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A3PN010-QNG48

Microchip Technology

A3PN010-QNG48 by Microchip Technology

Microchip Technology's A3PN010-QNG48 is a CMOS FPGA with 260 logic cells and 10000 equivalent gates. It operates b/w -20 to 85 °C, with supply voltage range of 1.425V to 1.575V. Ideal for applications requiring high gate count in compact form factor like IoT devices and industrial automation systems.

Median Price

$3.880

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Flip Electronics

USA . 100,249 parts In-Stock

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Nova Conductors

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Vyrian

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France . 608 parts In-Stock

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Digiode

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Ashlea Components Ltd

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Ampacity Inc.

Singapore . 833 parts In-Stock

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AZTECH Wire

Italy . 579 parts In-Stock

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Semicontronic

India . 487 parts In-Stock

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$15.520

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Corohmni

South Africa . 573 parts In-Stock

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Aztec Data Supply Inc.

USA . 1,803 parts In-Stock

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GreenTree Electronics

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Marpe Global Electronics

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Continental Prestige Electronics

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XL Components Corporation

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Argo Parts USA

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QualityLine Systems

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Microchip USA

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Bastille Electronics

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Corphita

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Overview

Looking for a high-quality Field Programmable Gate Array? Look no further than the A3PN010-QNG48 by Microchip Technology. With 260 logic cells and 10,000 equivalent gates, this FPGA is perfect for applications requiring flexibility and customization. Its CMOS technology ensures reliable performance, while its compact square shape makes it easy to integrate into any project. Trust in Microchip's reputation for excellence and choose the A3PN010-QNG48 for your next design. Unlock endless possibilities with this innovative and versatile FPGA!

Feature Benefit Bullets

No. of Logic Cells: 260

The high number of logic cells allows for complex programmable designs to be implemented efficiently.

Maximum Supply Voltage: 1.575 V

The ability to handle a relatively high supply voltage provides flexibility in powering the device.

Technology Used: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology offers low power consumption and high noise immunity, making the device energy efficient.

No. of Inputs: 34

Sufficient number of inputs for versatile input requirements in programmable logic applications.

Package Shape: SQUARE

The square shape provides easy placement and integration into circuit boards.

No. of Equivalent Gates: 10000

Large number of equivalent gates allows for complex logic functions to be implemented.

Nominal Supply Voltage (V): 1.5

The nominal supply voltage provides a standard operating range for the device.

No. of Terminals: 48

Sufficient number of terminals for connecting input and output signals.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The multiple package styles offer flexibility in mounting and thermal management options.

Minimum Supply Voltage: 1.425 V

The low minimum supply voltage allows for operation at lower power levels.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range ensures reliable operation in various environmental conditions.

Pitch Of Terminal: 0.4 mm

The small pitch of terminals allows for compact packaging and space-saving designs.

Organization: 10000 GATES

The organizational structure with 10,000 gates provides ample resources for complex logic processing tasks.

Minimum Operating Temperature: -20 °C

The low minimum operating temperature ensures reliable performance even in colder environments.

Position Of Terminal: QUAD

The quad terminal positioning facilitates easy connection and layout in circuit designs.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 indicates moderate sensitivity to moisture, requiring appropriate handling during assembly.

Maximum Seated Height: 1 mm

The low maximum seated height allows for compact device integration in space-constrained applications.

Width: 6 mm

The compact width enables easy placement and routing on circuit boards.

No. of Outputs: 34

Sufficient number of outputs for diverse output requirements in programmable logic applications.

Length: 6 mm

The compact length enables space-efficient design and integration in electronic systems.

Technical Specifications

Field Programmable Gate Arrays (FPGA) A3PN010-QNG48 attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of Logic Cells:

260

No. of Inputs:

34

No. of Outputs:

34

No. of Equivalent Gates:

10000

Technology:

CMOS

Organization:

10000 Gates

Power Characteristics

Nominal Supply Voltage:

1.5

Minimum Supply Voltage:

1.425 V

Maximum Supply Voltage:

1.575 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-20 °C (-4 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Surface Mountable:

Yes

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Code:

Package Shape:

Length:

6 mm

Width:

6 mm

Maximum Seated Height:

1 mm

Package Equivalence Code:

LCC48,.24SQ,16

Terminal Characteristcs

Terminal Position:

Quad

Terminal Style:

Terminal Pitch:

.4 mm

No. of Terminals:

48

Standards

JESD-30 Code:

S-XQCC-N48

Qualified:

No

Trade Compliance

A3PN010-QNG48 Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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