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VP0550N3-G

Microchip Technology

VP0550N3-G by Microchip Technology

VP0550N3-G by Microchip Technology is a P-CHANNEL FET with 500V DS Breakdown Voltage. Ideal for SWITCHING applications, it features SINGLE configuration with BUILT-IN DIODE and operates in ENHANCEMENT MODE. With 1W power dissipation, -55 to 150 °C operating temp range, and 125 ohm Drain-Source On Resistance, it's a versatile choice for various electronic designs.

Median Price

$1.030

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 214 parts In-Stock

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$1.030

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Microchip Technology

USA . 20,000 parts In-Stock

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$2.200

100+ parts

$1.670

1k+ parts

$1.380

10k+ parts

$1.280

20,000

$2.200

$1.670

$1.380

$1.280

Mouser Electronics

USA . 1,419 parts In-Stock

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$2.200

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Verical

USA . 512 parts In-Stock

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$0.708

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Master Electronics

USA . 390 parts In-Stock

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$0.994

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$0.924

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$0.901

390

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$0.994

$0.924

$0.901

Distributors (In-Stock)

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TME

Poland . 512 parts In-Stock

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$0.540

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NAC Semi

USA . 16,000 parts In-Stock

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$1.280

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$1.150

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$1.040

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$1.280

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IBS Electronics

USA . 465 parts In-Stock

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$1.394

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$1.296

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$1.254

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EPE Components Inc.

USA . 308 parts In-Stock

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Bristol Electronics

USA . 308 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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Ampacity Inc.

Singapore . 516 parts In-Stock

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$1.020

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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RGB Technical Solutions

Ukraine . 2,789 parts In-Stock

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Aranea Global

USA . 500 parts In-Stock

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Perfect Parts

USA . 227 parts In-Stock

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Overview

Elevate your electronic designs with the VP0550N3-G by Microchip Technology. As a leading manufacturer in the industry, Microchip ensures top-quality components that deliver superior performance and reliability. This Small Signal Field Effect Transistor (FET) is perfect for switching applications, offering a minimum DS breakdown voltage of 500V and a maximum power dissipation of 1W. With its P-Channel configuration and built-in diode, this transistor provides enhanced efficiency and functionality. Trust Microchip to provide innovative solutions that meet your needs and exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the transistor, making it suitable for a variety of applications.

Polarity or Channel Type: P-CHANNEL

Allows for efficient switching operations in electronic circuits.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design by incorporating a diode within the transistor package.

Transistor Application: SWITCHING

Designed for efficient switching applications in electronic systems.

Minimum DS Breakdown Voltage: 500 V

Provides a high level of breakdown voltage, ensuring reliability in high-voltage applications.

No. of Terminals: 3

Simple and straightforward to use in circuit connections.

Maximum Power Dissipation (Abs): 1 W

Can handle up to 1 watt of power dissipation, suitable for various low-power applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Utilizes modern MOSFET technology for efficient and reliable performance.

Maximum Operating Temperature: 150 °C

Can operate at high temperatures without performance degradation.

Minimum Operating Temperature: -55 °C

Has a wide operating temperature range, suitable for diverse environments.

Maximum Drain Current (ID): 0.054 A

Capable of handling up to 0.054 amps of drain current.

Maximum Drain-Source On Resistance: 125 ohm

Features low on-resistance for efficient power transfer in circuits.

Maximum Feedback Capacitance (Crss): 10 pF

Low feedback capacitance helps in minimizing signal distortion in switching applications.

Technical Specifications

Small Signal Field Effect Transistors (FET) VP0550N3-G attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Microchip Technology

Specs

Minimum DS Breakdown Voltage:

500 V

Maximum Drain Current (ID):

.054 A

Maximum Drain-Source On Resistance:

125 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

10 pF

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

1 W

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

BOTTOM

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

VP0550N3-G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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