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DSPIC33FJ64MC804-H/ML

Microchip Technology

DSPIC33FJ64MC804-H/ML by Microchip Technology

DSPIC33FJ64MC804-H/ML by Microchip Technology is a 16-bit digital signal processor with 3.3V power supply, suitable for automotive applications. It features 8 DMA channels, 5 timers, and operates in low power mode. With a max operating temperature of 150°C and flash ROM programmability, it offers high performance in a compact square package.

Median Price

$9.730

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 105 parts In-Stock

1+ parts

$9.730

100+ parts

$8.080

1k+ parts

$7.420

10k+ parts

$7.060

105

$9.730

$8.080

$7.420

$7.060

Mouser Electronics

USA . 104 parts In-Stock

1+ parts

$9.730

100+ parts

$8.080

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-

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-

104

$9.730

$8.080

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DigiKey

USA . 98 parts In-Stock

1+ parts

$9.730

100+ parts

$8.080

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-

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98

$9.730

$8.080

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-

Distributors (In-Stock)

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NAC Semi

USA . 90 parts In-Stock

1+ parts

$10.090

100+ parts

$9.150

1k+ parts

$8.370

10k+ parts

-

90

$10.090

$9.150

$8.370

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Vyrian

USA . 5,006 parts In-Stock

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5,006

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LIBRA Elektronik GmbH

Germany . 1,041 parts In-Stock

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Distributors (Availability)

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Ampacity Inc.

Singapore . 12 parts In-Stock

1+ parts

$8.270

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12

$8.270

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Marpe Global Electronics

Taiwan . 4,877 parts In-Stock

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4,877

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QualityLine Systems

Poland . 4,877 parts In-Stock

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XL Components Corporation

Australia . 4,877 parts In-Stock

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Continental Prestige Electronics

USA . 2,850 parts In-Stock

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2,850

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Argo Parts USA

USA . 2,226 parts In-Stock

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Authorized Procurement Solutions

USA . 1,500 parts In-Stock

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1,500

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Perfect Parts

USA . 493 parts In-Stock

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493

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Corohmni

South Africa . 155 parts In-Stock

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155

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Netroflash

USA . 50 parts In-Stock

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50

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Overview

Discover the unparalleled performance and reliability of the Microchip Technology DSPIC33FJ64MC804-H/ML digital signal processor. With a focus on quality and innovation, Microchip Technology delivers cutting-edge solutions for a wide range of applications in the digital signal processing category. This product offers customers exceptional value, benefits, and advantages, making it the ideal choice for those seeking high-quality performance and seamless integration. Experience the difference with Microchip Technology and elevate your projects to new heights of success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and cost-effective material for packaging, ensuring reliability of the product

Maximum Supply Voltage: 3.6 V

Allows for flexible power supply options and compatibility with different systems

Bit Size: 16

High bit size allows for complex signal processing tasks with precision

Technology: CMOS

CMOS technology offers low power consumption and high integration, making the product energy-efficient

Maximum Operating Temperature: 150 °C

Capable of operating in high-temperature environments, suitable for a variety of applications

No. of Serial I/Os: 2

Multiple serial I/Os allow for versatile connectivity options and data transfer capabilities

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33FJ64MC804-H/ML attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N44

JESD-609 Code:

e3

Length:

8 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

8

No. of External Interrupts:

3

No. of Serial I/Os:

2

No. of Terminals:

44

No. of Timers:

5

On Chip Data RAM Width:

16

On Chip Program ROM Width:

24

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC44,.31SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

76 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

8 mm

Trade Compliance

DSPIC33FJ64MC804-H/ML Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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