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EP1AGX50DF1152I6N

Intel

EP1AGX50DF1152I6N by Intel

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE;

Median Price

$280.000

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 429 parts In-Stock

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$280.000

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Digiode

USA . 1,139 parts In-Stock

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Flip Electronics

USA . 91 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 998 parts In-Stock

1+ parts

$0.484

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$0.465

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$0.484

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Northwest PG Solutions

USA . 631 parts In-Stock

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$0.533

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$0.470

631

$0.533

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$0.470

Semicontronic

India . 1,186 parts In-Stock

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$17.000

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$16.575

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$16.490

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One Stop Electronics

USA . 732 parts In-Stock

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$17.000

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Ampacity Inc.

Singapore . 1,508 parts In-Stock

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$23.000

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Modulus Dynamics

Lithuania . 616 parts In-Stock

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$27.460

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$27.460

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$27.460

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MARBEL Systems

Belgium . 3,328 parts In-Stock

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$50.825

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$48.792

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Kenton Components

USA . 5,130 parts In-Stock

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$70.103

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$61.690

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Texas Native Microelectronics

USA . 3,235 parts In-Stock

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$127.667

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$122.560

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$118.730

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$112.347

3,235

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$122.560

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$112.347

Microchip USA

USA . 173 parts In-Stock

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$593.115

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Vigor

Singapore . 218 parts In-Stock

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$1,028.520

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Qasali Group International

UK . 3,381 parts In-Stock

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$151.422

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$138.804

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Supply Digital

USA . 2,278 parts In-Stock

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Corphita

USA . 387 parts In-Stock

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Corohmni

South Africa . 98 parts In-Stock

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Technical Specifications

Field Programmable Gate Arrays (FPGA) EP1AGX50DF1152I6N attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Inputs:

350

No. of Outputs:

350

No. of CLBs:

50160

Maximum Clock Frequency:

640 MHz

Sub-Category:

Field Programmable Gate Arrays

Organization:

50160 CLBS

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.15 V

Maximum Supply Voltage:

1.25 V

Power Supplies:

1.2,2.5/3.3 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

35 mm

Width:

35 mm

Maximum Seated Height:

3.5 mm

Package Equivalence Code:

BGA1152,34X34,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

Standards

JESD-30 Code:

S-PBGA-B1152

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

EP1AGX50DF1152I6N Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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