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DSPIC33EP128GP502T-I/SO

Microchip Technology

DSPIC33EP128GP502T-I/SO by Microchip Technology

DSPIC33EP128GP502T-I/SO by Microchip Technology is a 16-bit DSP with max clock frequency of 60MHz. It operates at industrial temp range (-40 to 85°C) and has flash ROM programmability. Ideal for digital signal processing applications due to its small outline package, low supply voltage (3.3V), and high terminal pitch (1.27mm).

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,906 parts In-Stock

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4,906

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Nova Conductors

Japan . 29 parts In-Stock

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29

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Distributors (Availability)

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AZTECH Wire

Italy . 221 parts In-Stock

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$11.756

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221

$11.756

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Fulton Briggs Corp.

USA . 2,901 parts In-Stock

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Microchip USA

USA . 2,198 parts In-Stock

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Aranea Global

USA . 1,000 parts In-Stock

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1,000

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Overview

Unleash the power of cutting-edge technology with the DSPIC33EP128GP502T-I/SO by Microchip Technology. This top-of-the-line Digital Signal Processor offers unparalleled quality, reliability, and performance for a wide range of applications. With its advanced features and innovative design, this product provides customers with unmatched value, benefits, and advantages. Trust Microchip Technology to deliver state-of-the-art solutions that exceed expectations and drive success in the digital world.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the components inside, making it a reliable choice for long-term use.

Surface Mount: YES

The surface mount capability allows for easier and more efficient assembly, saving time and reducing production costs.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this DSP can handle a wide range of power inputs, providing flexibility in various applications.

Package Shape: RECTANGULAR

The rectangular shape makes it easy to integrate this DSP into different designs and layouts, allowing for versatile use.

Bit Size: 16

The 16-bit size offers high precision and accuracy in processing data, making it ideal for complex signal processing tasks.

Power Supplies (V): 3.3

The 3.3V power supply ensures efficient energy consumption and compatibility with a variety of power sources.

No. of Terminals: 28

The ample number of terminals allows for versatile connectivity options, enhancing the compatibility of this DSP with other components.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space and enables a compact design, making it suitable for applications with limited real estate.

Minimum Supply Voltage: 3 V

The low minimum supply voltage ensures this DSP can operate efficiently even in low-power environments, expanding its range of usability.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this DSP can withstand harsh environmental conditions and maintain performance under extreme heat.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures this DSP remains functional in cold environments, making it suitable for a variety of applications.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides corrosion resistance and promotes good solderability, ensuring long-term reliability in various operating conditions.

Terminal Position: DUAL

The dual terminal position offers flexible mounting options and facilitates easy integration into different circuit layouts, enhancing versatility.

Maximum Seated Height: 2.65 mm

The low maximum seated height allows for a slim design and easy installation in space-constrained applications, optimizing overall system layout.

Width: 7.5 mm

The compact width of this DSP allows for efficient use of board space, enabling dense layouts and maximizing system integration capabilities.

Maximum Clock Frequency: 60 MHz

With a high maximum clock frequency, this DSP can process data quickly and efficiently, making it suitable for high-speed signal processing tasks.

Maximum Time At Peak Reflow Temperature (s): 40

The short maximum time at peak reflow temperature ensures quick and reliable soldering during manufacturing, improving production efficiency.

Peak Reflow Temperature °C: 250

The high peak reflow temperature tolerance allows for robust soldering processes, ensuring strong and durable connections for long-term reliability.

Length: 17.9 mm

The compact length of this DSP offers versatility in system design and layout, providing flexibility in placement and integration within different applications.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature tolerance ensures this DSP can withstand harsh operating conditions, making it a reliable choice for industrial applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, CONTROLLER

This DSP incorporates multiple peripheral IC types, enhancing its versatility and enabling a wide range of functions in signal processing and control applications.

Technology: CMOS

The CMOS technology utilized in this DSP provides low power consumption, high-speed processing, and compatibility with a variety of voltages, making it an efficient and versatile choice.

Terminal Form: GULL WING

The gull-wing terminal form offers strong mechanical support and facilitates easy and secure soldering, ensuring reliable connections and durability in various conditions.

Maximum Supply Current: 150 mA

With a moderate maximum supply current, this DSP maintains efficient power usage and extends the battery life in portable applications, making it a practical choice for energy-conscious designs.

Nominal Supply Voltage: 3.3 V

The 3.3V nominal supply voltage ensures compatibility with standard power sources and promotes stable operation, making this DSP suitable for a wide range of applications.

ROM Programmability: FLASH

The Flash ROM programmability allows for easy and flexible data storage and retrieval, enabling quick updates and modifications to the programming of this DSP.

Terminal Pitch: 1.27 mm

The small terminal pitch enables compact design layouts and facilitates efficient signal routing on the circuit board, optimizing space usage and ensuring high-performance connections.

Format: FLOATING POINT

The floating-point format offers high precision in mathematical calculations and data processing, making this DSP suitable for applications requiring complex computations and accurate results.

On Chip Program ROM Width: 24

The 24-bit width of the on-chip program ROM provides ample storage capacity for programs and data, enabling extensive functionality and versatility in processing tasks.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33EP128GP502T-I/SO attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

60 MHz

External Data Bus Width:

0

Format:

FLOATING POINT

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e3

Length:

17.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

28

On Chip Program ROM Width:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

250

Power Supplies (V):

3.3

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

2.65 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

150 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7.5 mm

Trade Compliance

DSPIC33EP128GP502T-I/SO Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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