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93AA46AT-I/OTG

Microchip Technology

93AA46AT-I/OTG by Microchip Technology

93AA46AT-I/OTG by Microchip Tech is a 1024-bit EEPROM with 128x8 organization, operating at 1MHz. It has software write protection, industrial temp grade, and Microwire serial bus type. Ideal for applications requiring low-profile memory storage in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

VNN

France . 1,899 parts In-Stock

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1,899

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Vyrian

USA . 1,235 parts In-Stock

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1,235

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Nova Conductors

Japan . 88 parts In-Stock

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88

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 371 parts In-Stock

1+ parts

$3.000

100+ parts

$2.925

1k+ parts

$2.910

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371

$3.000

$2.925

$2.910

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Aztec Data Supply Inc.

USA . 3,577 parts In-Stock

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$3.420

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3,577

$3.420

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Corohmni

South Africa . 532 parts In-Stock

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$5.399

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532

$5.399

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Ampacity Inc.

Singapore . 647 parts In-Stock

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$6.000

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647

$6.000

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AZTECH Wire

Italy . 399 parts In-Stock

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$14.724

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399

$14.724

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Argo Parts USA

USA . 2,829 parts In-Stock

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Continental Prestige Electronics

USA . 2,358 parts In-Stock

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West Coast Incorporated

USA . 2,298 parts In-Stock

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Bastille Electronics

Australia . 22 parts In-Stock

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Overview

Discover the power of the 93AA46AT-I/OTG by Microchip Technology, a high-quality EEPROM that offers unparalleled reliability and performance. With its innovative design and industrial-grade technology, this product is perfect for a wide range of applications. From automotive to industrial automation, this compact device provides value and benefits like no other. Trust in Microchip Technology to deliver top-notch products that exceed expectations. Get your hands on the 93AA46AT-I/OTG today and experience the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection for the EEPROM chip, making it a reliable choice for various applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient integration into electronic circuit boards, saving space and simplifying assembly processes.

Operating Mode: SYNCHRONOUS

Synchronous operation provides precise timing and control over data transfer, enhancing the overall performance of the EEPROM.

Nominal Supply Voltage / Vsup (V): 2.5

Operating at a nominal supply voltage of 2.5V makes this EEPROM compatible with a wide range of electronic devices and systems.

Power Supplies (V): 2/5

Supporting dual power supplies of 2V and 5V provides flexibility in voltage options for different applications, making it versatile.

Write Protection: SOFTWARE

The software-based write protection feature adds an extra layer of security to prevent unauthorized data modification, ensuring data integrity.

Memory Density: 1024 bit

With a high memory density of 1024 bits, this EEPROM can store a significant amount of data, suitable for various storage needs.

Endurance: 1000000 Write/Erase Cycles

Having a high endurance of 1,000,000 write/erase cycles ensures long-lasting performance and reliability for frequent data updates.

Serial Bus Type: MICROWIRE

The use of Microwire serial bus type allows for efficient and fast data communication, enhancing the overall operational speed of the EEPROM.

Technical Specifications

EEPROM 93AA46AT-I/OTG attributes and parameters. Explore more EEPROM devices from Microchip Technology

Specs

Maximum Clock Frequency (fCLK):

1 MHz

Minimum Data Retention Time:

200

Endurance:

1000000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Length:

2.9 mm

Memory Density:

1024 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

No. of Words:

128 words

No. of Words Code:

128

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128X8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5

Qualification:

Not Qualified

Maximum Seated Height:

1.45 mm

Serial Bus Type:

MICROWIRE

Maximum Standby Current:

.000001 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

2 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.8 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

1.55 mm

Maximum Write Cycle Time (tWC):

6 ms

Write Protection:

SOFTWARE

Trade Compliance

93AA46AT-I/OTG Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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