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DSPIC33FJ32MC204-H/PT

Microchip Technology

DSPIC33FJ32MC204-H/PT by Microchip Technology

DSPIC33FJ32MC204-H/PT by Microchip Technology is a 16-bit DSP with 3.3V supply, 40MHz clock frequency, and 2048 RAM words. Ideal for automotive applications, it features 5 timers, flash ROM programmability, and low power mode for efficient operation at temperatures ranging from -40 to 150°C.

Median Price

$6.780

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 1,100 parts In-Stock

1+ parts

$6.780

100+ parts

$5.630

1k+ parts

$5.180

10k+ parts

$4.920

1,100

$6.780

$5.630

$5.180

$4.920

DigiKey

USA . 264 parts In-Stock

1+ parts

$6.780

100+ parts

$5.630

1k+ parts

-

10k+ parts

-

264

$6.780

$5.630

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-

Mouser Electronics

USA . 37 parts In-Stock

1+ parts

$6.780

100+ parts

$5.630

1k+ parts

-

10k+ parts

-

37

$6.780

$5.630

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$6.048

100+ parts

-

1k+ parts

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10

$6.048

-

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Vyrian

USA . 86 parts In-Stock

1+ parts

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86

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 1,413 parts In-Stock

1+ parts

$5.378

100+ parts

-

1k+ parts

$5.163

10k+ parts

$5.163

1,413

$5.378

-

$5.163

$5.163

Ampacity Inc.

Singapore . 101 parts In-Stock

1+ parts

$5.760

100+ parts

-

1k+ parts

-

10k+ parts

-

101

$5.760

-

-

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Continental Prestige Electronics

USA . 6,825 parts In-Stock

1+ parts

$6.048

100+ parts

-

1k+ parts

-

10k+ parts

$5.927

6,825

$6.048

-

-

$5.927

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$6.048

100+ parts

-

1k+ parts

$5.746

10k+ parts

$5.625

2,000

$6.048

-

$5.746

$5.625

AZTECH Wire

Italy . 397 parts In-Stock

1+ parts

$16.280

100+ parts

-

1k+ parts

-

10k+ parts

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397

$16.280

-

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Corohmni

South Africa . 2,647 parts In-Stock

1+ parts

$49.128

100+ parts

-

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10k+ parts

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2,647

$49.128

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Lixinc

USA . 11,706 parts In-Stock

1+ parts

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100+ parts

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11,706

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Authorized Procurement Solutions

USA . 11,000 parts In-Stock

1+ parts

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11,000

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NIA Electronics

USA . 4,602 parts In-Stock

1+ parts

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100+ parts

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4,602

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Ledger Components

France . 4,602 parts In-Stock

1+ parts

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4,602

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LMD Electronica

Estonia . 3,183 parts In-Stock

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3,183

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Argo Parts USA

USA . 1,765 parts In-Stock

1+ parts

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1,765

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Montano Global Distributors

Canada . 1,249 parts In-Stock

1+ parts

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1,249

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LOOK Integrated Logistics

Peru . 128 parts In-Stock

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128

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Perfect Parts

USA . 116 parts In-Stock

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116

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Overview

Experience the power of innovation with the DSPIC33FJ32MC204-H/PT by Microchip Technology. As a leader in digital signal processors, Microchip Technology brings you a high-quality product that is perfect for a wide range of applications. With its cutting-edge technology and reliable performance, this DSP offers customers exceptional value and benefits. Trust Microchip Technology to provide you with the tools you need to take your projects to the next level. Unlock new possibilities with the DSPIC33FJ32MC204-H/PT today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and cost-effective, suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving space on the board.

Maximum Supply Voltage: 3.6 V

Supports a wide range of supply voltages, providing flexibility in power source selection.

On Chip Data RAM Width: 8

8-bit data RAM width enables efficient data processing and storage within the chip.

Screening Level: AEC-Q100; TS 16949

Meets automotive industry standards for quality and reliability, ensuring high performance in harsh environments.

Package Shape: SQUARE

Square package shape offers a compact design, suitable for space-constrained applications.

Bit Size: 16

16-bit processing capability enables high-speed and accurate signal processing.

