Loading...

M45PE16-VMP6TP

STMicroelectronics

M45PE16-VMP6TP by STMicroelectronics

M45PE16-VMP6TP by STMicroelectronics is a NOR flash memory with a 16M x 1 organization, operating at 3V and supporting SPI for fast data transfer. It features a max clock frequency of 50 MHz and offers hardware/software write protection. Ideal for industrial applications, it operates in extreme temperatures from -40 °C to 85°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,026 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,026

-

-

-

-

Vyrian

USA . 2,218 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,218

-

-

-

-

Anansix

USA . 576 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

576

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,051 parts In-Stock

1+ parts

$3.697

100+ parts

-

1k+ parts

$3.327

10k+ parts

-

2,051

$3.697

-

$3.327

-

MKK Technologies

India . 308 parts In-Stock

1+ parts

$6.951

100+ parts

-

1k+ parts

-

10k+ parts

-

308

$6.951

-

-

-

DigiPath Technology Company

USA . 308 parts In-Stock

1+ parts

$6.951

100+ parts

-

1k+ parts

-

10k+ parts

-

308

$6.951

-

-

-

Corphita

USA . 1,894 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,894

-

-

-

-

Parana Technologies

USA . 607 parts In-Stock

1+ parts

-

100+ parts

$4.420

1k+ parts

-

10k+ parts

-

607

-

$4.420

-

-

Overview

Unlock exceptional performance and reliability with the M45PE16-VMP6TP Flash Memory from STMicroelectronics, a leader in innovative semiconductor solutions. This compact, high-speed memory is designed for diverse applications, ensuring durability even in extreme temperatures. With robust write protection and impressive endurance, it delivers peace of mind and efficiency for your projects. Choose STMicroelectronics for superior quality—your key to success in a fast-evolving tech landscape!

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for compact and efficient integration into a variety of electronic devices.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space utilization and fits well in various PCB layouts.

Operating Mode: SYNCHRONOUS

Synchronous operation enables faster data transfer rates, making this product suitable for high-speed applications.

Nominal Supply Voltage / Vsup: 3 V

Operating at a nominal voltage of 3V improves compatibility with most modern digital circuits.

Power Supplies (V): 3/3.3

Supports both 3V and 3.3V power supplies, enhancing versatility in varied electronic environments.

No. of Terminals: 8

With 8 terminals, this component provides a balance between simplicity and functionality for circuitry.

Package Style (Meter): CHIP CARRIER, VERY THIN PROFILE

The very thin profile allows for high-density mounting on PCBs, accommodating space-constrained designs.

Maximum Operating Temperature: 85 °C

A high maximum operating temperature makes this product suitable for industrial applications where heat may be a concern.

Organization: 16MX1

The memory organization of 16MX1 offers efficient storage and retrieval capabilities for embedded systems.

Minimum Operating Temperature: -40 °C

Operating at temperatures as low as -40 °C ensures reliability in extreme cold environments.

Terminal Position: QUAD

Quad terminal positioning facilitates easier routing on a PCB, enhancing performance and connectivity.

Write Protection: HARDWARE/SOFTWARE

Dual write protection options provide enhanced data security and integrity, crucial for critical applications.

Maximum Seated Height: 1 mm

The low seated height contributes to the overall slim profile of devices, aiding in portable and compact designs.

Maximum Clock Frequency (fCLK): 50 MHz

A maximum clock frequency of 50 MHz allows for rapid data transfer, beneficial for high-speed applications.

Width: 5 mm

A compact width makes this flash memory ideal for space-constrained devices without compromising capacity.

Minimum Supply Voltage (Vsup): 2.7 V

The minimum supply voltage of 2.7V supports applications that require efficient power management.

Type: NOR TYPE

NOR type flash memory provides faster read speeds and random access capabilities compared to NAND flash.

Length: 6 mm

The 6 mm length allows for efficient use of space on printed circuit boards.

Programming Voltage (V): 2.7

The low programming voltage simplifies handling and reduces potential stress on the device.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this flash memory can withstand harsh operational environments.

Technology: CMOS

CMOS technology contributes to lower power consumption and higher performance characteristics.

Parallel or Serial: SERIAL

Serial communication reduces pin count, allowing for simpler and more cost-effective circuit design.

Terminal Form: NO LEAD

No lead design enhances environmental compliance and minimizes the risk of lead-related issues.

Maximum Supply Current: 15 mA

A maximum supply current of 15 mA ensures efficient power usage, extending battery life in portable devices.

No. of Words: 16777216 words

With 16,777,216 words of memory, this product provides significant storage capacity for applications.

Minimum Data Retention Time: 20

A minimum data retention time of 20 years ensures long-term reliability and data integrity.

Terminal Pitch: 1.27 mm

The standard terminal pitch allows for compatibility with a wide range of PCB designs and layouts.

No. of Words Code: 16M

With a coding capacity of 16M words, this flash memory is suitable for various data-intensive applications.

Maximum Supply Voltage (Vsup): 3.6 V

Supports a maximum supply voltage of 3.6V, ensuring flexibility in system design.

Endurance: 100000 Write/Erase Cycles

An endurance of 100,000 cycles makes this product highly reliable for frequent data storage operations.

Serial Bus Type: SPI

Using SPI communication enables fast data exchange and simplifies interface design.

Memory Density: 16777216 bit

A memory density of 16,777,216 bits delivers ample space for a variety of applications.

Memory IC Type: FLASH

As a flash memory IC, this device offers the advantages of non-volatile storage and quick access times.

Maximum Standby Current: 0.00005 Amp

A very low maximum standby current enhances power efficiency, making it ideal for battery-powered applications.

Technical Specifications

Flash Memory M45PE16-VMP6TP attributes and parameters. Explore more Flash Memory devices from STMicroelectronics

Specs

Maximum Clock Frequency (fCLK):

50 MHz

Minimum Data Retention Time:

20

Endurance:

100000 Write/Erase Cycles

JESD-30 Code:

R-XQCC-N8

Length:

6 mm

Memory Density:

16777216 bit

Memory IC Type:

Memory Width:

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

16777216 words

No. of Words Code:

16M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

16MX1

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SOLCC8,.25

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3/3.3

Programming Voltage (V):

2.7

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.00005 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

15 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Type:

NOR TYPE

Width:

5 mm

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

M45PE16-VMP6TP Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20