Loading...

DSPIC33EP512GP502T-E/MM

Microchip Technology

DSPIC33EP512GP502T-E/MM by Microchip Technology

DSPIC33EP512GP502T-E/MM by Microchip Technology is a 16-bit DSP with 60 MHz clock frequency, 49152 RAM words, and 3.3V supply voltage. Ideal for automotive applications, it features AEC-Q100 screening level and operates in temperatures ranging from -40 to 125°C. With 5 timers, 4 DMA channels, and boundary scan support, this digital signal processor offers high performance in a compact chip carrier package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,368 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,368

-

-

-

-

Nova Conductors

Japan . 64 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

64

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 176 parts In-Stock

1+ parts

$8.890

100+ parts

-

1k+ parts

-

10k+ parts

-

176

$8.890

-

-

-

Ampacity Inc.

Singapore . 2,890 parts In-Stock

1+ parts

$11.290

100+ parts

-

1k+ parts

-

10k+ parts

-

2,890

$11.290

-

-

-

Corohmni

South Africa . 510 parts In-Stock

1+ parts

$48.832

100+ parts

-

1k+ parts

-

10k+ parts

-

510

$48.832

-

-

-

RGB Technical Solutions

Ukraine . 4,548 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,548

-

-

-

-

Netroflash

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

-

-

-

-

Argo Parts USA

USA . 762 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

762

-

-

-

-

Continental Prestige Electronics

USA . 414 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

414

-

-

-

-

Microchip USA

USA . 314 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

314

-

-

-

-

Overview

Unleash the power of cutting-edge technology with the DSPIC33EP512GP502T-E/MM by Microchip Technology, a top-tier manufacturer renowned for quality and innovation. As a leading product in the Digital Signal Processors category, this chip delivers unparalleled performance and reliability. Whether you're designing automotive systems, industrial controls, or consumer electronics, this versatile DSP offers value, efficiency, and precision like never before. Elevate your projects to new heights with the advantages and benefits that only Microchip Technology can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the DSP, making it suitable for various environments and applications.

Maximum Supply Voltage: 3.6 V

Allows for a higher supply voltage, offering flexibility in power sources and performance.

Bit Size: 16

With a larger bit size, the DSP is capable of processing more complex data and algorithms with higher precision.

Maximum Operating Temperature: 125 °C

Can operate in high temperature conditions, making it suitable for automotive and industrial applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, CONTROLLER

This dual capability allows for both signal processing and control functions in a single chip, reducing system complexity and cost.

ROM Programmability: FLASH

Utilizing flash ROM allows for easy and flexible reprogramming of the DSP, enabling firmware updates and customization.

Low Power Mode: YES

The low power mode helps to conserve energy and extend battery life in portable or power-sensitive applications.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33EP512GP502T-E/MM attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

60 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N28

JESD-609 Code:

e3

Length:

6 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

4

No. of External Interrupts:

3

No. of Terminals:

28

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC28,.24SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Words:

49152

ROM Programmability:

FLASH

Screening Level:

AEC-Q100; TS 16949

Maximum Seated Height:

1 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

55 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

6 mm

Trade Compliance

DSPIC33EP512GP502T-E/MM Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20