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93AA46C-I/P

Microchip Technology

93AA46C-I/P by Microchip Technology

93AA46C-I/P by Microchip Technology is an EEPROM with 64x16 organization, operating at 2.5V, and featuring a max clock frequency of 3 MHz. It is used in industrial applications for software write protection and offers a memory density of 1024 bit.

Median Price

$0.420

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 295 parts In-Stock

1+ parts

$0.420

100+ parts

$0.390

1k+ parts

$0.370

10k+ parts

$0.360

295

$0.420

$0.390

$0.370

$0.360

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

NAC Semi

USA . 1,080 parts In-Stock

1+ parts

$0.380

100+ parts

$0.350

1k+ parts

$0.310

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-

1,080

$0.380

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$0.310

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Chip Stock

USA . 2,940 parts In-Stock

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2,940

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VNN

France . 2,341 parts In-Stock

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2,341

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Vyrian

USA . 1,938 parts In-Stock

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Nova Conductors

Japan . 90 parts In-Stock

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90

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,114 parts In-Stock

1+ parts

$0.357

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1,114

$0.357

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Corohmni

South Africa . 169 parts In-Stock

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$4.320

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169

$4.320

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AZTECH Wire

Italy . 455 parts In-Stock

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$17.960

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455

$17.960

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Continental Prestige Electronics

USA . 4,129 parts In-Stock

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Argo Parts USA

USA . 3,508 parts In-Stock

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RGB Technical Solutions

Ukraine . 2,821 parts In-Stock

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Perfect Parts

USA . 1,466 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

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Overview

Unlock the power of reliable data storage with the 93AA46C-I/P by Microchip Technology. Designed with precision and quality in mind, this EEPROM offers unmatched durability and performance for a wide range of applications. Whether you're in need of secure data storage or efficient system operation, this product delivers exceptional value, benefits, and advantages that cater to your unique needs. Trust in Microchip Technology to provide top-of-the-line solutions that elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the EEPROM, ensuring long-lasting performance.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for precise timing and data transfer, enhancing reliability and efficiency.

Nominal Supply Voltage / Vsup (V): 2.5

The 2.5V supply voltage is suitable for various applications, providing a stable power source for the EEPROM.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this EEPROM can function effectively in industrial environments with elevated temperatures.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this EEPROM energy-efficient and reliable.

Endurance: 1000000 Write/Erase Cycles

The high endurance of 1,000,000 write/erase cycles ensures longevity and reliability for frequent data read/write operations.

Technical Specifications

EEPROM 93AA46C-I/P attributes and parameters. Explore more EEPROM devices from Microchip Technology

Specs

Alternate Memory Width:

8

Maximum Clock Frequency (fCLK):

3 MHz

Minimum Data Retention Time:

200

Endurance:

1000000 Write/Erase Cycles

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e3

Length:

9.27 mm

Memory Density:

1024 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

8

No. of Words:

64 words

No. of Words Code:

64

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

64X16

Output Characteristics:

TOTEM POLE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Parallel or Serial:

SERIAL

Power Supplies (V):

2/5

Qualification:

Not Qualified

Ready or Busy:

YES

Reverse Pinout:

NO

Screening Level:

TS 16949

Maximum Seated Height:

5.334 mm

Serial Bus Type:

MICROWIRE

Maximum Standby Current:

.000001 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

2 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.8 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Maximum Write Cycle Time (tWC):

6 ms

Write Protection:

SOFTWARE

Trade Compliance

93AA46C-I/P Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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