,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,000

-

-

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ACDS - Activité Composants Distribution Service

France . 4,000 parts In-Stock

1+ parts

-

100+ parts

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4,000

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Anansix

USA . 2,583 parts In-Stock

1+ parts

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100+ parts

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2,583

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Nova Conductors

Japan . 450 parts In-Stock

1+ parts

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450

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Connect4Technologies Inc.

Canada . 15 parts In-Stock

1+ parts

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15

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Stockers USA

USA . 587,727 parts In-Stock

1+ parts

$0.420

100+ parts

$0.420

1k+ parts

$0.420

10k+ parts

$0.390

587,727

$0.420

$0.420

$0.420

$0.390

Corphita

USA . 4,767 parts In-Stock

1+ parts

$1.566

100+ parts

-

1k+ parts

-

10k+ parts

-

4,767

$1.566

-

-

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IDEA Electronic Components Group

UK . 966 parts In-Stock

1+ parts

$2.536

100+ parts

-

1k+ parts

$2.282

10k+ parts

-

966

$2.536

-

$2.282

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MKK Technologies

India . 739 parts In-Stock

1+ parts

$4.768

100+ parts

-

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739

$4.768

-

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DigiPath Technology Company

USA . 739 parts In-Stock

1+ parts

$4.768

100+ parts

-

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739

$4.768

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Perfect Parts

USA . 73,490 parts In-Stock

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73,490

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SIE Connect GmbH (Excess)

Germany . 46,810 parts In-Stock

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46,810

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S.R.D Solutions

India . 30,000 parts In-Stock

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RC Electronics

USA . 19,941 parts In-Stock

1+ parts

-

100+ parts

$1.510

1k+ parts

$1.420

10k+ parts

$1.390

19,941

-

$1.510

$1.420

$1.390

Speed Components Ltd (Excess)

Israel . 18,000 parts In-Stock

1+ parts

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18,000

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Assy Fe

Spain . 6,716 parts In-Stock

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6,716

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Kepictronics

USA . 5,000 parts In-Stock

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5,000

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Argo Parts USA

USA . 4,110 parts In-Stock

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4,110

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GreenTree Electronics

Israel . 3,671 parts In-Stock

1+ parts

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3,671

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A-Z Elektronik GmbH

Germany . 2,237 parts In-Stock

1+ parts

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2,237

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Alle Elektronik GmbH

Germany . 1,491 parts In-Stock

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1,491

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Continental Prestige Electronics

USA . 777 parts In-Stock

1+ parts

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777

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Authorized Procurement Solutions

USA . 435 parts In-Stock

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435

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Bastille Electronics

Australia . 300 parts In-Stock

1+ parts

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300

-

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Parana Technologies

USA . 162 parts In-Stock

1+ parts

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100+ parts

$3.032

1k+ parts

-

10k+ parts

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162

-

$3.032

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-

Technical Specifications

Flash Memory M45PE80-VMP6TG attributes and parameters. Explore more Flash Memory devices from Micron Technology

Specs

Maximum Clock Frequency (fCLK):

50 MHz

Minimum Data Retention Time:

20

Endurance:

100000 Write/Erase Cycles

JESD-30 Code:

R-XDSO-N8

Length:

6 mm

Memory Density:

8388608 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

8

No. of Words:

1048576 words

No. of Words Code:

1M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

1MX8

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SOLCC8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/3.3

Programming Voltage (V):

2.7

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.00001 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

15 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Type:

NOR TYPE

Width:

5 mm

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

M45PE80-VMP6TG Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Micron Technology

Micron Technology, Inc. is a leading provider of cutting-edge semiconductor solutions and products, based in Boise, Idaho. Founded in 1978, the company manufactures dynamic random-access memory (DRAM), flash memory, USB flash drives and other storage solutions used by a wide range of businesses and consumers around the world. With more than 35,000 employees worldwide and a $20 billion market capitalization as of 2019, Micron has remained at the forefront of technological innovation for over 40 years. The company's products are used in enterprise applications such as networking and data centers; mobile computing devices including smartphones and tablets; personal computers; automotive electronics; embedded systems; gaming consoles; imaging systems; industrial manufacturing processes; medical devices; military systems and more.

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Management team

President, CEO

Sanjay Mehrotra

Executive VP, CFO

Mark J. Murphy

Executive VP, CBO

Sumit Sadana

Manufacturer fab locations 23

Fab name Location Fab Initiation Wafer Capacity

Fab 4

Fabrication

Fab Initiation

1994

USA

Boise

Wafer Capacity

8,750

1994

8,750

Fab 6

Fabrication

Fab Initiation

1997

USA

Manassas

Wafer Capacity

23,000

1997

23,000

Fab 6

Fabrication

Fab Initiation

2006

USA

Manassas

Wafer Capacity

28,000

2006

28,000

Fab 11

Fabrication

Fab Initiation

2007

Taiwan

Taoyuan

Wafer Capacity

34,000

2007

34,000

Fab 16 A1

Fabrication

Fab Initiation

2007

Taiwan

Taichung

Wafer Capacity

50,000

2007

50,000

Fab 16 A3

Fabrication

Fab Initiation

2021

Taiwan

Taichung

Wafer Capacity

3,000

2021

3,000

Fab 15

Fabrication

Fab Initiation

2002

Japan

Hiroshima

Wafer Capacity

98,000

2002

98,000

Fab 11

Fabrication

Fab Initiation

2004

Taiwan

Taoyuan

Wafer Capacity

34,000

2004

34,000

New Hiroshima DRAM Fab

Fabrication

Fab Initiation

-

Japan

Hiroshima

Wafer Capacity

-

Fab 4

Fabrication

Fab Initiation

2017

USA

Boise

Wafer Capacity

11,750

2017

11,750

Fab 10W

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

20,000

2016

20,000

Fab 10X

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

55,000

2016

55,000

Fab 15

Fabrication

Fab Initiation

2019

Japan

Hiroshima

Wafer Capacity

18,000

2019

18,000

Fab 10A

Fabrication

Fab Initiation

2019

Singapore

Singapore

Wafer Capacity

18,000

2019

18,000

Fab 10N

Fabrication

Fab Initiation

2014

Singapore

Singapore

Wafer Capacity

47,000

2014

47,000

Fab 11

Fabrication

Fab Initiation

2000

Taiwan

Taoyuan

Wafer Capacity

32,000

2000

32,000

Fab 4

Fabrication

Fab Initiation

2012

USA

Boise

Wafer Capacity

6,000

2012

6,000

Fab 16 A2

Fabrication

Fab Initiation

2015

Taiwan

Taichung

Wafer Capacity

43,000

2015

43,000

New Clay Fab Phase 1

Fabrication

Fab Initiation

2027

USA

Clay

Wafer Capacity

2027

New Boise Fab 1

Fabrication

Fab Initiation

2025

USA

Boise

Wafer Capacity

2025

Fab 15

Fabrication

Fab Initiation

2021

Japan

Hiroshima

Wafer Capacity

2021

Fab 16 A5

Fabrication

Fab Initiation

2028

Taiwan

Taichung

Wafer Capacity

2028

Expansion Fab

Fabrication

Fab Initiation

2020

USA

Manassas

Wafer Capacity

6,000

2020

6,000

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