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PIC24EP128MC206-E/PT

Microchip Technology

PIC24EP128MC206-E/PT by Microchip Technology

PIC24EP128MC206-E/PT by Microchip: 16-bit DSP with 60 MHz clock, 3.3V supply, and -40 to 125°C temp range. Ideal for automotive applications, featuring FLASH ROM, 5 timers, and 4 DMA channels for efficient digital signal processing.

Median Price

$3.850

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 65 parts In-Stock

1+ parts

$3.850

100+ parts

-

1k+ parts

-

10k+ parts

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65

$3.850

-

-

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Vyrian

USA . 424 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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424

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Netroflash

USA . 100 parts In-Stock

1+ parts

$3.850

100+ parts

-

1k+ parts

-

10k+ parts

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100

$3.850

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-

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Ampacity Inc.

Singapore . 557 parts In-Stock

1+ parts

$11.000

100+ parts

-

1k+ parts

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10k+ parts

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557

$11.000

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AZTECH Wire

Italy . 195 parts In-Stock

1+ parts

$11.986

100+ parts

-

1k+ parts

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195

$11.986

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-

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XL Components Corporation

Australia . 8,140 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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8,140

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-

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Marpe Global Electronics

Taiwan . 4,155 parts In-Stock

1+ parts

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4,155

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QualityLine Systems

Poland . 2,804 parts In-Stock

1+ parts

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100+ parts

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2,804

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Microchip USA

USA . 2,462 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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2,462

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Overview

Experience unparalleled performance and reliability with the PIC24EP128MC206-E/PT by Microchip Technology. As a leader in digital signal processors, Microchip delivers cutting-edge technology that maximizes efficiency and functionality. Whether you're working on automotive applications or industrial controls, this product offers exceptional value with its 16-bit architecture, high clock frequency, and low power consumption. Trust in the quality and innovation of Microchip Technology to take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the components inside, ensuring long-term reliability.

Surface Mount: YES

Being surface mountable makes installation easier and allows for more compact designs, saving space on the circuit board.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power supply options and compatibility with various systems.

Bit Size: 16

With a 16-bit architecture, this DSP can handle complex calculations and processing tasks with high precision and efficiency.

Power Supplies (V): 3.3

The 3.3V power supply ensures efficient performance while still being compatible with common power sources.

No. of Terminals: 64

Having 64 terminals provides ample connectivity options for interfacing with other components and peripherals in the system.

Minimum Operating Temperature: -40 °C

The wide operating temperature range enables this DSP to function reliably in harsh environments or extreme temperature conditions.

Maximum Clock Frequency: 60 MHz

With a maximum clock frequency of 60 MHz, this DSP can handle high-speed processing tasks efficiently.

Technology: CMOS

The CMOS technology used in this DSP allows for low power consumption, reducing energy costs and heat generation.

ROM Programmability: FLASH

The flash ROM programmability feature allows for easy and flexible updates to the firmware, improving versatility and customization options.

Technical Specifications

Digital Signal Processors (DSPs) PIC24EP128MC206-E/PT attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

60 MHz

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

4

No. of Terminals:

64

No. of Timers:

5

On Chip Program ROM Width:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Sub-Category:

Microcontrollers

Maximum Supply Current:

150 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

10 mm

Trade Compliance

PIC24EP128MC206-E/PT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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