Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Intel CM80616003060AESLBTD is a 64-bit microprocessor with integrated cache, operating at 133 MHz. Suitable for industrial applications, it features low power mode and boundary scan capability. Package style is grid array with 1156 terminals, supporting a max supply voltage of 1.15 V.
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This material provides durability and cost-effectiveness, making the product reliable for long-term use.
Having integrated cache helps in improving the speed of data access and processing, enhancing the overall performance of the microprocessor.
A higher maximum supply voltage allows for more flexibility in power management and optimization of performance.
The square shape of the package allows for efficient use of space, making it suitable for compact devices and applications.
The high number of terminals enables connectivity to multiple components, enhancing the versatility and functionality of the microprocessor.
The high maximum operating temperature ensures stable performance even under demanding conditions, increasing the overall reliability of the product.
Being designed specifically as a microprocessor ensures that it is optimized for processing tasks efficiently and effectively.
CMOS technology offers low power consumption and high noise immunity, making the microprocessor energy-efficient and reliable.
The high maximum clock frequency allows for fast data processing and execution of instructions, enhancing the overall performance of the microprocessor.
With a speed of 133 rpm, the microprocessor can quickly carry out operations, improving the efficiency of the device it is used in.
Microprocessors CM80616003060AESLBTD attributes and parameters. Explore more Microprocessors devices from Intel
Address Bus Width:
Bit Size:
Boundary Scan:
Maximum Clock Frequency:
External Data Bus Width:
Format:
Integrated Cache:
JESD-30 Code:
Low Power Mode:
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Qualification:
Speed:
Maximum Supply Voltage:
Minimum Supply Voltage:
Nominal Supply Voltage:
Surface Mount:
Technology:
Temperature Grade:
Terminal Form:
Terminal Position:
Peripheral IC Type:
CM80616003060AESLBTD Peripheral ICs trade compliance attributes, and parameters.
ECCN
3A991.A.2
ECCN Governance
EAR
HTS
8542.31.00.01
SB
8542.31.00.00
Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.
MBR1560CT
Yangzhou Yangjie Electronics
RECTIFIER DIODE; Surface Mount: NO; Maximum Operating Temperature: 150 Cel; Maximum Repetitive Peak Reverse Voltage: 60 V; Technology: SCHOTTKY; Maximum Non Repetitive Peak Forward Current: 150 A;
SMBJ18CA
Changzhou Starsea Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
Micropac Industries
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
BAV99
Continental Device India
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LM107H
Advanced Micro Devices
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Maximum Bias Current (IIB) @25C: .075 uA;
MMBF170LT1G
Onsemi
MMBF170LT1G by Onsemi is a N-CHANNEL FET with 60V DS Breakdown Voltage and 0.5A Drain Current. Ideal for SWITCHING applications, it operates in ENHANCEMENT MODE with a max power dissipation of 0.225W. This small outline transistor has a temperature range from -55 to 150 °C.
2N7002
Formosa Microsemi
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR; Maximum Drain Current (Abs) (ID): .115 A;
KSZ9031RNXIA
Micrel
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE;
SS14
Vishay Semiconductors
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
FDC5614P
TAIZHOU ELECTRONICS CO LTD
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.92 W; Maximum Operating Temperature: 150 Cel; Package Body Material: PLASTIC/EPOXY;
1552200253
Molex
WIRE AND CABLE;
Brightking
Fairchild Semiconductor
BSS138
Jiangsu Changjiang Electronics Technology
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Package Style (Meter): SMALL OUTLINE; Maximum Drain Current (ID): .22 A; Package Shape: RECTANGULAR;
Micro Commercial Components
Small Signal Field-Effect Transistors; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Transistor Application: SWITCHING; Maximum Drain Current (ID): .34 A; Package Style (Meter): SMALL OUTLINE;
LM358N
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
B340A-13-F
SPC TECHNOLOGY/ MULTICOMP
STM32H753IIT6
STMicroelectronics
STM32H753IIT6 by STMicroelectronics is a 32-bit microcontroller with 176 terminals, operating at up to 48 MHz. It features 20-Ch 16-Bit ADCs and 2-Ch 12-Bit DACs, suitable for industrial applications requiring high-speed data processing and connectivity via CAN, ETHERNET, USB, and more.
Telcom Semiconductor
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Operating Temperature: 150 Cel; JESD-609 Code: e0;
ULN2803A
Vishay Intertechnology
NPN; Configuration: COMPLEX; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Package Body Material: PLASTIC/EPOXY; JESD-30 Code: R-PDIP-T18;
ADSP-BF609BBCZ-5
Analog Devices
ADSP-BF609BBCZ-5 by Analog Devices is a 32-bit microprocessor with integrated cache, operating at max 60 MHz clock frequency. Ideal for industrial applications, it features low power mode and boundary scan capability. Package style is grid array with 349 terminals in a square shape measuring 19mm x 19mm.
ATSAMA5D27C-D1G-CUR
Microchip Technology
ATSAMA5D27C-D1G-CUR by Microchip Technology is a 16-bit microprocessor with integrated cache, operating at up to 24 MHz. Ideal for industrial applications, it features 51 DMA channels and low power mode for efficient performance. Package style: Grid Array, Thin Profile, Fine Pitch.
