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RC28F640J3D-75

Intel

RC28F640J3D-75 by Intel

The Intel RC28F640J3D-75 is a 64-terminal NOR flash memory with 4MX16 organization, operating at -40 to 85°C. It features a page size of 4/8 words and sector size of 128K words, suitable for industrial applications requiring fast access time of 75 ns. With parallel interface and common flash interface support, it offers high memory density of 67108864 bits in a compact GRID ARRAY package.

Median Price

$2.551

Lifecycle Status

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18

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Freelance Electronics

USA . 1 parts In-Stock

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Cyclops Electronics Ltd

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Vyrian

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Digiode

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Prism Electronics

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Maverick Electronics, Inc.

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Sea View Technologies

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Sunrise Surplus Inc.

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Nova Conductors

Japan . 50 parts In-Stock

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Connector Distribution Corp

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Right Parts Inc.

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Fibra_Brandt Electronic GMBH

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Rotakorn

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Bristol Electronics

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BCID Electronics Ltd.

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Carlin Systems, Inc.

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MARBEL Systems

Belgium . 519 parts In-Stock

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Texas Native Microelectronics

USA . 800 parts In-Stock

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$3.878

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$3.607

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$3.413

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Kenton Components

USA . 4,692 parts In-Stock

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$4.654

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Qasali Group International

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Ampacity Inc.

Singapore . 1,204 parts In-Stock

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Perfect Parts

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Argo Parts USA

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Continental Prestige Electronics

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A-Z Elektronik GmbH

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Corphita

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Lixinc

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GreenTree Electronics

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Aranea Global

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Schahn Electronic Components

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Overview

Unlock new possibilities with the Intel RC28F640J3D-75 Flash Memory. Crafted with precision by industry leader Intel, this high-quality memory device offers unparalleled performance and reliability for a wide range of applications. Whether you're looking to enhance your storage capabilities or boost system speed, this product delivers exceptional value and benefits. Trust Intel to provide cutting-edge technology that meets your needs and exceeds your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material provides durability and helps in reducing the overall weight of the product.

Surface Mount: YES

Easy installation on circuit boards without the need for additional mounting hardware.

Operating Mode: ASYNCHRONOUS

Allows for independent operation, enhancing performance and flexibility.

Nominal Supply Voltage / Vsup (V): 3

Efficient power usage at the specified voltage level.

Width: 10 mm

Compact size suitable for a variety of applications and space constraints.

Memory Density: 67108864 bit

High memory density allows for storing large amounts of data in a compact form.

Maximum Access Time: 75 ns

Fast access time ensures quick retrieval of data, enhancing performance.

Technical Specifications

Flash Memory RC28F640J3D-75 attributes and parameters. Explore more Flash Memory devices from Intel

Specs

Maximum Access Time:

75 ns

Alternate Memory Width:

8

Command User Interface:

YES

Common Flash Interface:

YES

Data Polling:

NO

JESD-30 Code:

R-PBGA-B64

JESD-609 Code:

e0

Length:

13 mm

Memory Density:

67108864 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Sectors/Size:

64

No. of Terminals:

64

No. of Words:

4194304 words

No. of Words Code:

4M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

4MX16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA64,8X8,40

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE

Page Size (words):

4/8

Parallel or Serial:

PARALLEL

Power Supplies (V):

3/3.3

Programming Voltage (V):

2.7

Qualification:

Not Qualified

Ready or Busy:

YES

Maximum Seated Height:

1.2 mm

Sector Size (Words):

128K

Maximum Standby Current:

.00012 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

80 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

BALL

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Toggle Bit:

NO

Type:

NOR TYPE

Width:

10 mm

Trade Compliance

RC28F640J3D-75 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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