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AX2000-FG896I

Microchip Technology

AX2000-FG896I by Microchip Technology

Microchip Technology's AX2000-FG896I FPGA offers 32256 logic cells, 21504 CLBs, and 2000000 equivalent gates. With a max clock frequency of 649 MHz, it is ideal for industrial applications requiring high-speed processing and complex logic operations. The package features a grid array style with PLASTIC/EPOXY material and measures 31mm in width and length.

Median Price

$1,729.040

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 440 parts In-Stock

1+ parts

$1,729.040

100+ parts

$1,681.010

1k+ parts

$1,090.380

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440

$1,729.040

$1,681.010

$1,090.380

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Distributors (In-Stock)

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NAC Semi

USA . 352 parts In-Stock

1+ parts

$1,613.760

100+ parts

$1,476.000

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352

$1,613.760

$1,476.000

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Vyrian

USA . 8,191 parts In-Stock

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VNN

France . 705 parts In-Stock

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Chip Stock

USA . 215 parts In-Stock

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215

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Digiode

USA . 101 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,443 parts In-Stock

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$22.000

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$22.000

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Semicontronic

India . 1,289 parts In-Stock

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$30.000

100+ parts

$29.250

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$29.100

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West Coast Incorporated

USA . 4,395 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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Corphita

USA . 445 parts In-Stock

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Netroflash

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Perfect Parts

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Overview

Experience the power of cutting-edge technology with the AX2000-FG896I by Microchip Technology. As a leader in the industry, Microchip Technology delivers top-quality Field Programmable Gate Arrays (FPGA) that are versatile and reliable for a wide range of applications. With 32256 logic cells and 21504 CLBs, this FPGA offers unmatched performance and flexibility. Trust Microchip Technology to provide you with the most advanced solutions that meet your needs, ensuring that you stay ahead of the competition. Unlock endless possibilities with the AX2000-FG896I and revolutionize your projects today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY body material ensures durability and reliability of the FPGA.

No. of Logic Cells: 32256

Large number of logic cells allows for complex designs and high-performance applications.

Surface Mount: YES

Surface mount capability makes it easy to integrate into circuit boards.

Maximum Supply Voltage: 1.575 V

The high maximum supply voltage allows for flexibility in power supply options.

Technology Used: CMOS

CMOS technology ensures low power consumption and high speed operation.

No. of Inputs: 684

Large number of inputs allow for versatile input configurations in designs.

Package Shape: SQUARE

Square package shape provides a compact form factor for space-constrained applications.

Form Of Terminal: BALL

Ball terminals offer reliable connections for easy integration into circuit boards.

No. of Equivalent Gates: 2000000

Large number of equivalent gates provides ample resources for complex logic functions.

Nominal Supply Voltage (V): 1.5

Stable nominal supply voltage ensures consistent performance.

Packing Method: TRAY

Tray packing method provides secure packaging for transportation and storage.

Power Supplies (V): 1.5,1.5/3.3,2.5/3.3

Multiple power supply options offer flexibility in design and integration.

No. of Terminals: 896

Large number of terminals allow for versatile connection options.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field programmable gate array allows for reconfigurability and flexibility in design.

Package Style (Meter): GRID ARRAY

Grid array package style provides a high density of terminals for connections.

Minimum Supply Voltage: 1.425 V

Low minimum supply voltage allows for efficient power consumption.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability in harsh environments.

Pitch Of Terminal: 1 mm

Narrow terminal pitch allows for high density packaging and compact designs.

Maximum Combinatorial Delay of a CLB: 0.99 ns

Low maximum combinatorial delay ensures high-speed operation.

Organization: 21504 CLBS, 2000000 GATES

Well-organized structure with a high number of CLBs and gates for efficient design implementation.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for use in a wide range of environments.

Finishing Of Terminal Used: TIN LEAD

Tin lead finishing on terminals provides good solderability for reliable connections.

Position Of Terminal: BOTTOM

Bottom terminal positioning facilitates easy integration and connection in circuit designs.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 indicates robustness against moisture exposure.

Maximum Seated Height: 2.44 mm

Low maximum seated height allows for slim and compact designs.

Width: 31 mm

31mm width provides a compact form factor for space-constrained applications.

Maximum Clock Frequency: 649 MHz

High maximum clock frequency allows for high-speed operation and performance.

No. of Outputs: 684

Large number of outputs provide flexibility in output configurations.

Length: 31 mm

31mm length provides a compact form factor for space-constrained applications.

Grading Of Temperature: INDUSTRIAL

Industrial temperature grading ensures reliability in harsh operating conditions.

Technical Specifications

Field Programmable Gate Arrays (FPGA) AX2000-FG896I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of Logic Cells:

32256

No. of Inputs:

684

No. of Outputs:

684

No. of CLBs:

21504

No. of Equivalent Gates:

2000000

Maximum Clock Frequency:

649 MHz

CLB Maximum Delay:

0.99 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

21504 CLBS, 2000000 Gates

Additional Features:

2000000 system gates avaiable

Power Characteristics

Nominal Supply Voltage:

1.5

Minimum Supply Voltage:

1.425 V

Maximum Supply Voltage:

1.575 V

Power Supplies:

1.5,1.5/3.3,2.5/3.3 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

31 mm

Width:

31 mm

Maximum Seated Height:

2.44 mm

Packing Method:

Tray

Package Equivalence Code:

BGA896,30X30,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Lead

Terminal Pitch:

1 mm

No. of Terminals:

896

Standards

JESD-30 Code:

S-PBGA-B896

JESD-609 Code:

e0

Qualified:

No

Trade Compliance

AX2000-FG896I Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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