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IS25WP016D-JBLE-TR

Integrated Silicon Solution

IS25WP016D-JBLE-TR by Integrated Silicon Solution

IS25WP016D-JBLE-TR by Integrated Silicon Solution is a 16Mb Flash Memory with 2MX8 organization, operating at up to 133MHz clock frequency. It features a small outline package style and is suitable for industrial applications requiring high-speed synchronous operation.

Median Price

$1.130

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Avnet

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Vyrian

USA . 8,348 parts In-Stock

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NAC Semi

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Nova Conductors

Japan . 40 parts In-Stock

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AZTECH Wire

Italy . 980 parts In-Stock

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Argo Parts USA

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Authorized Procurement Solutions

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Eastek

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GreenTree Electronics

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Continental Prestige Electronics

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Aranea Global

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Overview

Unlock the power of seamless data storage and retrieval with the IS25WP016D-JBLE-TR by Integrated Silicon Solution. This cutting-edge Flash Memory device offers unparalleled reliability and efficiency, making it a game-changer for various applications. With a focus on quality and innovation, Integrated Silicon Solution ensures that customers receive top-notch products that exceed expectations. Embrace the future of technology with the IS25WP016D-JBLE-TR and experience the benefits of faster data access, enhanced performance, and seamless integration into your projects. Elevate your business with this exceptional product that delivers value and reliability like no other.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the flash memory chip, ensuring long-term reliability.

Operating Mode: SYNCHRONOUS

Allows for synchronized data transfer, improving efficiency and performance.

Maximum Clock Frequency (fCLK): 133 MHz

High clock frequency enables fast data access and transfer speeds.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Memory Width: 8

8-bit memory width allows for efficient data processing and storage.

Technical Specifications

Flash Memory IS25WP016D-JBLE-TR attributes and parameters. Explore more Flash Memory devices from Integrated Silicon Solution

Specs

Alternate Memory Width:

1

Maximum Clock Frequency (fCLK):

133 MHz

JESD-30 Code:

S-PDSO-G8

Length:

5.28 mm

Memory Density:

16777216 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

8

No. of Words:

2097152 words

No. of Words Code:

2M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

2MX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

NOT SPECIFIED

Programming Voltage (V):

1.8

Maximum Seated Height:

2.16 mm

Maximum Supply Voltage (Vsup):

1.95 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5.28 mm

Trade Compliance

IS25WP016D-JBLE-TR Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Integrated Silicon Solution

ISSI is a technology leader that designs, develops, and markets high performance integrated circuits for the following key markets: (i) automotive, (ii) industrial and medical, (iii) communications/enterprise, and (iv) digital consumer. Our primary products are high speed and low power SRAM and low and medium density DRAM, NOR/NAND Flash, and eMMC products. We target these key markets with our cost-effective, high-quality semiconductor products and seek to build long-term relationships with our customers. We have been a committed long-term supplier of memory products, including lower density and smaller volume products, even during periods of tight manufacturing capacity. Our outsourced manufacturing model is based upon a history of joint technology development relationships with key foundries. We also make strategic equity purchases in selected foundries. We have expanded our presence in important markets by adding to design groups in US, China, Korea and Taiwan, and investing in applications engineering and technical support in closer proximity to end customers. These groups complement our core engineering and product management teams located in our Silicon Valley Headquarters in California. In recent years, the need for sophisticated semiconductor memory has expanded beyond the personal computer market and into the automotive, communications, digital consumer, industrial and medical markets. Increased memory content is required in these products in order to help process large amounts of data.

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