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EP2C35F484C8N

Intel

EP2C35F484C8N by Intel

EP2C35F484C8N by Intel is a FPGA with 33216 logic cells, 2076 CLBs, and max clock frequency of 402.5 MHz. It is used in applications requiring high-speed processing, such as telecommunications equipment and industrial automation systems.

Median Price

$225.260

Lifecycle Status

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Arrow

USA . 300 parts In-Stock

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DigiKey

USA . 42 parts In-Stock

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Verical

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Nova Conductors

Japan . 50 parts In-Stock

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Digiode

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Bristol Electronics

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DF Sales Co.

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DF Sales Co.

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Vyrian

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Chip Stock

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Dan-Mar Components

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ACDS - Activité Composants Distribution Service

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Touchstone Systems

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Semtec, LLC

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Odintec Ltd.

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Semi Source

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Prism Electronics

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Electronics Depot

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Atlantic Semiconductor

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Whistler Technology

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NexGen Digital

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Andel Nordic

Denmark . 4,352 parts In-Stock

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$4.200

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$2.940

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AZTECH Wire

Italy . 194 parts In-Stock

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$15.467

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Corohmni

South Africa . 877 parts In-Stock

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MARBEL Systems

Belgium . 768 parts In-Stock

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Kenton Components

USA . 3,114 parts In-Stock

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Modulus Dynamics

Lithuania . 254 parts In-Stock

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$81.533

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Qasali Group International

UK . 3,422 parts In-Stock

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$94.662

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Texas Native Microelectronics

USA . 29,881 parts In-Stock

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Continental Prestige Electronics

USA . 6,457 parts In-Stock

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Microchip USA

USA . 2,305 parts In-Stock

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$144.890

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Vigor

Singapore . 489 parts In-Stock

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$146.620

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One Stop Electronics

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$154.900

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Ampacity Inc.

Singapore . 120 parts In-Stock

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Corphita

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Semicontronic

India . 175 parts In-Stock

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$191.470

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A-Z Elektronik GmbH

Germany . 7,139 parts In-Stock

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Lixinc

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Authorized Procurement Solutions

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Alle Elektronik GmbH

Germany . 4,429 parts In-Stock

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Glotronic Ltd.

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ChipTracer

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S.R.D Solutions

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Supply Digital

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Netroflash

USA . 1,000 parts In-Stock

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Perfect Parts

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Assy Fe

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Argo Parts USA

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Kepictronics

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GreenTree Electronics

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Overview

Unlock endless possibilities with the EP2C35F484C8N by Intel, a cutting-edge Field Programmable Gate Array that offers unmatched quality and reliability. Built by the industry leader, Intel, this FPGA is perfect for a wide range of applications, from IoT devices to aerospace systems. Experience the power of 33216 logic cells and 2076 CLBs, all wrapped in a compact package body material of PLASTIC/EPOXY. Maximize your potential with a maximum clock frequency of 402.5 MHz and seamless surface mount installation. Elevate your projects with Intel's EP2C35F484C8N FPGA and explore new horizons today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the FPGA lightweight and durable, making it suitable for various applications.

No. of Logic Cells: 33216

With a high number of logic cells, this FPGA can handle complex logic functions and tasks efficiently.

Maximum Supply Voltage: 1.25 V

The low maximum supply voltage requirement helps in reducing power consumption and heat generation, making the FPGA more energy-efficient.

Technology Used: CMOS

The CMOS technology ensures low power consumption, high noise immunity, and faster switching speeds, enhancing the overall performance of the FPGA.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows the FPGA to function reliably in harsh environmental conditions without any performance degradation.

Maximum Clock Frequency: 402.5 MHz

The high maximum clock frequency enables the FPGA to process data at high speeds, making it suitable for applications requiring real-time processing.

Technical Specifications

Field Programmable Gate Arrays (FPGA) EP2C35F484C8N attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

33216

No. of Inputs:

322

No. of Outputs:

306

No. of CLBs:

2076

Maximum Clock Frequency:

402.5 MHz

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

2076 CLBS

Additional Features:

Also requires 3.3 V supply

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.15 V

Maximum Supply Voltage:

1.25 V

Power Supplies:

1.2,1.5/3.3,3.3 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

23 mm

Width:

23 mm

Maximum Seated Height:

2.6 mm

Package Equivalence Code:

BGA484,22X22,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin/Silver/Copper

Terminal Pitch:

1 mm

No. of Terminals:

484

Standards

JESD-30 Code:

S-PBGA-B484

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

EP2C35F484C8N Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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