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S25FL256SAGMFM000

Infineon Technologies

S25FL256SAGMFM000 by Infineon Technologies

The Infineon Technologies S25FL256SAGMFM000 is a 64MX4 flash memory with 268MB density. Operating at 133MHz, it has a clock frequency of 133 MHz and supports synchronous mode. With automotive temperature grade, it's ideal for applications requiring high-speed data storage in compact designs.

Median Price

$6.085

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 77 parts In-Stock

1+ parts

$5.398

100+ parts

$4.863

1k+ parts

$4.448

10k+ parts

$4.215

77

$5.398

$4.863

$4.448

$4.215

Farnell

UK . 165 parts In-Stock

1+ parts

$5.710

100+ parts

$4.920

1k+ parts

$4.640

10k+ parts

-

165

$5.710

$4.920

$4.640

-

Newark

USA . 199 parts In-Stock

1+ parts

$5.980

100+ parts

$5.270

1k+ parts

$4.860

10k+ parts

-

199

$5.980

$5.270

$4.860

-

Chip1Stop

Japan . 246 parts In-Stock

1+ parts

$6.190

100+ parts

-

1k+ parts

-

10k+ parts

-

246

$6.190

-

-

-

DigiKey

USA . 85 parts In-Stock

1+ parts

$6.400

100+ parts

$5.648

1k+ parts

$5.134

10k+ parts

$5.038

85

$6.400

$5.648

$5.134

$5.038

Mouser Electronics

USA . 532 parts In-Stock

1+ parts

$6.720

100+ parts

$5.790

1k+ parts

$5.460

10k+ parts

$5.330

532

$6.720

$5.790

$5.460

$5.330

RS (Exports)

UK . 26 parts In-Stock

1+ parts

$9.731

100+ parts

$7.559

1k+ parts

-

10k+ parts

-

26

$9.731

$7.559

-

-

Element14

Singapore . 165 parts In-Stock

1+ parts

$10.240

100+ parts

$9.000

1k+ parts

$8.680

10k+ parts

-

165

$10.240

$9.000

$8.680

-

Rochester

USA . 292 parts In-Stock

1+ parts

-

100+ parts

$3.560

1k+ parts

$3.190

10k+ parts

$3.000

292

-

$3.560

$3.190

$3.000

Verical

USA . 292 parts In-Stock

1+ parts

-

100+ parts

$4.250

1k+ parts

$3.800

10k+ parts

$3.575

292

-

$4.250

$3.800

$3.575

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 430 parts In-Stock

1+ parts

$6.070

100+ parts

-

1k+ parts

-

10k+ parts

-

430

$6.070

-

-

-

Nova Conductors

Japan . 450 parts In-Stock

1+ parts

$8.069

100+ parts

-

1k+ parts

-

10k+ parts

-

450

$8.069

-

-

-

Bristol Electronics

USA . 960 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

960

-

-

-

-

Vyrian

USA . 249 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

249

-

-

-

-

Electronics Depot

USA . 23 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

23

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 517 parts In-Stock

1+ parts

$5.751

100+ parts

-

1k+ parts

-

10k+ parts

-

517

$5.751

-

-

-

Aztec Data Supply Inc.

USA . 301 parts In-Stock

1+ parts

$5.783

100+ parts

-

1k+ parts

-

10k+ parts

-

301

$5.783

-

-

-

Ampacity Inc.

Singapore . 289 parts In-Stock

1+ parts

$6.020

100+ parts

-

1k+ parts

-

10k+ parts

-

289

$6.020

-

-

-

Component Stockers USA

USA . 6,393 parts In-Stock

1+ parts

$7.220

100+ parts

$6.780

1k+ parts

$6.910

10k+ parts

-

6,393

$7.220

$6.780

$6.910

-

Continental Prestige Electronics

USA . 4,603 parts In-Stock

1+ parts

$7.494

100+ parts

-

1k+ parts

-

10k+ parts

$7.344

4,603

$7.494

-

-

$7.344

Modulus Dynamics

Lithuania . 3,013 parts In-Stock

1+ parts

$7.650

100+ parts

$7.344

1k+ parts

$7.038

10k+ parts

-

3,013

$7.650

$7.344

$7.038

-

Authorized Procurement Solutions

USA . 7,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,000

-

-

-

-

Argo Parts USA

USA . 3,512 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,512

-

-

-

-

Netroflash

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

$7.908

1k+ parts

$7.666

10k+ parts

$7.504

2,000

-

$7.908

$7.666

$7.504

Overview

Unlock the power of reliable and high-quality flash memory with the S25FL256SAGMFM000 from Infineon Technologies. Designed with cutting-edge technology and built to automotive grade standards, this compact memory solution offers seamless operation in a variety of applications. Whether you're looking to enhance your automotive electronics, IoT devices, or industrial systems, this flash memory provides fast and efficient data storage with a maximum clock frequency of 133 MHz. Trust in the value and performance that Infineon Technologies delivers with the S25FL256SAGMFM000.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, making the product long-lasting and reliable.

Surface Mount: YES

Allows for easy installation on circuit boards, simplifying the manufacturing process.

Operating Mode: SYNCHRONOUS

Enables synchronous data transfers for faster and more efficient performance.

Nominal Supply Voltage / Vsup (V): 3

Consistent and stable voltage supply ensures reliable operation of the flash memory.

Maximum Operating Temperature: 125 °C

Can operate in high temperature environments, suitable for automotive applications.

Minimum Operating Temperature: -40 °C

Can withstand low temperatures, making it versatile for various operating conditions.

Technology: CMOS

Utilizes CMOS technology for low power consumption and efficient operation.

Memory IC Type: FLASH

Flash memory offers fast read/write speeds and non-volatile storage, making it ideal for data storage applications.

Technical Specifications

Flash Memory S25FL256SAGMFM000 attributes and parameters. Explore more Flash Memory devices from Infineon Technologies

Specs

Additional Features:

ALSO CONFIGURABLE AS 256M X 1

Alternate Memory Width:

2

Maximum Clock Frequency (fCLK):

133 MHz

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

10.3 mm

Memory Density:

268435456 bit

Memory IC Type:

Memory Width:

4

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

No. of Words:

67108864 words

No. of Words Code:

64M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

64MX4

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Programming Voltage (V):

3

Screening Level:

AEC-Q100

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Maximum Write Cycle Time (tWC):

500 ms

Trade Compliance

S25FL256SAGMFM000 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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