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A3PN010-QNG48I

Microchip Technology

A3PN010-QNG48I by Microchip Technology

A3PN010-QNG48I by Microchip Technology is a CMOS-based Field Programmable Gate Array (FPGA) with 260 logic cells. It operates at a nominal voltage of 1.5V and has 34 inputs and outputs. This FPGA is suitable for industrial applications requiring high gate count and low power consumption.

Median Price

$2.902

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 550 parts In-Stock

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$2.902

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VNN

France . 666 parts In-Stock

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666

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Digiode

USA . 435 parts In-Stock

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435

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Vyrian

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Continental Prestige Electronics

USA . 3,338 parts In-Stock

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$2.902

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$2.844

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Argo Parts USA

USA . 1,101 parts In-Stock

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Netroflash

USA . 500 parts In-Stock

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$2.902

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$2.844

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$2.844

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AZTECH Wire

Italy . 322 parts In-Stock

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$17.665

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Ampacity Inc.

Singapore . 340 parts In-Stock

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$29.000

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Semicontronic

India . 378 parts In-Stock

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$34.000

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$33.150

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$32.980

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Corohmni

South Africa . 984 parts In-Stock

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Aztec Data Supply Inc.

USA . 3,521 parts In-Stock

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Microchip USA

USA . 2,697 parts In-Stock

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RGB Technical Solutions

Ukraine . 1,246 parts In-Stock

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Perfect Parts

USA . 1,120 parts In-Stock

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Component Stockers USA

USA . 466 parts In-Stock

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Corphita

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Overview

Experience the power of cutting-edge technology with the A3PN010-QNG48I by Microchip Technology. As a leading manufacturer in the industry, Microchip Technology delivers superior quality and reliability, ensuring that our products surpass all expectations. The A3PN010-QNG48I falls under the category of Field Programmable Gate Arrays (FPGA), offering endless possibilities for customization and adaptability. With 260 logic cells and 10,000 equivalent gates, this FPGA provides unmatched performance and flexibility. Whether you're designing advanced electronics or optimizing complex systems, the A3PN010-QNG48I is the perfect solution. Discover innovation at its finest with Microchip Technology.

Feature Benefit Bullets

No. of Logic Cells: 260

This FPGA has a sufficient number of logic cells for small to medium scale logic designs, making it a versatile choice for various applications.

Surface Mount: YES

Surface mount technology allows for easy mounting on circuit boards, saving space and facilitating automated assembly processes.

Maximum Supply Voltage: 1.575 V

With a low maximum supply voltage, this FPGA offers power-efficient operation, reducing energy consumption and heat generation.

Technology Used: CMOS

CMOS technology provides low power consumption, high noise immunity, and good speed performance, making this FPGA suitable for a range of applications.

No. of Inputs: 34

Having 34 inputs allows for flexibility in connecting external signals and data sources to the FPGA, enabling complex logic operations to be performed.

Package Shape: SQUARE

A square package shape can simplify PCB layout and routing, ensuring efficient use of space on the circuit board.

Form Of Terminal: NO LEAD

No-lead terminals provide improved reliability and thermal performance, making the FPGA suitable for demanding applications where high reliability is essential.

No. of Equivalent Gates: 10000

With 10,000 equivalent gates, this FPGA offers a good balance of logic capacity and complexity, allowing for the implementation of moderately complex designs.

Nominal Supply Voltage (V): 1.5

The nominal supply voltage of 1.5 V ensures compatibility with standard power supply voltages, simplifying integration into existing systems.

No. of Terminals: 48

Having 48 terminals provides ample connectivity options for interfacing with external components or systems, making this FPGA versatile in various applications.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field programmable device, this FPGA offers flexibility and reconfigurability, allowing for rapid prototyping and customization of logic functions.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles offers enhanced thermal management and compatibility with different mounting configurations.

Minimum Supply Voltage: 1.425 V

The low minimum supply voltage of 1.425 V provides flexibility in power supply design, allowing for operation in low-power environments.

Maximum Operating Temperature: 100 °C

With a maximum operating temperature of 100 °C, this FPGA is suitable for industrial environments where higher temperatures may be encountered.

Pitch Of Terminal: 0.4 mm

Having a pitch of 0.4 mm between terminals allows for high-density packaging and compact layout designs, optimizing space utilization on the PCB.

Organization: 10000 GATES

Organized into 10,000 gates, this FPGA offers a structured and scalable architecture for implementing various logic functions efficiently.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this FPGA is suitable for use in cold environments or applications where temperature fluctuations occur.

Position Of Terminal: QUAD

Quad position terminals allow for stable and secure connections, ensuring reliable operation of the FPGA in diverse environmental conditions.

Moisture Sensitivity Level (MSL): 3

A moisture sensitivity level of 3 indicates that this FPGA can withstand moderate exposure to moisture during storage or operation, enhancing its reliability.

Maximum Seated Height: 1 mm

With a maximum seated height of 1 mm, this FPGA can be used in slim-profile designs or applications where space constraints are a concern.

Width: 6 mm

The compact width of 6 mm makes this FPGA suitable for applications requiring a small footprint on the PCB, enabling space-efficient design layouts.

No. of Outputs: 34

Having 34 outputs allows for the FPGA to drive multiple external devices or subsystems, enabling complex logic functions to be implemented and controlled.

Length: 6 mm

With a length of 6 mm, this FPGA offers a square form factor that simplifies mounting and integration into various electronic systems or devices.

Grading Of Temperature: INDUSTRIAL

The industrial temperature grading ensures reliable operation of the FPGA in harsh and demanding environments, making it suitable for industrial applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) A3PN010-QNG48I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of Logic Cells:

260

No. of Inputs:

34

No. of Outputs:

34

No. of Equivalent Gates:

10000

Technology:

CMOS

Organization:

10000 Gates

Power Characteristics

Nominal Supply Voltage:

1.5

Minimum Supply Voltage:

1.425 V

Maximum Supply Voltage:

1.575 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Surface Mountable:

Yes

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Code:

Package Shape:

Length:

6 mm

Width:

6 mm

Maximum Seated Height:

1 mm

Package Equivalence Code:

LCC48,.24SQ,16

Terminal Characteristcs

Terminal Position:

Quad

Terminal Style:

Terminal Pitch:

.4 mm

No. of Terminals:

48

Standards

JESD-30 Code:

S-XQCC-N48

Qualified:

No

Trade Compliance

A3PN010-QNG48I Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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