Power Supplies (V): 3.3

Stable 3.3V power supply ensures consistent performance and compatibility with common power sources.

No. of Terminals: 44

44 terminals provide ample I/O options for connectivity and interface with external components.

Package Style (Meter): FLATPACK, THIN PROFILE

Flatpack, thin profile package style offers a low-profile design, ideal for compact devices and tight spaces.

Minimum Supply Voltage: 3 V

Supports low supply voltage operation, suitable for battery-powered applications.

Maximum Operating Temperature: 150 °C

High operating temperature range enables operation in extreme environmental conditions.

No. of External Interrupts: 3

3 external interrupts allow for efficient handling of external events and real-time responsiveness.

Minimum Operating Temperature: -40 °C

Wide temperature range enables operation in extreme cold conditions.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance for reliable connections.

ADC Channels: YES

Integrated ADC channels enable analog signal processing and conversion for diverse applications.

Terminal Position: QUAD

Quad terminal position facilitates easy PCB layout and connection with other components.

Maximum Seated Height: 1.2 mm

Low profile design with a maximum seated height of 1.2mm saves space in device packaging.

RAM Words: 2048

2048 RAM words allow for efficient data storage and manipulation within the chip.

Width: 10 mm

Compact 10mm width makes the chip suitable for small form factor applications.

Boundary Scan: YES

Boundary scan feature facilitates testing and diagnostics during manufacturing and maintenance processes.

Maximum Clock Frequency: 40 MHz

High clock frequency of 40MHz enables fast signal processing and throughput.

Maximum Time At Peak Reflow Temperature (s): 40

Can withstand peak reflow temperature for up to 40 seconds, ensuring reliable soldering during assembly.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260°C ensures proper soldering and component bonding during assembly.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture allows for efficient data transfer and communication between different components on the chip.

Length: 10 mm

Compact 10mm length makes the chip suitable for space-constrained applications.

Temperature Grade: AUTOMOTIVE

Automotive temperature grade ensures reliable operation in automotive applications subjected to temperature variations.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Integrated digital signal processor and other peripheral ICs offer versatile signal processing and functionality.

No. of Timers: 5

5 timers provide timing and scheduling capabilities for various tasks and operations.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and compatibility with a wide range of applications.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy surface mounting and soldering on the PCB.

Maximum Supply Current: 60 mA

Low maximum supply current of 60mA ensures efficient power usage and minimizes heat dissipation.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage of 3.3V ensures consistent performance and compatibility with standard power sources.

PWM Channels: YES

Integrated PWM channels enable precise control of analog signals and motor speed in applications.

ROM Programmability: FLASH

Flash ROM programmability allows for easy firmware updates and customization of integrated software.

Terminal Pitch: 0.8 mm

Narrow terminal pitch of 0.8mm saves space on the PCB and supports high-density designs.

Format: FIXED POINT

Fixed-point format allows for efficient arithmetic operations and accurate processing of numerical data.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 indicates the level of protection against moisture during storage and handling.

Speed: 20 rpm

Operates at a speed of 20 rotations per minute, suitable for low-speed motor control applications.

Low Power Mode: YES

Low power mode option allows for power-saving operation and extended battery life in portable devices.

Barrel Shifter: YES

Integrated barrel shifter enables efficient shifting and rotation operations on data within the chip.

On Chip Program ROM Width: 24

24-bit program ROM width provides ample storage for program code and instructions.

No. of I/O Lines: 35

35 I/O lines offer versatile connectivity options for interfacing with external devices and peripherals.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33FJ32MC204-H/PT attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

ADC Channels:

YES

Address Bus Width:

0

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G44

JESD-609 Code:

e3

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of External Interrupts:

3

No. of I/O Lines:

35

No. of Serial I/Os:

1

No. of Terminals:

44

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

24

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP44,.39SQ,31

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Words:

2048

ROM Programmability:

FLASH

Screening Level:

AEC-Q100; TS 16949

Maximum Seated Height:

1.2 mm

Speed:

20 rpm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

60 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

10 mm

Peripheral IC Type:

Trade Compliance

DSPIC33FJ32MC204-H/PT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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