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10CL016YM164I7G

Intel

10CL016YM164I7G by Intel

Intel 10CL016YM164I7G is a FPGA with 963 CLBs, operating at -40 to 100 °C. It has a max supply voltage of 1.25 V and min of 1.15 V, suitable for industrial applications requiring high performance and programmable ICs in compact form factors with fine pitch grid array package style.

Median Price

$35.956

Lifecycle Status

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1k+

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DigiKey

USA . 285 parts In-Stock

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$26.210

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$23.606

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Verical

USA . 4 parts In-Stock

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$45.701

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$45.701

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$45.701

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Digiode

USA . 147 parts In-Stock

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$21.166

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Nova Conductors

Japan . 41 parts In-Stock

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$23.716

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Vyrian

USA . 8,506 parts In-Stock

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VNN

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Chip Stock

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AZTECH Wire

Italy . 380 parts In-Stock

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$7.569

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Semicontronic

India . 407 parts In-Stock

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$18.940

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$18.466

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$18.372

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Ampacity Inc.

Singapore . 84 parts In-Stock

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$18.940

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Vigor

Singapore . 421 parts In-Stock

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Corphita

USA . 61 parts In-Stock

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Continental Prestige Electronics

USA . 2,588 parts In-Stock

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Microchip USA

USA . 1,045 parts In-Stock

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Texas Native Microelectronics

USA . 3,474 parts In-Stock

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$101.457

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$97.399

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$94.355

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Kenton Components

USA . 40 parts In-Stock

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$121.748

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$107.139

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Corohmni

South Africa . 979 parts In-Stock

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MARBEL Systems

Belgium . 5,434 parts In-Stock

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Argo Parts USA

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Qasali Group International

UK . 38 parts In-Stock

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$262.977

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$241.062

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$262.977

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$241.062

Overview

Unleash the power of innovation with the 10CL016YM164I7G by Intel! This cutting-edge Field Programmable Gate Array (FPGA) boasts unmatched quality and reliability, thanks to Intel's renowned manufacturing expertise. From high-performance computing to industrial automation, this FPGA offers endless possibilities for customization and optimization. Experience seamless integration, lightning-fast processing, and unparalleled versatility with this game-changing product. Elevate your projects to new heights with the Intel 10CL016YM164I7G FPGA - where innovation meets excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product reliable for long-term use.

Surface Mount: YES

Being surface mountable allows for easy installation and integration into circuit boards.

Maximum Supply Voltage: 1.25 V

The high maximum supply voltage ensures optimal performance and voltage protection.

No. of CLBs: 963

Having a large number of Configurable Logic Blocks (CLBs) provides flexibility and high processing capability.

Package Shape: SQUARE

The square shape makes it easier to handle and mount in a standardized manner.

Form Of Terminal: BALL

Ball terminals offer secure connections and efficient heat dissipation.

Nominal Supply Voltage (V): 1.2

The nominal supply voltage ensures stable operation and energy efficiency.

No. of Terminals: 164

Having a sufficient number of terminals allows for versatile connectivity options.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

FPGA technology enables customization and reprogramming for various applications.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

This packaging style offers compactness, easy assembly, and high-density integration.

Minimum Supply Voltage: 1.15 V

The low minimum supply voltage allows for efficient power consumption and performance optimization.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature, the FPGA can withstand harsh environmental conditions.

Pitch Of Terminal: 0.5 mm

Having a small pitch terminal spacing enables high-density packaging and connectivity.

Organization: 963 CLBS

The organized CLBs provide structured logic implementation and efficient resource utilization.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable performance even in cold environments.

Position Of Terminal: BOTTOM

Bottom terminal position offers easy access for soldering and connection in circuit designs.

Maximum Seated Height: 1.2 mm

The low seated height allows for compact and space-saving designs.

Width: 8 mm

With a standard width of 8mm, the FPGA can fit into various circuit board layouts easily.

Length: 8 mm

The length of 8mm provides a balanced form factor for integration and compatibility with PCB designs.

Grading Of Temperature: INDUSTRIAL

Industrial temperature grading ensures reliable operation in demanding industrial environments.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 10CL016YM164I7G attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of CLBs:

963

Organization:

963 CLBS

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.15 V

Maximum Supply Voltage:

1.25 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Thin Profile, Fine Pitch

Package Code:

Package Shape:

Length:

8 mm

Width:

8 mm

Maximum Seated Height:

1.2 mm

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

.5 mm

No. of Terminals:

164

Standards

JESD-30 Code:

S-PBGA-B164

Trade Compliance

10CL016YM164I7G Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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