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DSPIC30F3011-20E/ML

Microchip Technology

DSPIC30F3011-20E/ML by Microchip Technology

DSPIC30F3011-20E/ML by Microchip Technology is a 16-bit DSP with max clock freq of 40 MHz. Operating temp range -40 to 125 °C, suitable for automotive applications. Features flash ROM programmability, CMOS technology, and quad terminal position in a compact chip carrier package.

Median Price

$7.520

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 693 parts In-Stock

1+ parts

$7.520

100+ parts

$6.210

1k+ parts

$5.700

10k+ parts

$5.430

693

$7.520

$6.210

$5.700

$5.430

Mouser Electronics

USA . 97 parts In-Stock

1+ parts

$7.520

100+ parts

$6.760

1k+ parts

-

10k+ parts

-

97

$7.520

$6.760

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$6.696

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$6.696

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-

-

NAC Semi

USA . 495 parts In-Stock

1+ parts

$7.760

100+ parts

$7.040

1k+ parts

$6.440

10k+ parts

-

495

$7.760

$7.040

$6.440

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Vyrian

USA . 5,959 parts In-Stock

1+ parts

-

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5,959

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 72 parts In-Stock

1+ parts

$6.390

100+ parts

$6.230

1k+ parts

$6.198

10k+ parts

-

72

$6.390

$6.230

$6.198

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Corohmni

South Africa . 523 parts In-Stock

1+ parts

$6.515

100+ parts

-

1k+ parts

-

10k+ parts

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523

$6.515

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-

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Aranea Global

USA . 50 parts In-Stock

1+ parts

$6.562

100+ parts

-

1k+ parts

$6.300

10k+ parts

-

50

$6.562

-

$6.300

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Continental Prestige Electronics

USA . 6,305 parts In-Stock

1+ parts

$6.696

100+ parts

-

1k+ parts

-

10k+ parts

$6.562

6,305

$6.696

-

-

$6.562

AZTECH Wire

Italy . 755 parts In-Stock

1+ parts

$10.539

100+ parts

-

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10k+ parts

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755

$10.539

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-

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Aztec Data Supply Inc.

USA . 3,523 parts In-Stock

1+ parts

$58.503

100+ parts

-

1k+ parts

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3,523

$58.503

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-

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QUARKTWIN TECHNOLOGY LTD

USA . 22,888 parts In-Stock

1+ parts

-

100+ parts

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22,888

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Lixinc

USA . 19,602 parts In-Stock

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19,602

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Fulton Briggs Corp.

USA . 7,283 parts In-Stock

1+ parts

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7,283

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Argo Parts USA

USA . 2,801 parts In-Stock

1+ parts

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2,801

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Overview

Unleash the power of digital signal processing with the DSPIC30F3011-20E/ML by Microchip Technology. As a trusted name in the industry, Microchip delivers top-quality products that exceed expectations. This DSP is perfect for a wide range of applications, offering unmatched performance and reliability. With its advanced features and cutting-edge technology, this product provides exceptional value to customers looking to elevate their projects to the next level. Experience the difference with Microchip Technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the DSP, making it suitable for a variety of applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage ensures compatibility with a wide range of power sources.

Bit Size: 16

A 16-bit bit size allows for handling complex digital signal processing tasks effectively.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The compact and efficient package style allows for space-saving and efficient heat dissipation.

Maximum Clock Frequency: 40 MHz

High maximum clock frequency enables fast processing of signals and data.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature rating ensures reliability in harsh environmental conditions.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, CONTROLLER

Combining digital signal processing and controller capabilities makes this DSP versatile for various applications.

ROM Programmability: FLASH

Flash ROM programmability offers flexibility in updating and customizing the DSP's firmware.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC30F3011-20E/ML attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Additional Features:

ALSO OPERATES AT 3V MINIMUM SUPPLY AT 15 MHZ

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

40 MHz

External Data Bus Width:

0

Format:

FIXED POINT

JESD-30 Code:

S-PQCC-N44

JESD-609 Code:

e3

Length:

8 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

44

On Chip Program ROM Width:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC44,.31SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

8 mm

Trade Compliance

DSPIC30F3011-20E/ML Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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