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DSPIC33FJ12MC202-I/SP

Microchip Technology

DSPIC33FJ12MC202-I/SP by Microchip Technology

DSPIC33FJ12MC202-I/SP by Microchip is a 16-bit DSP with max clock freq of 40MHz, operating temp range -40 to 85°C. It's used in industrial applications for digital signal processing and control tasks due to its flash ROM programmability and CMOS technology.

Median Price

$4.780

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

RS (Exports)

UK . 15 parts In-Stock

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$1.090

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$1.090

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RS Americas

USA . 15 parts In-Stock

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$4.720

100+ parts

$4.010

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15

$4.720

$4.010

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Mouser Electronics

USA . 155 parts In-Stock

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$4.840

100+ parts

$4.430

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$4.000

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-

155

$4.840

$4.430

$4.000

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DigiKey

USA . 48 parts In-Stock

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$4.840

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$4.000

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48

$4.840

$4.000

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Distributors (In-Stock)

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Nova Conductors

Japan . 67 parts In-Stock

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$4.312

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Vyrian

USA . 1,960 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 226 parts In-Stock

1+ parts

$4.010

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226

$4.010

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Netroflash

USA . 50 parts In-Stock

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$4.312

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$4.096

10k+ parts

$4.010

50

$4.312

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$4.096

$4.010

Allen Electronics Distributors

USA . 15 parts In-Stock

1+ parts

$4.540

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15

$4.540

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iodParts Technologies Inc.

India . 18 parts In-Stock

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$4.840

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18

$4.840

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AZTECH Wire

Italy . 342 parts In-Stock

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$12.934

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Lixinc

USA . 19,778 parts In-Stock

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Infinite Electronics LLP (Excess)

. 8,312 parts In-Stock

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West Coast Incorporated

USA . 456 parts In-Stock

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456

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Perfect Parts

USA . 86 parts In-Stock

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86

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Overview

Elevate your projects with the DSPIC33FJ12MC202-I/SP by Microchip Technology, a top-tier manufacturer of cutting-edge Digital Signal Processors. Perfect for a wide range of applications, this powerful DSP offers unparalleled value and benefits, delivering exceptional performance and efficiency. With a maximum clock frequency of 40 MHz and a compact design, this product provides customers with a reliable solution that exceeds expectations. Experience the advantages of advanced technology and precision engineering with the DSPIC33FJ12MC202-I/SP.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in electronic components as it is lightweight, durable, and cost-effective.

Maximum Supply Voltage: 3.6 V

Allows for a higher voltage input, providing flexibility in power supply options.

Package Shape: RECTANGULAR

Rectangular shape makes it easier to integrate and mount the DSP in different applications.

Bit Size: 16

16-bit processing capability provides a good balance between performance and cost for various signal processing tasks.

Power Supplies (V): 3.3

Optimal power supply voltage for efficient operation of the DSP.

No. of Terminals: 28

A high number of terminals allow for versatile connectivity and interfacing with other components.

Minimum Operating Temperature: -40 °C

Wide temperature range ensures reliability in various operating conditions, including harsh environments.

Maximum Clock Frequency: 40 MHz

High clock frequency enables fast signal processing and response times.

Package Style (Meter): IN-LINE

In-line package style saves space and simplifies PCB layout designs.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ideal for portable and battery-operated devices.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33FJ12MC202-I/SP attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

40 MHz

External Data Bus Width:

0

Format:

FIXED POINT

JESD-30 Code:

R-PDIP-T28

JESD-609 Code:

e3

Length:

34.671 mm

No. of Terminals:

28

On Chip Program ROM Width:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP28,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

3.3

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

5.08 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

90 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

DSPIC33FJ12MC202-I/SP Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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