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M2GL010T-1FGG484I

Microchip Technology

M2GL010T-1FGG484I by Microchip Technology

Microchip Technology's M2GL010T-1FGG484I is a 12084 logic cell FPGA with 233 inputs/outputs. Operating at 1.2V, it has a temperature range of -40 to 100°C and uses a grid array package style. Ideal for industrial applications requiring high-performance programmable ICs in compact form factors.

Median Price

$58.500

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 94 parts In-Stock

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$58.500

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$53.170

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$53.110

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DigiKey

USA . 25 parts In-Stock

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$58.500

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$53.180

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Microchip Technology

USA . 2 parts In-Stock

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$58.500

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$53.180

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$31.740

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Distributors (In-Stock)

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Digiode

USA . 304 parts In-Stock

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$55.575

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304

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NAC Semi

USA . 2 parts In-Stock

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$58.500

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$53.880

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$49.940

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Nova Conductors

Japan . 100 parts In-Stock

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$61.422

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Vyrian

USA . 5,272 parts In-Stock

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Chip Stock

USA . 683 parts In-Stock

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AZTECH Wire

Italy . 569 parts In-Stock

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$7.114

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Ampacity Inc.

Singapore . 65 parts In-Stock

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$49.730

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Semicontronic

India . 65 parts In-Stock

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$49.730

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$48.487

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$48.238

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Corphita

USA . 169 parts In-Stock

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$52.650

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Continental Prestige Electronics

USA . 995 parts In-Stock

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$61.422

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$60.194

995

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Netroflash

USA . 100 parts In-Stock

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$61.422

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$60.194

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XL Components Corporation

Australia . 7,904 parts In-Stock

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Marpe Global Electronics

Taiwan . 6,119 parts In-Stock

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Argo Parts USA

USA . 3,726 parts In-Stock

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QualityLine Systems

Poland . 3,659 parts In-Stock

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Overview

Looking for a reliable FPGA solution? Look no further than the M2GL010T-1FGG484I by Microchip Technology! With over 12000 logic cells and 233 inputs/outputs, this FPGA is perfect for a wide range of applications. From industrial automation to telecommunications, this versatile device offers exceptional performance and flexibility. Trust in Microchip's reputation for quality and innovation, and unlock endless possibilities with the M2GL010T-1FGG484I. Upgrade your systems today and experience the benefits firsthand!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes this FPGA lightweight and durable, ideal for portable and rugged applications.

No. of Logic Cells: 12084

With a high number of logic cells, this FPGA offers ample capacity for complex programmable logic designs.

Maximum Supply Voltage: 1.26 V

The high maximum supply voltage allows for flexibility in power supply options.

No. of Inputs: 233

Having a large number of inputs enables this FPGA to interface with a wide range of external devices and sensors.

Nominal Supply Voltage (V): 1.2

Having a stable nominal supply voltage of 1.2V ensures reliable performance in various operating conditions.

Minimum Operating Temperature: -40 °C

The wide minimum operating temperature range of -40°C enables this FPGA to be used in harsh environmental conditions.

Maximum Operating Temperature: 100 °C

With a maximum operating temperature of 100°C, this FPGA can handle high-temperature environments without compromising performance.

No. of Outputs: 233

Just like the inputs, a large number of outputs allows for versatile interfacing capabilities for this FPGA.

Technical Specifications

Field Programmable Gate Arrays (FPGA) M2GL010T-1FGG484I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of Logic Cells:

12084

No. of Inputs:

233

No. of Outputs:

233

Sub-Category:

Field Programmable Gate Arrays

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Power Supplies:

1.2 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

250 °C (482 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

23 mm

Width:

23 mm

Maximum Seated Height:

2.44 mm

Packing Method:

Tray

Package Equivalence Code:

BGA484,22X22,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

1 mm

No. of Terminals:

484

Standards

JESD-30 Code:

S-PBGA-B484

Qualified:

No

Trade Compliance

M2GL010T-1FGG484I Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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