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M2GL005-VF256IX417

Microchip Technology

M2GL005-VF256IX417 by Microchip Technology

M2GL005-VF256IX417 by Microchip Technology is a Field Programmable Gate Array (FPGA) with 161 inputs and outputs. Operating at temperatures from -40 to 100°C, it has a low profile package style with 0.8mm terminal pitch. Ideal for industrial applications requiring high-density programmable logic solutions.

Median Price

$28.639

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IBS Electronics

USA . 136 parts In-Stock

1+ parts

$28.639

100+ parts

$23.183

1k+ parts

$22.875

10k+ parts

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136

$28.639

$23.183

$22.875

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Vyrian

USA . 873 parts In-Stock

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873

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Nova Conductors

Japan . 870 parts In-Stock

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870

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Digiode

USA . 167 parts In-Stock

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167

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Distributors (Availability)

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AZTECH Wire

Italy . 285 parts In-Stock

1+ parts

$8.136

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285

$8.136

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Ampacity Inc.

Singapore . 718 parts In-Stock

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$26.000

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718

$26.000

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Semicontronic

India . 392 parts In-Stock

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$33.000

100+ parts

$32.175

1k+ parts

$32.010

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392

$33.000

$32.175

$32.010

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RGB Technical Solutions

Ukraine . 5,957 parts In-Stock

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5,957

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Corphita

USA . 464 parts In-Stock

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464

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Aranea Global

USA . 100 parts In-Stock

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100

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Overview

Unleash the power of cutting-edge technology with the M2GL005-VF256IX417 by Microchip Technology. As a leading manufacturer in the field programmable gate arrays (FPGA) category, this product offers unparalleled quality and performance. With a wide range of applications, this FPGA is versatile and reliable for any project. Experience the value and benefits of this innovative product, from its low profile package body material to its fine pitch package style. Elevate your projects with the advantages and efficiency that only Microchip Technology can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a durable and cost-effective packaging option for the FPGA.

Surface Mount: YES

Allows for easy and efficient installation on a PCB.

Maximum Supply Voltage: 1.26 V

Ensures stable and reliable operation within specified voltage range.

No. of Inputs: 161

Offers a high number of inputs for flexibility in design and functionality.

Package Shape: SQUARE

Helps in optimizing space on the PCB and enables easy alignment.

Form Of Terminal: BALL

Enhances connectivity and provides reliable contact with the PCB.

Nominal Supply Voltage (V): 1.2

Ideal supply voltage for efficient performance of the FPGA.

No. of Terminals: 256

Offers ample terminals for connecting to other components and peripherals.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Allows for flexibility in programming and customization based on application requirements.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Enables compact and low-profile design of the FPGA for space-constrained applications.

Minimum Supply Voltage: 1.14 V

Provides a range of supply voltage for stability and efficiency.

Maximum Operating Temperature: 100 °C

Can operate in high-temperature environments typical of industrial applications.

Pitch Of Terminal: 0.8 mm

Offers a fine pitch for efficient connection and layout on the PCB.

Minimum Operating Temperature: -40 °C

Can operate in low-temperature conditions without issues.

Position Of Terminal: BOTTOM

Allows for easy access and connection to the PCB.

Maximum Seated Height: 1.56 mm

Low profile design for space optimization and compatibility with different board configurations.

Width: 14 mm

Compact width for efficient integration into the PCB layout.

No. of Outputs: 161

Balanced number of outputs to match the high number of inputs for effective signal processing.

Length: 14 mm

Compact length for efficient board space utilization.

Grading Of Temperature: INDUSTRIAL

Suitable for industrial applications with wide temperature ranges and harsh conditions.

Technical Specifications

Field Programmable Gate Arrays (FPGA) M2GL005-VF256IX417 attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of Inputs:

161

No. of Outputs:

161

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

14 mm

Width:

14 mm

Maximum Seated Height:

1.56 mm

Package Equivalence Code:

BGA256,16X16,32

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

.8 mm

No. of Terminals:

256

Standards

JESD-30 Code:

S-PBGA-B256

Trade Compliance

M2GL005-VF256IX417 Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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