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DSPIC33FJ64GS606T-50I/MR

Microchip Technology

DSPIC33FJ64GS606T-50I/MR by Microchip Technology

DSPIC33FJ64GS606T-50I/MR by Microchip is a 16-bit DSP with max clock freq of 40MHz, operating temp range -40 to 85°C. Ideal for industrial applications requiring high-speed signal processing and control tasks due to its FLASH ROM programmability, CMOS technology, and low power supply voltage of 3.3V. Package style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE.

Median Price

$9.886

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 81 parts In-Stock

1+ parts

$9.886

100+ parts

-

1k+ parts

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10k+ parts

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81

$9.886

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Vyrian

USA . 8,804 parts In-Stock

1+ parts

-

100+ parts

-

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10k+ parts

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8,804

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 338 parts In-Stock

1+ parts

$6.054

100+ parts

-

1k+ parts

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338

$6.054

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Continental Prestige Electronics

USA . 5,615 parts In-Stock

1+ parts

$9.886

100+ parts

-

1k+ parts

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10k+ parts

$9.688

5,615

$9.886

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$9.688

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$9.886

100+ parts

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1,000

$9.886

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Ampacity Inc.

Singapore . 1,426 parts In-Stock

1+ parts

$19.000

100+ parts

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1,426

$19.000

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Microchip USA

USA . 5,449 parts In-Stock

1+ parts

$20.345

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5,449

$20.345

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Semicontronic

India . 844 parts In-Stock

1+ parts

$28.000

100+ parts

$27.300

1k+ parts

$27.160

10k+ parts

-

844

$28.000

$27.300

$27.160

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Advanced Electronics

New Zealand . 850 parts In-Stock

1+ parts

$51.141

100+ parts

$50.630

1k+ parts

$48.584

10k+ parts

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850

$51.141

$50.630

$48.584

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Fulton Briggs Corp.

USA . 7,544 parts In-Stock

1+ parts

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7,544

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Argo Parts USA

USA . 4,132 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the DSPIC33FJ64GS606T-50I/MR from Microchip Technology. As a leader in the industry, Microchip delivers top-quality digital signal processors that are versatile and reliable. Perfect for a wide range of applications, this DSP offers unparalleled performance and efficiency. With a focus on innovation and customer satisfaction, Microchip ensures that you get the best value for your investment. Upgrade your projects with the DSPIC33FJ64GS606T-50I/MR and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers durability and protection, making the DSPs suitable for various environments.

Surface Mount: YES

The surface mount option allows for easy and efficient installation on circuit boards, saving time and effort.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, these DSPs can handle a wide range of power inputs for versatile applications.

Screening Level: TS 16949

The TS 16949 screening level ensures high quality and reliability, meeting industry standards for performance.

Package Shape: SQUARE

The square package shape allows for efficient use of space on circuit boards, maximizing component layout flexibility.

Bit Size: 16

The 16-bit size enhances processing capabilities, enabling fast and accurate signal processing tasks.

Power Supplies (V): 3.3

The 3.3 V power supply ensures stable and consistent performance of the DSPs in various operating conditions.

No. of Terminals: 64

With 64 terminals, these DSPs offer ample connectivity options for interfacing with other components in a system.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles promotes efficient heat dissipation and compact design.

Minimum Supply Voltage: 3 V

The low minimum supply voltage ensures compatibility with a wide range of power sources for flexibility in system design.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, these DSPs can withstand harsh environmental conditions without compromising performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable operation even in extreme cold environments.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides good solderability and corrosion resistance for long-term reliability.

Terminal Position: QUAD

The quad terminal position offers easy soldering and secure connections for stable performance.

Maximum Seated Height: 1 mm

The low maximum seated height allows for compact and space-efficient designs in electronic systems.

Width: 9 mm

The 9 mm width provides a compact form factor, enabling integration into various electronic devices with limited space.

Maximum Clock Frequency: 40 MHz

The high maximum clock frequency allows for fast processing speeds and real-time data handling.

Maximum Time At Peak Reflow Temperature (s): 40

The 40-second maximum time at peak reflow temperature ensures proper soldering and component bonding during assembly.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C supports reliable solder joints and thermal stability in manufacturing processes.

Length: 9 mm

The 9 mm length offers a balanced form factor, making the DSPs suitable for a wide range of applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade enables the DSPs to operate reliably in demanding industrial environments.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, CONTROLLER

The DSPs feature peripheral IC types for signal processing and control applications, offering versatile functionality.

Technology: CMOS

The CMOS technology provides low power consumption and high noise immunity, ensuring efficient and reliable operation.

Terminal Form: NO LEAD

The no-lead terminal form simplifies installation and enhances reliability by reducing the risk of solder joint failure.

Nominal Supply Voltage: 3.3 V

The 3.3 V nominal supply voltage ensures compatibility with standard power sources for seamless integration into electronic systems.

ROM Programmability: FLASH

The flash ROM programmability allows for flexible and convenient firmware updates and customization for specific applications.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch offers high-density mounting capabilities, enabling compact and space-efficient system designs.

Format: FLOATING POINT

The floating-point format enhances numerical accuracy and precision in mathematical calculations for signal processing tasks.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, these DSPs can withstand moderate moisture exposure during manufacturing and assembly processes.

On Chip Program ROM Width: 8

The 8-bit on-chip program ROM width provides ample storage capacity for firmware and program data, enabling versatile functionality.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33FJ64GS606T-50I/MR attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

40 MHz

External Data Bus Width:

0

Format:

FLOATING POINT

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e3

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

1 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

9 mm

Trade Compliance

DSPIC33FJ64GS606T-50I/MR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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