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AX2000-1CQ352M

Microchip Technology

AX2000-1CQ352M by Microchip Technology

Microchip Technology's AX2000-1CQ352M FPGA features 32256 logic cells, 21504 CLBs, and 2000000 equivalent gates. Ideal for military applications with MIL-STD-883 Class B screening level, it operates at a max clock frequency of 763 MHz and supports a wide range of power supplies from 1.5V to 2.5/3.3V.

Median Price

$24,343.190

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 7 parts In-Stock

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$24,343.190

100+ parts

$23,666.990

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$15,351.560

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7

$24,343.190

$23,666.990

$15,351.560

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Distributors (In-Stock)

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Digiode

USA . 427 parts In-Stock

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$23,126.030

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Vyrian

USA . 7,300 parts In-Stock

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VNN

France . 2,828 parts In-Stock

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Chip Stock

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Nova Conductors

Japan . 500 parts In-Stock

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ComSIT Distribution GmbH

Germany . 3 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 38 parts In-Stock

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$53.450

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Advanced Electronics

New Zealand . 2,138 parts In-Stock

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$125.677

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$114.366

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$103.055

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Ampacity Inc.

Singapore . 7 parts In-Stock

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$20,691.710

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Semicontronic

India . 7 parts In-Stock

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$20,691.710

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$20,174.417

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$20,070.959

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Corphita

USA . 325 parts In-Stock

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$21,908.871

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Component Stockers USA

USA . 9 parts In-Stock

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Microchip USA

USA . 205 parts In-Stock

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Marpe Global Electronics

Taiwan . 7,133 parts In-Stock

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QualityLine Systems

Poland . 7,133 parts In-Stock

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XL Components Corporation

Australia . 7,133 parts In-Stock

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Argo Parts USA

USA . 3,024 parts In-Stock

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Continental Prestige Electronics

USA . 2,932 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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Overview

Unleash the power of advanced technology with Microchip Technology's AX2000-1CQ352M Field Programmable Gate Array. This cutting-edge product boasts exceptional quality and reliability, meeting MIL-STD-883 Class B screening standards. With a staggering 2,000,000 equivalent gates and 76MHz maximum clock frequency, this FPGA is designed to deliver unparalleled performance in a variety of applications. From aerospace to telecommunications, the AX2000-1CQ352M offers customers unmatched value, flexibility, and efficiency. Elevate your projects to new heights with Microchip Technology's innovative FPGA solution.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material provides durability and protection for the internal components, making the FPGA suitable for rugged environments.

No. of Logic Cells: 32256

High number of logic cells allow for complex logic operations to be implemented, making the FPGA versatile for various applications.

Maximum Supply Voltage: 1.575 V

Efficient power consumption at a low voltage, contributing to energy efficiency in the system.

Screening Level: MIL-STD-883 Class B

Compliance with military standards ensures reliability and performance in demanding conditions.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the overall performance of the FPGA.

No. of Inputs: 684

Having a high number of inputs allows for a wide range of external connectivity options, enabling versatile input configurations.

Maximum Clock Frequency: 763 MHz

High clock frequency supports fast operation and real-time processing of data, making the FPGA suitable for time-critical applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) AX2000-1CQ352M attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of Logic Cells:

32256

No. of Inputs:

684

No. of Outputs:

684

No. of CLBs:

21504

No. of Equivalent Gates:

2000000

Maximum Clock Frequency:

763 MHz

CLB Maximum Delay:

0.84 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

21504 CLBS, 2000000 Gates

Additional Features:

2000000 system gates avaiable

Power Characteristics

Nominal Supply Voltage:

1.5

Minimum Supply Voltage:

1.425 V

Maximum Supply Voltage:

1.575 V

Power Supplies:

1.5,1.5/3.3,2.5/3.3 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Ceramic, Metal-Sealed Cofired

Surface Mountable:

Yes

Package Style:

Flatpack, Guard Ring

Package Code:

Package Shape:

Length:

48 mm

Width:

48 mm

Maximum Seated Height:

2.89 mm

Package Equivalence Code:

TPAK352,2.9SQ,20

Terminal Characteristcs

Terminal Position:

Quad

Terminal Style:

Terminal Finish:

Tin Lead

Terminal Pitch:

.5 mm

No. of Terminals:

352

Standards

JESD-30 Code:

S-CQFP-F352

JESD-609 Code:

e0

Qualified:

No

Screening Level:

MIL-STD-883 Class B

Trade Compliance

AX2000-1CQ352M Programmable ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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