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DSPIC33FJ64GS406T-50I/MR

Microchip Technology

DSPIC33FJ64GS406T-50I/MR by Microchip Technology

DSPIC33FJ64GS406T-50I/MR by Microchip is a 16-bit DSP with max clock freq of 40MHz, ideal for industrial applications. Operating at 3.3V, it features flash ROM programmability and CMOS technology. With a temp range of -40 to 85°C, this chip carrier package has 64 terminals in a square shape.

Median Price

$7.820

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$7.820

100+ parts

-

1k+ parts

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10

$7.820

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Vyrian

USA . 2,872 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,872

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 5,859 parts In-Stock

1+ parts

$7.820

100+ parts

-

1k+ parts

-

10k+ parts

$7.664

5,859

$7.820

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-

$7.664

Netroflash

USA . 100 parts In-Stock

1+ parts

$7.820

100+ parts

-

1k+ parts

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100

$7.820

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Ampacity Inc.

Singapore . 1,148 parts In-Stock

1+ parts

$14.000

100+ parts

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1k+ parts

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1,148

$14.000

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AZTECH Wire

Italy . 311 parts In-Stock

1+ parts

$16.445

100+ parts

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311

$16.445

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Microchip USA

USA . 5,928 parts In-Stock

1+ parts

$17.954

100+ parts

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5,928

$17.954

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Fulton Briggs Corp.

USA . 7,286 parts In-Stock

1+ parts

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100+ parts

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7,286

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Argo Parts USA

USA . 2,775 parts In-Stock

1+ parts

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100+ parts

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2,775

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Overview

Discover the power of the Microchip Technology DSPIC33FJ64GS406T-50I/MR, a high-quality Digital Signal Processor designed to revolutionize your projects. With a focus on innovation and reliability, Microchip Technology ensures that this product exceeds industry standards, offering customers unmatched performance and versatility. Ideal for a variety of applications, this DSP delivers superior processing capabilities and efficiency, providing you with the tools you need to bring your ideas to life. Experience the value and benefits of the DSPIC33FJ64GS406T-50I/MR and elevate your designs to new heights.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - Provides durability and cost-effectiveness.

Surface Mount:

YES - Enables easy and efficient installation on PCBs.

Maximum Supply Voltage:

3.6 V - Allows for versatile power supply options.

Screening Level:

TS 16949 - Ensures high quality and reliability in automotive applications.

Package Shape:

SQUARE - Facilitates space-saving and efficient PCB design.

Bit Size:

16 - Offers high processing capabilities for complex algorithms.

Power Supplies (V):

3.3 - Operates efficiently within standard voltage ranges.

No. of Terminals:

64 - Provides ample connections for peripheral devices.

Package Style:

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE - Offers flexibility in mounting options.

Minimum Supply Voltage:

3 V - Ensures stable operation at lower power inputs.

Maximum Operating Temperature:

85 °C - Enables reliable performance in varying environments.

Minimum Operating Temperature:

40 °C - Allows for operation in extreme cold conditions.

Terminal Finish:

MATTE TIN - Ensures good solderability and electrical conductivity.

Terminal Position:

QUAD - Facilitates easy integration into PCB layouts.

Maximum Seated Height:

1 mm - Enables compact design solutions.

Width:

9 mm - Contributes to space-efficient board layouts.

Maximum Clock Frequency:

40 MHz - Provides high-speed processing capabilities.

Maximum Time At Peak Reflow Temperature (s):

40 - Ensures proper soldering during assembly.

Peak Reflow Temperature °C:

260 - Supports high-temperature soldering processes.

Length:

9 mm - Contributes to compact device design.

Temperature Grade:

INDUSTRIAL - Suitable for rugged industrial applications.

Peripheral IC Type:

DIGITAL SIGNAL PROCESSOR, CONTROLLER - Offers versatile functionality for signal processing and control tasks.

Technology:

CMOS - Provides low power consumption and high noise immunity.

Terminal Form:

NO LEAD - Ensures environmental compliance and ease of recycling.

Nominal Supply Voltage:

3.3 V - Operates efficiently within standard voltage ranges.

ROM Programmability:

FLASH - Facilitates easy firmware updates and customization.

Terminal Pitch:

0.5 mm - Allows for high-density board layouts.

Format:

FLOATING POINT - Supports accurate and efficient mathematical operations.

Moisture Sensitivity Level (MSL):

3 - Ensures proper handling and storage to prevent moisture damage.

On Chip Program ROM Width:

8 - Provides ample storage for program data.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33FJ64GS406T-50I/MR attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

40 MHz

External Data Bus Width:

0

Format:

FLOATING POINT

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e3

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

1 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

9 mm

Trade Compliance

DSPIC33FJ64GS406T-50I/MR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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