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DSPIC33EP256GP502-E/SS

Microchip Technology

DSPIC33EP256GP502-E/SS by Microchip Technology

DSPIC33EP256GP502-E/SS by Microchip Technology is a 16-bit digital signal processor with 3.3V power supply, 60MHz clock frequency, and 32768 RAM words. Ideal for automotive applications, it features flash ROM programmability, 5 timers, and low power mode for efficient performance in compact designs.

Median Price

$4.390

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 15 parts In-Stock

1+ parts

$4.390

100+ parts

-

1k+ parts

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15

$4.390

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Vyrian

USA . 6,330 parts In-Stock

1+ parts

-

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6,330

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 1,580 parts In-Stock

1+ parts

$3.000

100+ parts

$2.925

1k+ parts

$2.910

10k+ parts

-

1,580

$3.000

$2.925

$2.910

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Corohmni

South Africa . 911 parts In-Stock

1+ parts

$4.111

100+ parts

-

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911

$4.111

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Continental Prestige Electronics

USA . 2,411 parts In-Stock

1+ parts

$4.390

100+ parts

-

1k+ parts

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10k+ parts

$4.302

2,411

$4.390

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-

$4.302

Argo Parts USA

USA . 1,869 parts In-Stock

1+ parts

$4.390

100+ parts

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1,869

$4.390

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Netroflash

USA . 50 parts In-Stock

1+ parts

$4.390

100+ parts

-

1k+ parts

$4.170

10k+ parts

$4.083

50

$4.390

-

$4.170

$4.083

AZTECH Wire

Italy . 399 parts In-Stock

1+ parts

$7.530

100+ parts

-

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399

$7.530

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Aztec Data Supply Inc.

USA . 3,049 parts In-Stock

1+ parts

$20.969

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3,049

$20.969

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Ampacity Inc.

Singapore . 806 parts In-Stock

1+ parts

$32.000

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806

$32.000

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RGB Technical Solutions

Ukraine . 6,925 parts In-Stock

1+ parts

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6,925

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Microchip USA

USA . 182 parts In-Stock

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182

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Overview

Unleash the power of cutting-edge technology with Microchip Technology's DSPIC33EP256GP502-E/SS Digital Signal Processor. Designed for a wide range of applications, this high-quality product offers unmatched performance and reliability. With a maximum clock frequency of 60 MHz and low power mode, customers can expect efficient operation and extended battery life. Whether you're in the automotive industry or developing controllers, this DSP provides the perfect solution. Experience the benefits of advanced features and superior quality that only Microchip Technology can deliver. Elevate your projects to the next level with the DSPIC33EP256GP502-E/SS today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the components inside, making the product reliable for long-term use.

Maximum Supply Voltage: 3.6 V

The higher maximum supply voltage allows for flexibility in different power supply configurations, ensuring compatibility with various systems.

Bit Size: 16

The 16-bit architecture enables efficient processing of data and allows for complex signal processing tasks to be performed effectively.

No. of Terminals: 28

The ample number of terminals provides connectivity options and interfaces for integrating the DSP into different systems and peripherals.

Maximum Clock Frequency: 60 MHz

The high clock frequency enables fast processing of data and real-time signal processing, making the product suitable for demanding applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and reliability of the DSP.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33EP256GP502-E/SS attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

60 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e3

Length:

10.2 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of DMA Channels:

4

No. of External Interrupts:

3

No. of Terminals:

28

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP28,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Words:

32768

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

2 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

55 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

5.3 mm

Trade Compliance

DSPIC33EP256GP502-E/SS Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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