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VP0550N3-G-P013

Microchip Technology

VP0550N3-G-P013 by Microchip Technology

VP0550N3-G-P013 by Microchip Technology is a P-CHANNEL FET with 500V DS Breakdown Voltage. It's used for SWITCHING applications, featuring 0.054A ID and 125Ω RDS(on). The transistor has a built-in diode, operates in ENHANCEMENT MODE, and has 10pF Crss.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Adafruit Industries

USA . 327 parts In-Stock

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Vyrian

USA . 7,180 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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Corohmni

South Africa . 126 parts In-Stock

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$0.405

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Aztec Data Supply Inc.

USA . 4,848 parts In-Stock

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$1.516

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AZTECH Wire

Italy . 1,015 parts In-Stock

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Ampacity Inc.

Singapore . 327 parts In-Stock

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$40.050

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Fulton Briggs Corp.

USA . 7,183 parts In-Stock

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Argo Parts USA

USA . 6,127 parts In-Stock

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Continental Prestige Electronics

USA . 6,113 parts In-Stock

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Aranea Global

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Advanced Electronics

New Zealand . 327 parts In-Stock

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Overview

Enhance your electronic projects with the VP0550N3-G-P013 by Microchip Technology, a high-quality Small Signal Field Effect Transistor that offers exceptional performance and reliability. With its P-CHANNEL configuration and built-in diode, this transistor is perfect for switching applications. Its 500V minimum DS breakdown voltage ensures durability, while its low on-resistance and feedback capacitance provide efficiency. Trust in Microchip's expertise in semiconductor technology to deliver a product that meets your needs. Upgrade your designs today with the VP0550N3-G-P013 and experience the value it brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material makes the transistor light-weight and durable, making it ideal for applications where weight and size constraints are important.

Polarity or Channel Type: P-CHANNEL

P-channel transistors are known for their lower ON-resistance and higher mobility compared to N-channel transistors, resulting in better performance in switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for reverse current protection and simplifies circuit design, making the transistor versatile and easy to use in various applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor offers fast switch-on and switch-off times, making it efficient for controlling current flow in electronic circuits.

Minimum DS Breakdown Voltage: 500 V

With a high breakdown voltage of 500V, this transistor can handle high voltage applications with ease, providing reliable and stable performance in demanding environments.

Transistor Element Material: SILICON

Silicon is a widely used semiconductor material known for its high thermal conductivity and low power consumption, ensuring efficient operation and long-term reliability of the transistor.

Maximum Drain Current (ID): 0.054 A

With a maximum drain current of 0.054A, this transistor can handle moderate current loads, making it suitable for various low-power applications.

Maximum Drain-Source On Resistance: 125 ohm

The low drain-source ON resistance of 125 ohm minimizes power dissipation and voltage drop across the transistor, resulting in improved efficiency and performance in circuit applications.

Maximum Feedback Capacitance (Crss): 10 pF

The low feedback capacitance of 10 pF reduces signal distortion and ensures stable performance at high frequencies, making this transistor suitable for high-speed switching applications.

Technical Specifications

Small Signal Field Effect Transistors (FET) VP0550N3-G-P013 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Microchip Technology

Specs

Minimum DS Breakdown Voltage:

500 V

Maximum Drain Current (ID):

.054 A

Maximum Drain-Source On Resistance:

125 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

10 pF

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Polarity or Channel Type:

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

BOTTOM

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

VP0550N3-G-P013 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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