MIMXRT1166XVM5A
NXP Semiconductors
MICROPROCESSOR, RISC; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260;
P2010NXN2KFC
Freescale Semiconductor
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.1 V;
MIMXRT1011DAE5A
MICROPROCESSOR, RISC; Terminal Finish: TIN; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e3; Peak Reflow Temperature (C): 260;
MCF5271CVM100
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 196; Package Code: LBGA; Package Shape: SQUARE;
MC68EC000EI10
MC68EC000EI10 by Freescale Semiconductor is a 32-bit microprocessor with 5V power supply, operating b/w 0-70°C. It comes in a square chip carrier package with 68 terminals and J bend terminal form. Ideal for commercial applications requiring RISC technology and a max speed of 10 rpm.
LS1012ASN7HKA
LS1012ASN7HKA by NXP Semiconductors is a 64-bit microprocessor with integrated cache, 16-bit address and external data bus width. It operates at a max clock frequency of 25 MHz, suitable for low power applications in various industries like IoT and networking due to its CMOS technology.
ATSAMA5D44B-CU
ATSAMA5D44B-CU by Microchip Technology is a 32-bit microprocessor with 131072 RAM words, 50 MHz clock frequency, and 32 DMA channels. Ideal for industrial applications, it features low power mode, floating point format, and RISC technology for efficient processing.
AM6442BSDGGAALV
Texas Instruments
AM6442BSDGGAALV by Texas Instruments is a Microprocessor with 64-bit architecture, 16-bit data RAM width, and 25 MHz clock frequency. It is ideal for applications requiring high-speed processing and low power consumption, such as embedded systems, IoT devices, and industrial automation.
MCF5484CZP200
NXP Semiconductors MCF5484CZP200 is a 32-bit microprocessor with integrated cache, operating at max 66.67 MHz. Ideal for industrial applications, it features low power mode and boundary scan capability, with a package style of grid array and terminal pitch of 1 mm.
MCIMX6S7CVM08AB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE; External Data Bus Width: 32;
MPC8313CVRAFFC
MICROPROCESSOR; Terminal Form: BALL; No. of Terminals: 516; Package Code: BGA; Package Shape: SQUARE; JESD-609 Code: e2;
DM3730CUS100NEP
Texas Instruments DM3730CUS100NEP microprocessor features 32-bit architecture, 26-bit address bus, and integrated cache. Ideal for low power applications with a max clock frequency of 54 MHz. Suitable for mobile devices, automotive systems, and industrial automation due to its compact size and high performance capabilities.
MCF54418CMJ250R
MICROPROCESSOR; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3;
DM3725CUSD100
The Texas Instruments DM3725CUSD100 microprocessor features a 32-bit architecture with 26-bit address bus width and integrated cache. Operating at a max clock frequency of 54 MHz, it is suitable for industrial applications requiring low power consumption and high-speed processing. With a terminal pitch of 0.65 mm and peripheral IC type as RISC, this processor offers efficient performance in compact designs.
STM32MP151CAD3
MICROPROCESSOR, RISC; Peak Reflow Temperature (C): NOT SPECIFIED; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
MCF54416CMJ250
MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;
W65C02S6TPG-14
Western Design Center
Microprocessors;
CM8068403380018
Intel
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
CM8064601538900SR183
MICROPROCESSOR;
CM8070104282329SRH70
CM8067702868416SR339
CM8064601483405/SR1CN
MICROPROCESSOR; Terminal Form: NO LEAD; No. of Terminals: 1150; Package Code: LGA; Package Shape: SQUARE; Speed: 2700 rpm;
CM8063701098702SR0PA
MICROPROCESSOR; Terminal Form: NO LEAD; No. of Terminals: 1155; Package Shape: SQUARE; Surface Mount: YES; Speed: 3500 rpm;
CM8064601481957SR1PA
CM8070104282327
CM8063701211600SR0PK
MICROPROCESSOR; Terminal Form: NO LEAD; No. of Terminals: 1155; Package Code: LGA; Package Shape: SQUARE; Package Equivalence Code: LGA1155,40X40,36;
CM8064601465605SR14J
MICROPROCESSOR; Terminal Form: NO LEAD; No. of Terminals: 1150; Package Shape: SQUARE; Integrated Cache: YES; Boundary Scan: NO;
CM8066002041900
MICROPROCESSOR; Terminal Form: NO LEAD; No. of Terminals: 2011; Package Shape: RECTANGULAR; JESD-30 Code: R-XBGA-N2011; Bit Size: 64;
CM8067702868115SR337
CM8062301044204SR05Y
MICROPROCESSOR; Terminal Form: NO LEAD; No. of Terminals: 1155; Package Code: LGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY;
CM8062301046204SR05Q
CM8062307262304SR00G
CM8064601465605
MICROPROCESSOR; Terminal Form: NO LEAD; No. of Terminals: 1150; Package Shape: SQUARE; Package Body Material: UNSPECIFIED; Terminal Position: BOTTOM;
CM8064601465803/SR14M
CM8064601561826SR1S6
CM8066201920404SR2L6
MICROPROCESSOR; Terminal Form: NO LEAD; No. of Terminals: 1151; Package Code: LGA; Package Shape: SQUARE; Peak Reflow Temperature (C): NOT SPECIFIED;
CM80616003060AESLBMQ
MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BUTT; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE;
Supply Digital Components
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12,000 In-Stock
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