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10CL040ZF484I8G

Intel

10CL040ZF484I8G by Intel

Intel's 10CL040ZF484I8G FPGA features 39600 logic cells, 2475 CLBs, and 325 inputs/outputs. With a package style of grid array and industrial-grade temperature grading, it is ideal for applications requiring high-density programmable logic solutions in harsh environments.

Median Price

$69.000

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DigiKey

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Nova Conductors

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AZTECH Wire

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Texas Native Microelectronics

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Kenton Components

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Overview

Unlock the power of innovation with the Intel 10CL040ZF484I8G Field Programmable Gate Array (FPGA). Backed by Intel's reputation for quality, this versatile FPGA offers endless possibilities for applications in industries such as telecommunications, automotive, and aerospace. With 39600 logic cells and 2475 CLBs, it provides unparalleled flexibility and performance. From its compact square package to its industrial-grade temperature tolerance, this FPGA delivers value and benefits that exceed expectations. Experience the advantage of Intel technology and elevate your projects to new heights with the 10CL040ZF484I8G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the FPGA, ensuring it can withstand various environmental conditions.

No. of Logic Cells: 39600

Having a high number of logic cells allows for complex logic operations to be implemented, making this FPGA suitable for demanding applications.

Surface Mount: YES

The surface mount feature makes it easier to integrate this FPGA onto circuit boards, reducing assembly time and complexity.

Maximum Supply Voltage: 1.03 V

The high maximum supply voltage allows for flexibility in power input options, catering to different system requirements.

No. of CLBs: 2475

With a high number of Configurable Logic Blocks (CLBs), this FPGA offers a significant amount of reconfigurable logic resources for versatile design implementation.

No. of Inputs: 325

The abundance of input pins enables the FPGA to interface with a wide range of external devices and sensors for data processing and control purposes.

Package Shape: SQUARE

The square package shape allows for more efficient use of board space during PCB layout and design.

Form Of Terminal: BALL

The ball terminals provide reliable electrical connections and efficient heat dissipation, contributing to the overall performance and longevity of the FPGA.

No. of Terminals: 484

The large number of terminals offers ample connectivity options for interfacing with external components and peripherals in the system.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a Field Programmable Gate Array allows for on-the-fly reprogramming and customization of the FPGA's logic functions without the need for hardware changes, providing flexibility in adaptability.

Package Style (Meter): GRID ARRAY

The grid array package style enhances the overall signal integrity and thermal performance of the FPGA, ensuring reliable operation in demanding environments.

Minimum Supply Voltage: 0.97 V

The low minimum supply voltage enables energy-efficient operation and reduces power consumption, making the FPGA suitable for battery-powered applications.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature, this FPGA can withstand elevated temperature conditions without compromising performance or reliability.

Pitch Of Terminal: 1 mm

The fine pitch of terminals allows for denser packing and efficient routing of signals on the PCB, optimizing the overall design layout.

Organization: 2475 CLBS

The organized configuration of 2475 Configurable Logic Blocks facilitates logical structuring and design implementation, enhancing the efficiency of the FPGA's operation.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range ensures reliable performance even in extreme cold environments, making this FPGA suitable for a wide range of applications.

Position Of Terminal: BOTTOM

The bottom position of terminals simplifies the integration process and PCB layout, allowing for easier access and connections during assembly.

Maximum Seated Height: 2.4 mm

The low maximum seated height of the FPGA contributes to compact and slim device designs, saving space and enabling efficient system integration.

Width: 23 mm

The width of 23mm provides a balance between compact form factor and sufficient surface area for the necessary components and connections, offering a versatile design solution.

No. of Outputs: 325

The numerous output pins allow for versatile output configurations and connectivity options, enhancing the FPGA's ability to drive multiple external devices and interfaces.

Length: 23 mm

With a length of 23mm, this FPGA offers a square form factor that simplifies board layout and assembly, optimizing space utilization in compact system designs.

Grading Of Temperature: INDUSTRIAL

Having an industrial-grade temperature range ensures reliable operation in harsh industrial environments, making this FPGA suitable for rugged applications where temperature fluctuations are common.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 10CL040ZF484I8G attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

39600

No. of Inputs:

325

No. of Outputs:

325

No. of CLBs:

2475

Organization:

2475 CLBS

Additional Features:

-40 to 125 °C range is available as extended industrial

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.97 V

Maximum Supply Voltage:

1.03 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

23 mm

Width:

23 mm

Maximum Seated Height:

2.4 mm

Package Equivalence Code:

BGA484,22X22,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

1 mm

No. of Terminals:

484

Standards

JESD-30 Code:

S-PBGA-B484

Trade Compliance

10CL040ZF484I8G Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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