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AV8063801117503SR0NC

Intel

AV8063801117503SR0NC by Intel

MICROPROCESSOR; Terminal Form: BALL; No. of Terminals: 1023; Package Code: BGA; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;

Median Price

$361.380

Lifecycle Status

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5

In-Stock Inventory

1k+

AV8063801117503SR0NC by Intel
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Verical

USA . 14 parts In-Stock

1+ parts

$361.380

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14

$361.380

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Digiode

USA . 499 parts In-Stock

1+ parts

$385.339

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499

$385.339

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TME

Poland . 14 parts In-Stock

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$604.500

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14

$604.500

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Vyrian

USA . 1,442 parts In-Stock

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1,442

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LIBRA Elektronik GmbH

Germany . 1 parts In-Stock

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MARBEL Systems

Belgium . 897 parts In-Stock

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$67.872

100+ parts

$65.157

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897

$67.872

$65.157

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Texas Native Microelectronics

USA . 1,631 parts In-Stock

1+ parts

$78.014

100+ parts

$74.893

1k+ parts

$72.553

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1,631

$78.014

$74.893

$72.553

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Kenton Components

USA . 613 parts In-Stock

1+ parts

$93.617

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$82.383

613

$93.617

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$82.383

Corphita

USA . 299 parts In-Stock

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$365.058

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299

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Qasali Group International

UK . 566 parts In-Stock

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$202.212

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$185.361

566

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$202.212

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$185.361

Overview

Intel 3rd Generation i7 Core Processors are 64-bit, multi-core processors built on 22nm process technology. The processor is designed for a two-chip platform. The two-chip platform consists of a processor and a Platform Controller Hub (PCH) and enables higher performance, lower cost, easier validation, and improved x-y footprint. The processor includes Integrated Display Engine, Processor Graphics, and an Integrated Memory Controller. These processors are designed for desktop or mobile platforms. Intel's i7 Core Processors provide up to 3.5GHz clock speed, Max TDP of 77W, 32GB Max Memory, and an Intel HD Graphics 4000 processor.

Technical Specifications

Microprocessors AV8063801117503SR0NC attributes and parameters. Explore more Microprocessors devices from Intel

Specs

Bit Size:

64

Integrated Cache:

YES

JESD-30 Code:

R-PBGA-B1023

No. of Terminals:

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA1023(UNSPEC)

Package Shape:

Package Style (Meter):

GRID ARRAY

Qualification:

Not Qualified

Speed:

3300 rpm

Sub-Category:

Microprocessors

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Position:

BOTTOM

Peripheral IC Type:

Trade Compliance

AV8063801117503SR0NC Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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