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DSPIC33EP128GM710-E/PT

Microchip Technology

DSPIC33EP128GM710-E/PT by Microchip Technology

DSPIC33EP128GM710-E/PT by Microchip Technology is a 16-bit digital signal processor with 16384 RAM words and 60 MHz max clock frequency. Ideal for automotive applications, it features 3.3V nominal voltage, FLASH ROM programmability, and low power mode for efficient operation.

Median Price

$8.140

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$8.140

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$8.140

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Vyrian

USA . 8,206 parts In-Stock

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8,206

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 536 parts In-Stock

1+ parts

$5.566

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536

$5.566

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Bastille Electronics

Australia . 50 parts In-Stock

1+ parts

$8.140

100+ parts

$7.733

1k+ parts

-

10k+ parts

$7.245

50

$8.140

$7.733

-

$7.245

Continental Prestige Electronics

USA . 842 parts In-Stock

1+ parts

$8.140

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$7.977

842

$8.140

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$7.977

Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$8.303

100+ parts

$8.303

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$8.303

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5,000

$8.303

$8.303

$8.303

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Ampacity Inc.

Singapore . 263 parts In-Stock

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$20.000

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263

$20.000

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Aztec Data Supply Inc.

USA . 783 parts In-Stock

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$63.121

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783

$63.121

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Corohmni

South Africa . 21 parts In-Stock

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$64.171

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QUARKTWIN TECHNOLOGY LTD

USA . 9,377 parts In-Stock

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Argo Parts USA

USA . 1,659 parts In-Stock

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1,659

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RGB Technical Solutions

Ukraine . 1,642 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the Microchip Technology DSPIC33EP128GM710-E/PT Digital Signal Processor. As a leader in the industry, Microchip Technology delivers top-quality products that are designed to meet the highest standards. Ideal for a wide range of applications, this DSP offers unparalleled value, benefits, and advantages to customers. Experience enhanced performance, reliability, and efficiency with this innovative solution. Elevate your projects to new heights with the DSPIC33EP128GM710-E/PT and discover the difference that Microchip Technology can make for you.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the components inside, ensuring a longer lifespan for the product.

Surface Mount: YES

Surface mount technology allows for more compact and efficient designs, saving space and improving overall performance.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this DSP can handle a wider range of power inputs, making it versatile for different applications.

On Chip Data RAM Width: 8

The wide on-chip data RAM width allows for faster data processing and efficient handling of complex algorithms.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this DSP can withstand harsh conditions and provide reliable performance in challenging environments.

ROM Programmability: FLASH

Flash ROM programmability offers flexibility for users to update and customize the firmware as needed, making the product adaptable to changing requirements.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33EP128GM710-E/PT attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

60 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

4

No. of External Interrupts:

5

No. of Serial I/Os:

6

No. of Terminals:

100

No. of Timers:

15

On Chip Data RAM Width:

8

On Chip Program ROM Width:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP100,.55SQ,16

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Words:

16384

ROM Programmability:

FLASH

Screening Level:

AEC-Q100; TS 16949

Maximum Seated Height:

1.2 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

60 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

12 mm

Trade Compliance

DSPIC33EP128GM710-E/PT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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