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GCIXP1200FB

Intel

GCIXP1200FB by Intel

The Intel GCIXP1200FB microprocessor features 32-bit address and data bus width, with a max clock frequency of 200 MHz. It is designed for commercial applications requiring a low-profile grid array package style and operates at temperatures ranging from 0 to 70°C.

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Digiode

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Electronics Depot

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A2Z Electronics, Inc.

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MRC Electronics

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Lighthouse Electronics, Inc.

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Nova Conductors

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Classic Components Corporation

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Ampacity Inc.

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MARBEL Systems

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Overview

Discover the power and performance of the Intel GCIXP1200FB microprocessor, a cutting-edge technology manufactured by Intel known for its reliability and innovation. Ideal for a wide range of applications, this processor offers seamless integration and enhanced efficiency. From faster processing speeds to advanced features, this product delivers exceptional value and benefits to customers looking to optimize their systems. Upgrade to the Intel GCIXP1200FB and experience the next level of computing excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good durability and protection for the microprocessor, making it reliable for long-term use.

Integrated Cache: YES

Having integrated cache helps improve the overall performance and efficiency of the microprocessor by reducing memory access time.

Maximum Supply Voltage: 2.1 V

Operating within the specified voltage range ensures the stability and functionality of the microprocessor.

Address Bus Width: 32

A wider address bus width allows for more efficient data processing and communication within the system.

Package Shape: SQUARE

Square package shape is space-efficient and allows for easy placement on a circuit board.

Power Supplies (V): 2,3.3

Support for multiple power supply voltages offers flexibility in system design and compatibility with different power sources.

No. of Terminals: 432

High number of terminals provide connection options and support for various input and output devices.

Package Style (Meter): GRID ARRAY, LOW PROFILE

Grid array package style with low profile design enables efficient heat dissipation and space-saving on the PCB.

Minimum Supply Voltage: 1.9 V

Having a low minimum supply voltage allows for energy-efficient operation and extends battery life in portable devices.

Maximum Operating Temperature: 70 °C

Ability to operate at high temperatures ensures reliability and stable performance in demanding environments.

Minimum Operating Temperature: 0 °C

Operating at low temperatures without issues makes the microprocessor suitable for a wide range of applications and environments.

Terminal Position: BOTTOM

Bottom terminal position simplifies the installation and connection process on the PCB.

Maximum Seated Height: 1.67 mm

Low seated height of the package enables compact and slim device designs.

Width: 40 mm

Compact width dimension allows for easy integration into different system configurations.

Boundary Scan: YES

Boundary scan capability helps in testing and debugging the microprocessor during production and maintenance.

External Data Bus Width: 32

Matching external data bus width with the address bus width ensures efficient data transfer and processing capabilities.

Maximum Clock Frequency: 200 MHz

High maximum clock frequency enables fast data processing and execution speed for applications requiring real-time performance.

Length: 40 mm

Compact length dimension facilitates space-saving integration in various electronic devices.

Temperature Grade: COMMERCIAL

Commercial temperature grade indicates suitability for standard operating conditions in commercial applications.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC microprocessor with peripheral IC type allows for efficient and streamlined instruction execution.

Technology: CMOS

CMOS technology offers low power consumption and high speed performance, making the microprocessor energy-efficient and reliable.

Terminal Form: BALL

Ball terminal form provides reliable connections and facilitates soldering during the assembly process.

Nominal Supply Voltage: 2 V

Having a stable nominal supply voltage ensures consistent and reliable performance of the microprocessor.

Terminal Pitch: 1.27 mm

Optimal terminal pitch allows for easy mounting and soldering, enhancing the manufacturability of the product.

Format: FIXED POINT

Fixed-point format simplifies arithmetic operations and enhances the computational efficiency of the microprocessor.

Speed: 200 rpm

High speed capability of 200 rpm enables rapid data processing and execution for time-sensitive applications.

Technical Specifications

Microprocessors GCIXP1200FB attributes and parameters. Explore more Microprocessors devices from Intel

Specs

Address Bus Width:

32

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

200 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B432

Length:

40 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

432

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA432,31X31,50

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

Power Supplies (V):

2,3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.67 mm

Speed:

200 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

2.1 V

Minimum Supply Voltage:

1.9 V

Nominal Supply Voltage:

2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Width:

40 mm

Peripheral IC Type:

Trade Compliance

GCIXP1200FB Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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